LCMXO3L-6900E-6MG324C

IC FPGA 281 I/O 324CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 281 245760 6864 324-VFBGA

Quantity 1,358 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSFBGA (10x10)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-VFBGANumber of I/O281Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3L-6900E-6MG324C – MachXO3 Field Programmable Gate Array (FPGA) IC 281 I/O 245760 RAM 6864 LE 324-VFBGA

The LCMXO3L-6900E-6MG324C is a MachXO3 family FPGA from Lattice Semiconductor designed for commercial embedded applications requiring non‑volatile, reprogrammable logic. This device integrates 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and up to 281 general‑purpose I/O pins in a 324‑VFBGA package to support compact, reconfigurable system designs.

Its architecture includes non‑volatile, multi‑time programmable configuration, embedded peripherals and clocking resources noted in the MachXO3 family data sheet, making it suitable for commercial control, interface and glue‑logic tasks where reconfiguration and on‑chip resources reduce external component count.

Key Features

  • Core Logic  6,864 logic elements and 858 logic blocks provide programmable fabric for custom logic, state machines, and glue‑logic functions.
  • Embedded Memory  Approximately 0.246 Mbits of on‑chip RAM (245,760 bits) for FIFOs, buffering and small data storage.
  • I/O  Up to 281 I/O pins with programmable I/O cells and flexible sysI/O buffer options described in the MachXO3 family data sheet.
  • Non‑volatile Configuration  Multi‑time programmable, non‑volatile configuration enables persistent device behavior without external configuration memory.
  • Clocking and Timing  On‑chip oscillator and sysCLOCK PLLs for flexible on‑chip clock generation and distribution (MachXO3 family features).
  • Embedded Hardened IP  Family‑level hardened peripherals include I2C, SPI and timer/counter functions to simplify common system interfaces and timing functions.
  • Power and Reliability  Standby mode and power saving options are supported (see MachXO3 family documentation); RoHS compliant.
  • Package and Mounting  324‑VFBGA (supplier device package: 324‑CSFBGA, 10×10) for surface‑mount assembly in space‑constrained designs.
  • Operating Conditions  Voltage supply range 1.14 V to 1.26 V and commercial temperature grade with operating range 0 °C to 85 °C.
  • System Features  Additional family features include TransFR reconfiguration support, user flash memory (UFM), hot socketing and configuration/testing options referenced in the MachXO3 family data sheet.

Typical Applications

  • Commercial Embedded Control  Reconfigurable logic, state machines and control interfaces for equipment operating within commercial temperature ranges.
  • Interface and Glue Logic  Protocol bridging and signal conditioning using the device’s programmable I/O and embedded peripherals to reduce external components.
  • Peripheral Management  Local device control, sensor aggregation, and timing functions leveraging embedded timers, SPI and I2C IP blocks.

Unique Advantages

  • Highly integrated solution: Combines 6,864 logic elements, embedded RAM and hardened peripheral IP to reduce BOM and PCB area.
  • Non‑volatile programmability: Multi‑time programmable configuration removes the need for external configuration flash for persistent device behavior.
  • Flexible I/O and clocking: 281 I/Os with programmable I/O cells and on‑chip PLLs/oscillator enable diverse interface and timing topologies.
  • Commercial readiness: Designed for commercial applications with a defined operating range of 0 °C to 85 °C and RoHS compliance.
  • Compact package: 324‑VFBGA (324‑CSFBGA, 10×10) supports dense board layouts and surface‑mount assembly.
  • Family‑level system features: Support for TransFR reconfiguration, UFM, hot socketing and power saving modes improves system flexibility and maintainability.

Why Choose LCMXO3L-6900E-6MG324C?

The LCMXO3L-6900E-6MG324C positions itself as a compact, non‑volatile FPGA option for commercial embedded designs that demand reconfigurable logic, ample I/O and integrated peripheral IP. With 6,864 logic elements, approximately 0.246 Mbits of embedded RAM and 281 I/Os in a 324‑VFBGA package, it addresses designs where reducing external components and preserving configuration across power cycles are priorities.

Engineers designing commercial control, interface or glue‑logic subsystems will find the device’s combination of programmable fabric, hardened IP blocks and family‑level clocking and power features useful for accelerating development and simplifying system architecture. RoHS compliance and defined voltage and temperature ranges support predictable procurement and deployment in commercial environments.

Request a quote or submit an inquiry to receive pricing, availability and technical support for LCMXO3L-6900E-6MG324C. Our team can provide lead‑time details and assist with volume purchasing and technical evaluation needs.

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