LCMXO3L-9400C-5BG256C

The LCMXO3L-9400C-5BG256C is a MachXO3 family non-volatile FPGA offering reprogrammable logic and flexible I/O in a compact 256-LFBGA package. With 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, and 206 I/Os, it is designed for embedded applications that require on-chip memory, configurable logic, and extensive I/O connectivity.

Built on the MachXO3 architecture, this device combines multi-time programmable, non-volatile configuration with on-chip clocking, embedded peripherals and system-level features to simplify board-level integration while supporting a supply range of 2.375 V to 3.465 V and commercial temperature operation.

Key Features

• Logic Capacity — 9,400 logic elements provide a mid-density, reprogrammable fabric suitable for glue logic, control functions, and moderate-complexity custom logic.
• Embedded Memory — Approximately 0.44 Mbits (442,368 bits) of on-chip RAM (sysMEM) for FIFOs, buffers and small data stores.
• I/O Density and Flexibility — 206 user I/O pins with a flexible I/O buffer architecture and support for source-synchronous interfaces as described in the MachXO3 family documentation.
• Non-volatile, Multi-time Programmable Configuration — On-chip non-volatile configuration that supports multi-time programming and TransFR reconfiguration capabilities as part of the MachXO3 feature set.
• On-chip Clocking and PLLs — Flexible on-chip clocking resources, including PLLs, to support a range of clocking and timing architectures.
• Embedded Peripherals and Hardened IP — Family datasheet documents hardened I2C and SPI IP cores, timers/counters, and other system-level IP to reduce external component count.
• System & Power Features — On-chip oscillator, user flash memory (UFM), standby modes and power-saving options are included in the family feature set to assist low-power and system-management designs.
• Packaging & Mounting — 256-LFBGA surface-mount package (supplier package 256-CABGA, 14 × 14) for compact board integration.
• Voltage & Temperature — Operates from 2.375 V to 3.465 V and rated for commercial temperature range (0 °C to 85 °C).
• Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the device's flexible I/O and reprogrammable logic to implement board-level protocol translation, bus bridging, and custom interface logic.
• Embedded Control and Sequencing — Non-volatile configuration and on-chip timers/counters make this device suitable for control tasks and startup sequencing in embedded systems.
• Peripheral Aggregation — Leverage the combination of logic, embedded memory and hardened serial/IP blocks to aggregate and manage multiple peripherals with reduced external components.

Unique Advantages

• Non-volatile, reprogrammable configuration: Eliminates the need for external configuration memory while allowing field updates and multiple reprogramming cycles.
• Balanced mix of logic and memory: 9,400 logic elements paired with ~0.44 Mbits of embedded RAM supports a variety of mid-density designs without excessive external RAM.
• High I/O count in a compact package: 206 I/Os in a 256-LFBGA enable rich board-level connectivity within a small PCB footprint.
• Integrated system IP: Hardened I2C/SPI and timer functions reduce BOM and simplify implementation of common system interfaces.
• Flexible clocking and power modes: On-chip PLLs, oscillator and power-saving options help tailor power and performance to application requirements.
• Commercial-grade availability: Designed for commercial-temperature operation and RoHS compliance for mainstream embedded products.

Why Choose LCMXO3L-9400C-5BG256C?

The LCMXO3L-9400C-5BG256C sits at the intersection of reprogrammability, I/O capacity, and on-chip system features. Its 9,400 logic elements, substantial embedded RAM and 206 I/Os provide a solid platform for mid-density embedded designs that need reliable non-volatile configuration and integrated peripherals.

This device is well suited to designers seeking to reduce external components, implement complex glue logic, or consolidate peripheral interfacing in a compact surface-mount package while operating within a commercial temperature range. The MachXO3 family feature set delivers system-level IP and power options that support long-term design flexibility and maintainability.

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