LCMXO3L-6900C-5BG400I

The LCMXO3L-6900C-5BG400I is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for industrial-grade embedded logic and system I/O tasks. This device integrates 6,864 logic elements, approximately 245,760 bits of embedded memory, and up to 335 I/Os in a 400-LFBGA (400-CABGA, 17×17) package.

With a wide supply voltage range (2.375 V to 3.465 V) and an extended operating temperature range (−40 °C to 100 °C), the part suits industrial applications that require dense logic, flexible on-chip memory, and high pin-count I/O in a surface-mount package.

Key Features

• Logic Capacity — 6,864 logic elements provide substantial programmable logic resources for glue logic, protocol handling, and control functions.
• Embedded Memory — Approximately 0.246 Mbits (245,760 bits) of on-chip RAM for data buffering, small FIFOs, and state storage.
• Rich I/O Count — Up to 335 I/Os to support multi-channel interfaces, board-level bridging, and high-density connectivity.
• Power and Voltage — Supports a supply voltage range of 2.375 V to 3.465 V to accommodate common embedded power rails.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation, suitable for industrial environments.
• Non-volatile, Multi-time Programmable Family Features — MachXO3 family capabilities include non-volatile configuration and multi-time programmability (as described in the MachXO3 family datasheet).
• On-chip System and I/O Features — Family-level features include flexible on-chip clocking, phase-locked loops (PLLs), an on-chip oscillator, programmable I/O buffers, and pre-engineered source-synchronous I/O (per MachXO3 family documentation).
• Embedded Hardened IP — The MachXO3 family includes hardened IP blocks such as I²C and SPI cores and timer/counter functions (as described in the family datasheet).
• Package and Mounting — 400-LFBGA (supplier package: 400-CABGA, 17×17) in a surface-mount form factor for high-density board designs.
• RoHS Compliant — Device is compliant with RoHS environmental regulations.

Typical Applications

• Industrial Control — Use for control logic, sequencing, and interface consolidation in industrial systems requiring extended temperature operation.
• I/O Expansion and Bridge Functions — High I/O count and programmable I/O make the device suitable for protocol bridging and expanding board-level interfaces.
• Embedded System Glue Logic — Implement custom control, handshaking, and timing functions to reduce external component count.
• Peripheral Offload and Interface Management — On-chip memory and hardened IP cores help offload simple peripheral tasks and manage serial interfaces.

Unique Advantages

• Highly Integrated Logic and I/O: Combines 6,864 logic elements with 335 I/Os to reduce external components and simplify PCB routing for complex interface requirements.
• On-chip Memory for Local Buffering: Approximately 0.246 Mbits of embedded RAM supports local FIFOs and temporary data storage without external memory.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and listed as industrial grade, enabling deployment in harsh environments.
• Flexible Power Options: Broad supply voltage range (2.375 V to 3.465 V) allows compatibility with common embedded power rails.
• Family-level System Features: MachXO3 family capabilities—such as non-volatile configuration, PLLs, on-chip oscillator, and hardened I²C/SPI—simplify system design and reduce development time.
• High-density Package: 400-LFBGA (17×17 CABGA) delivers a large pin count in a compact surface-mount package for space-constrained, high-functionality boards.

Why Choose LCMXO3L-6900C-5BG400I?

The LCMXO3L-6900C-5BG400I positions itself as a practical, industrial-grade FPGA option for designs requiring a balance of programmable logic, embedded memory, and extensive I/O in a single surface-mount package. Its MachXO3 family capabilities and hardened IP functions help streamline common system tasks while the device-level specifications support reliable operation across a broad temperature range.

This part is well suited to engineers and procurement teams building industrial control systems, board-level interface hubs, and embedded controllers that need scalable logic resources, on-chip buffering, and a high pin-count package backed by family-level documentation and features.

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