LCMXO3L-6900C-6BG324I

The LCMXO3L-6900C-6BG324I is a MachXO3 family FPGA device designed for industrial-grade embedded applications. It provides a combination of configurable logic, abundant I/O, and on-chip memory in a 324-LFBGA (15×15) surface-mount package.

With 6,864 logic elements, 279 general-purpose I/O pins and approximately 0.24 Mbits of embedded RAM, this device is suited for system glue logic, I/O aggregation, protocol bridging, and other applications that require a dense I/O footprint and non-volatile, reconfigurable logic in an industrial temperature range.

Key Features

• Core Logic 6,864 logic elements provide flexible programmable fabric for implementing custom logic, control functions, and glue logic.
• Embedded Memory Approximately 0.24 Mbits (245,760 bits) of on-chip RAM for buffering, small look-up tables, and local storage.
• I/O Capacity 279 I/O pins support extensive external device interfacing and parallel signal routing directly from the package.
• Voltage and Power Operates from 2.375 V to 3.465 V supply rails, enabling compatibility with a range of common system power domains.
• Industrial Temperature Range Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• Packaging and Mounting 324-LFBGA (324-CABGA, 15×15) surface-mount package suitable for compact, high-density board designs.
• Non-volatile Configuration and On-chip Management MachXO3 family features include non-volatile, multi-time programmable configuration, on-chip oscillator, and standby/power-saving options.
• Clocking and Timing Family-level support for sysCLOCK PLLs and flexible on-chip clock distribution for synchronized logic and I/O timing.
• Embedded Hardened IP The MachXO3 family includes hardened IP such as I²C and SPI cores and timer/counter functions to simplify common peripheral tasks.
• System Test and Configuration Family documentation references IEEE 1149.1-compliant boundary scan and multiple device configuration and testing features.
• RoHS Compliant Device is RoHS compliant.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and flexible I/O make the device suitable for control logic, sensor interfacing, and local protocol conversions in automation equipment.
• I/O Aggregation and Protocol Bridging — High I/O count supports consolidation of multiple external interfaces and implementation of glue logic between subsystems.
• Embedded System Glue Logic — Use the programmable fabric and on-chip memory for address decoding, bus arbitration, and custom peripheral interfacing.
• Configurable Peripherals and Prototyping — Hardened IP blocks (I²C, SPI, timers) and reprogrammable configuration make the device useful for prototyping and iterative development of embedded functions.

Unique Advantages

• Highly configurable logic density: 6,864 logic elements let designers implement moderate-complexity state machines, protocol handlers, and glue logic without external CPLDs.
• Large I/O budget: 279 I/O pins reduce the need for external multiplexers or expanders when connecting many peripherals or sensors.
• Non-volatile, reprogrammable configuration: Family-level multi-time programmable configuration simplifies field updates and iterative firmware/logic development.
• Industrial robustness: -40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Integrated peripheral IP: Embedded hardened I²C, SPI, and timer/counter functions reduce BOM and shorten development time for common interfaces.
• Compact, high-density package: 324-LFBGA (15×15) surface-mount package enables high pin-count connectivity in a board-area-efficient footprint.

Why Choose LCMXO3L-6900C-6BG324I?

The LCMXO3L-6900C-6BG324I positions itself as a flexible, industrial-grade FPGA option within the MachXO3 family, offering a balance of logic resources, embedded memory, and a large I/O complement in a compact 324-LFBGA package. Its family-level features—non-volatile configuration, on-chip clocking and PLLs, hardened peripheral IP, and power-saving options—support system-level integration and reduce external component count.

This device is well suited to engineers building embedded systems that require moderate programmable logic, extensive external connectivity, and industrial temperature operation. The MachXO3 family feature set and the device’s specifications provide a scalable and maintainable solution for applications that demand reprogrammable logic with persistent configuration and built-in peripheral functions.

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