LCMXO3L-9400C-5BG400C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA |
|---|---|
| Quantity | 150 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3L-9400C-5BG400C – MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA
The LCMXO3L-9400C-5BG400C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It delivers a mid-range programmable fabric with 9,400 logic elements, approximately 0.42 Mbits of embedded memory, and 335 user I/O pins in a compact 400‑LFBGA package.
Designed for system-level integration, this non-volatile, multi-time programmable device combines flexible on-chip clocking, hardened peripheral IP and source-synchronous I/O capabilities to simplify board design and reduce external component count for commercial-temperature applications.
Key Features
- Logic Capacity — 9,400 logic elements for implementing glue logic, state machines and moderate-density FPGA functions.
- Embedded Memory — 442,368 bits of on-chip RAM (approximately 0.42 Mbits) for buffering, FIFOs and small data stores.
- I/O Density — 335 user I/Os to support broad interfacing needs without extensive external multiplexing.
- Non-volatile, Multi-time Programmable — MachXO3 family non-volatile configuration that supports multiple programming cycles and in-system reconfiguration.
- Embedded Hardened IP — Includes hardened I²C and SPI IP cores, timer/counter and user flash memory (UFM) for system functions without additional discrete controllers.
- Flexible On‑Chip Clocking — Integrated clocking resources and sysCLOCK PLLs to support a range of system timing architectures.
- High-performance I/O — Pre-engineered source-synchronous I/O and flexible I/O buffer architecture for reliable interface timing and signal conditioning.
- Package & Mounting — 400‑LFBGA (400‑CABGA, 17 × 17) surface-mount package for dense board integration.
- Power & Operating Range — Supply voltage range 2.375 V to 3.465 V; commercial operating temperature 0 °C to 85 °C.
- Compliance — RoHS‑compliant.
Unique Advantages
- Highly integrated solution: 9,400 logic elements, 335 I/Os and ~0.42 Mbits of embedded RAM reduce the need for separate glue logic and external memory.
- Non-volatile configuration: Multi-time programmable on-chip configuration eliminates mandatory external configuration flash and simplifies system start-up.
- Embedded peripherals lower BOM: Hardened I²C, SPI, timer/counter and UFM provide common system functions without additional discrete components.
- Flexible clocking and I/O: On-chip PLLs and source-synchronous I/O support diverse timing architectures and high-quality interface timing.
- Compact, board-friendly package: 400‑LFBGA (17 × 17) surface-mount packaging enables high-density PCB designs with a small footprint.
- Commercial readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial applications.
Why Choose LCMXO3L-9400C-5BG400C?
As a member of the MachXO3 family, the LCMXO3L-9400C-5BG400C offers a balanced combination of logic capacity, I/O density and embedded memory in a non-volatile FPGA. Its hardened peripheral IP and flexible on-chip clocking make it well suited for designs that need to consolidate discrete components and streamline system integration while staying within commercial temperature limits.
This device is appropriate for engineering teams seeking a reliable, mid-density programmable device that supports in-system reconfiguration, compact packaging and a reduced BOM through embedded IP and memory. The MachXO3 family architecture provides predictable scaling and migration options within the same family.
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