LCMXO3L-6900E-6MG324C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 281 245760 6864 324-VFBGA |
|---|---|
| Quantity | 1,358 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSFBGA (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-VFBGA | Number of I/O | 281 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO3L-6900E-6MG324C – MachXO3 Field Programmable Gate Array (FPGA) IC 281 I/O 245760 RAM 6864 LE 324-VFBGA
The LCMXO3L-6900E-6MG324C is a MachXO3 family FPGA from Lattice Semiconductor designed for commercial embedded applications requiring non‑volatile, reprogrammable logic. This device integrates 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and up to 281 general‑purpose I/O pins in a 324‑VFBGA package to support compact, reconfigurable system designs.
Its architecture includes non‑volatile, multi‑time programmable configuration, embedded peripherals and clocking resources noted in the MachXO3 family data sheet, making it suitable for commercial control, interface and glue‑logic tasks where reconfiguration and on‑chip resources reduce external component count.
Key Features
- Core Logic 6,864 logic elements and 858 logic blocks provide programmable fabric for custom logic, state machines, and glue‑logic functions.
- Embedded Memory Approximately 0.246 Mbits of on‑chip RAM (245,760 bits) for FIFOs, buffering and small data storage.
- I/O Up to 281 I/O pins with programmable I/O cells and flexible sysI/O buffer options described in the MachXO3 family data sheet.
- Non‑volatile Configuration Multi‑time programmable, non‑volatile configuration enables persistent device behavior without external configuration memory.
- Clocking and Timing On‑chip oscillator and sysCLOCK PLLs for flexible on‑chip clock generation and distribution (MachXO3 family features).
- Embedded Hardened IP Family‑level hardened peripherals include I2C, SPI and timer/counter functions to simplify common system interfaces and timing functions.
- Power and Reliability Standby mode and power saving options are supported (see MachXO3 family documentation); RoHS compliant.
- Package and Mounting 324‑VFBGA (supplier device package: 324‑CSFBGA, 10×10) for surface‑mount assembly in space‑constrained designs.
- Operating Conditions Voltage supply range 1.14 V to 1.26 V and commercial temperature grade with operating range 0 °C to 85 °C.
- System Features Additional family features include TransFR reconfiguration support, user flash memory (UFM), hot socketing and configuration/testing options referenced in the MachXO3 family data sheet.
Typical Applications
- Commercial Embedded Control Reconfigurable logic, state machines and control interfaces for equipment operating within commercial temperature ranges.
- Interface and Glue Logic Protocol bridging and signal conditioning using the device’s programmable I/O and embedded peripherals to reduce external components.
- Peripheral Management Local device control, sensor aggregation, and timing functions leveraging embedded timers, SPI and I2C IP blocks.
Unique Advantages
- Highly integrated solution: Combines 6,864 logic elements, embedded RAM and hardened peripheral IP to reduce BOM and PCB area.
- Non‑volatile programmability: Multi‑time programmable configuration removes the need for external configuration flash for persistent device behavior.
- Flexible I/O and clocking: 281 I/Os with programmable I/O cells and on‑chip PLLs/oscillator enable diverse interface and timing topologies.
- Commercial readiness: Designed for commercial applications with a defined operating range of 0 °C to 85 °C and RoHS compliance.
- Compact package: 324‑VFBGA (324‑CSFBGA, 10×10) supports dense board layouts and surface‑mount assembly.
- Family‑level system features: Support for TransFR reconfiguration, UFM, hot socketing and power saving modes improves system flexibility and maintainability.
Why Choose LCMXO3L-6900E-6MG324C?
The LCMXO3L-6900E-6MG324C positions itself as a compact, non‑volatile FPGA option for commercial embedded designs that demand reconfigurable logic, ample I/O and integrated peripheral IP. With 6,864 logic elements, approximately 0.246 Mbits of embedded RAM and 281 I/Os in a 324‑VFBGA package, it addresses designs where reducing external components and preserving configuration across power cycles are priorities.
Engineers designing commercial control, interface or glue‑logic subsystems will find the device’s combination of programmable fabric, hardened IP blocks and family‑level clocking and power features useful for accelerating development and simplifying system architecture. RoHS compliance and defined voltage and temperature ranges support predictable procurement and deployment in commercial environments.
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