LCMXO3L-9400C-6BG400C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA |
|---|---|
| Quantity | 381 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3L-9400C-6BG400C – MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA
The LCMXO3L-9400C-6BG400C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It delivers a flexible, non-volatile FPGA architecture with on-chip memory and a large I/O count in a compact 400-LFBGA package.
Designed for commercial-grade system integration, the device combines 9,400 logic elements, substantial embedded RAM, and extensive I/O to address control, interface and glue-logic functions while supporting a wide supply voltage window and standard operating temperature range.
Key Features
- Core Density — 9,400 logic elements provide programmable logic capacity for control, glue logic and interface functions.
- Embedded Memory — 442,368 bits of on-chip RAM (approximately 0.44 Mbits) for data buffering, FIFOs and small working memory.
- Extensive I/O — 335 general-purpose I/O pins enable wide peripheral connectivity and multiple interface implementations.
- Flexible Non‑volatile Configuration — MachXO3 family architecture supports non-volatile, multi-time programmable configuration and system-level support features.
- Advanced Clocking — On-chip clocking resources including PLL support for flexible timing architectures and source-synchronous I/O (as described in MachXO3 family documentation).
- Embedded Peripherals and IP — MachXO3 family includes hardened IP blocks (for example I²C and SPI cores, timers/counters) and an on-chip oscillator to simplify system design.
- Power and Supply — Supports a voltage supply range of 2.375 V to 3.465 V for compatibility with common system rails.
- Package and Mounting — 400-LFBGA (supplier package 400‑CABGA, 17×17) in a surface-mount form factor for compact board designs.
- Commercial Grade Operation — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- Interface Bridging and Protocol Conversion — Use the device’s large I/O count and flexible I/O buffer options to implement glue logic and protocol bridges between subsystems.
- Control and System Supervision — Deploy the FPGA for board-level control, sequencing and peripheral management leveraging on-chip logic and memory resources.
- User Interface and Peripheral Aggregation — Aggregate and manage multiple input/output peripherals, displays and buttons with available I/O and embedded resources.
- Embedded Sequencing and Timing — Implement timing-critical logic using embedded PLLs and clocking resources described in the MachXO3 family documentation.
Unique Advantages
- High Logic Capacity in a Compact Package: 9,400 logic elements in a 400-LFBGA reduce board area compared with multiple discrete devices.
- Wide I/O Availability: 335 I/Os enable consolidation of multiple interface functions into a single device, lowering BOM complexity.
- On-chip RAM for Local Storage: Approximately 0.44 Mbits of embedded memory supports FIFOs, buffering and small data-store needs without external RAM.
- Flexible Supply Range: 2.375 V to 3.465 V supply compatibility eases integration with common system rails.
- Commercial Temperature and RoHS Compliance: Designed for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
- Pre-engineered Family Features: MachXO3 family architecture provides non‑volatile configuration, hardened peripheral IP and configurable I/O structures to accelerate design development.
Why Choose LCMXO3L-9400C-6BG400C?
The LCMXO3L-9400C-6BG400C positions itself as a flexible, non-volatile FPGA option for commercial system designs that require significant I/O, moderate logic density and embedded memory in a compact BGA package. Its MachXO3 family architecture brings pre-engineered I/O and system-level features that simplify integration and shorten design cycles.
This device is well suited to engineers and procurement teams building board-level control, interface aggregation and glue-logic solutions where consolidation, compact packaging and RoHS compliance are priorities. The combination of logic density, I/O count and on-chip RAM provides a balanced platform for achieving scalable, maintainable designs backed by Lattice Semiconductor’s MachXO3 documentation and family support.
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