LCMXO3L-9400C-6BG256C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA |
|---|---|
| Quantity | 1,978 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3L-9400C-6BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC, 9,400 logic elements, 206 I/Os, 256-LFBGA
The LCMXO3L-9400C-6BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation offering 9,400 logic elements and flexible on-chip resources in a compact 256-LFBGA package. Its architecture provides non-volatile, multi-time programmable configuration with embedded memory and a broad I/O set for board-level logic, interface, and control tasks.
Designed for commercial-temperature applications, the device supports single-supply operation across a nominal range and integrates clocking, hardened peripheral IP and memory blocks to address common system-level functions while minimizing external components.
Key Features
- Logic Capacity — 9,400 logic elements suitable for mid-density programmable logic tasks and system glue logic.
- Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 total bits) for buffering, FIFOs and small local data storage.
- Flexible I/O — 206 I/O pins to support multiple interfaces and board-level signal routing with pre-engineered source-synchronous and flexible I/O buffer capabilities described in the MachXO3 family documentation.
- On-chip Peripherals — Includes hardened IP functions such as I²C and SPI cores and a timer/counter, enabling common peripheral roles without external IP blocks.
- Clocking and Oscillator — Flexible on-chip clocking with PLLs and an on-chip oscillator to support a range of timing architectures and clock domains.
- Non-volatile Configuration — Multi-time programmable, non-volatile configuration and TransFR reconfiguration features as outlined in the MachXO3 family data sheet.
- Power and Supply — Supports a supply voltage range of 2.375 V to 3.465 V for single-supply system designs.
- Package and Mounting — Surface-mount 256-LFBGA package; supplier device package listed as 256-CABGA (14×14).
- Operating Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Board-level Interface and Glue Logic — Use the device’s 206 I/Os and programmable logic to implement interface adaptation, protocol bridging and timing alignment functions.
- Embedded Control and Sequencing — On-chip timers, counters and non-volatile configuration make it suitable for system control, initialization sequencing and state-machine implementations.
- Peripheral Offload — Hardened I²C and SPI IP cores reduce external controller requirements for sensor or peripheral aggregation.
- Local Memory and FIFO Functions — Approximately 0.44 Mbits of embedded RAM supports buffering, small FIFOs and temporary data storage for high-level logic blocks.
Unique Advantages
- Balanced mid-range logic density: 9,400 logic elements provide a practical trade-off between capacity and board space for many control and interface designs.
- Generous I/O count: 206 I/Os help minimize external level shifters and expanders by letting designers consolidate signals on-chip.
- Integrated peripherals and clocking: Hardened I²C/SPI cores, timer/counter and on-chip PLLs reduce the need for discrete components and simplify firmware/RTL development.
- Non-volatile configuration: Multi-time programmable, non-volatile programming supports reliable field updates and reconfiguration without external configuration memory.
- Compact, surface-mount package: 256-LFBGA (supplier 256-CABGA 14×14) enables high-density board layouts while preserving signal density.
- Commercial temperature rating: 0 °C to 85 °C supports a wide range of general-purpose electronic products and applications.
Why Choose LCMXO3L-9400C-6BG256C?
The LCMXO3L-9400C-6BG256C places a practical set of FPGA capabilities—9,400 logic elements, approximately 0.44 Mbits of embedded RAM and 206 I/Os—into a compact, surface-mount 256-LFBGA package. Its MachXO3 family architecture offers integrated clocking, hardened peripheral IP and non-volatile configuration that help simplify board design and reduce bill-of-materials for mid-density programmable logic needs.
Backed by Lattice Semiconductor’s MachXO3 family documentation, this device is well suited to designers seeking a commercially graded, reprogrammable solution for board-level interfaces, embedded control and peripheral offload where compact packaging, flexible I/O and on-chip resources matter.
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