LCMXO3L-9400C-6BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 1,978 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3L-9400C-6BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC, 9,400 logic elements, 206 I/Os, 256-LFBGA

The LCMXO3L-9400C-6BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation offering 9,400 logic elements and flexible on-chip resources in a compact 256-LFBGA package. Its architecture provides non-volatile, multi-time programmable configuration with embedded memory and a broad I/O set for board-level logic, interface, and control tasks.

Designed for commercial-temperature applications, the device supports single-supply operation across a nominal range and integrates clocking, hardened peripheral IP and memory blocks to address common system-level functions while minimizing external components.

Key Features

  • Logic Capacity — 9,400 logic elements suitable for mid-density programmable logic tasks and system glue logic.
  • Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 total bits) for buffering, FIFOs and small local data storage.
  • Flexible I/O — 206 I/O pins to support multiple interfaces and board-level signal routing with pre-engineered source-synchronous and flexible I/O buffer capabilities described in the MachXO3 family documentation.
  • On-chip Peripherals — Includes hardened IP functions such as I²C and SPI cores and a timer/counter, enabling common peripheral roles without external IP blocks.
  • Clocking and Oscillator — Flexible on-chip clocking with PLLs and an on-chip oscillator to support a range of timing architectures and clock domains.
  • Non-volatile Configuration — Multi-time programmable, non-volatile configuration and TransFR reconfiguration features as outlined in the MachXO3 family data sheet.
  • Power and Supply — Supports a supply voltage range of 2.375 V to 3.465 V for single-supply system designs.
  • Package and Mounting — Surface-mount 256-LFBGA package; supplier device package listed as 256-CABGA (14×14).
  • Operating Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Board-level Interface and Glue Logic — Use the device’s 206 I/Os and programmable logic to implement interface adaptation, protocol bridging and timing alignment functions.
  • Embedded Control and Sequencing — On-chip timers, counters and non-volatile configuration make it suitable for system control, initialization sequencing and state-machine implementations.
  • Peripheral Offload — Hardened I²C and SPI IP cores reduce external controller requirements for sensor or peripheral aggregation.
  • Local Memory and FIFO Functions — Approximately 0.44 Mbits of embedded RAM supports buffering, small FIFOs and temporary data storage for high-level logic blocks.

Unique Advantages

  • Balanced mid-range logic density: 9,400 logic elements provide a practical trade-off between capacity and board space for many control and interface designs.
  • Generous I/O count: 206 I/Os help minimize external level shifters and expanders by letting designers consolidate signals on-chip.
  • Integrated peripherals and clocking: Hardened I²C/SPI cores, timer/counter and on-chip PLLs reduce the need for discrete components and simplify firmware/RTL development.
  • Non-volatile configuration: Multi-time programmable, non-volatile programming supports reliable field updates and reconfiguration without external configuration memory.
  • Compact, surface-mount package: 256-LFBGA (supplier 256-CABGA 14×14) enables high-density board layouts while preserving signal density.
  • Commercial temperature rating: 0 °C to 85 °C supports a wide range of general-purpose electronic products and applications.

Why Choose LCMXO3L-9400C-6BG256C?

The LCMXO3L-9400C-6BG256C places a practical set of FPGA capabilities—9,400 logic elements, approximately 0.44 Mbits of embedded RAM and 206 I/Os—into a compact, surface-mount 256-LFBGA package. Its MachXO3 family architecture offers integrated clocking, hardened peripheral IP and non-volatile configuration that help simplify board design and reduce bill-of-materials for mid-density programmable logic needs.

Backed by Lattice Semiconductor’s MachXO3 family documentation, this device is well suited to designers seeking a commercially graded, reprogrammable solution for board-level interfaces, embedded control and peripheral offload where compact packaging, flexible I/O and on-chip resources matter.

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