LCMXO3L-9400E-5BG256C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA |
|---|---|
| Quantity | 34 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3L-9400E-5BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA
The LCMXO3L-9400E-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation designed for low-voltage, non-volatile system logic and I/O integration. Built around a flexible on-chip architecture, this device provides 9,400 logic elements, approximately 0.42 Mbits of embedded memory, and 206 user I/Os in a compact 256-LFBGA package.
Typical uses for this device include system control, interface bridging and integration, and configuration/monitoring functions where a combination of programmable logic, embedded memory and hardened IP blocks deliver integration and design flexibility while operating within a commercial temperature range.
Key Features
- Logic Capacity — 9,400 logic elements for implementing glue logic, protocol handlers, state machines and custom control functions.
- Embedded Memory — 442,368 bits of on-chip RAM (approximately 0.42 Mbits) to support FIFOs, buffers and small lookup tables without external memory.
- I/O Density — 206 user I/Os providing broad interfacing capability for peripheral, sensor and bus connections.
- Low-Voltage Supply — Specified supply range from 1.14 V to 1.26 V for compatibility with low-voltage system rails.
- Package and Mounting — 256-LFBGA (supplier package: 256-CABGA, 14×14) in a surface-mount format for compact board designs.
- Commercial Grade Temperature — Rated for 0 °C to 85 °C operation; suitable for standard commercial applications.
- Non-Volatile, Multi-Time Programmable — MachXO3 family features include non-volatile configuration and multi-time programmability for stable field operation and reconfiguration.
- Embedded System IP and Clocking — Family datasheet documents on-chip oscillator, sysCLOCK PLLs, hardened I2C and SPI IP cores, and timer/counter primitives to accelerate system designs.
- Configuration & Test — Family-level support for IEEE 1149.1-compliant boundary scan and device configuration features for board-level testability and production programming.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- System Control and Glue Logic — Implement custom control paths, bus adapters and sequencing logic to integrate discrete components and ICs on the board.
- Interface Bridging — Use the device’s abundant I/O and embedded memory to translate, buffer or time-align signals between different peripheral interfaces.
- Configuration and Monitoring — Leverage non-volatile configuration and on-chip timers/IP to manage system boot sequences, configuration storage and runtime status monitoring.
- Peripheral Pre-Processing — Offload simple data formatting, filtering or aggregation tasks from the main processor using programmable logic and on-chip RAM.
Unique Advantages
- Highly Integrated I/O and Logic: 206 I/Os combined with 9,400 logic elements reduce external glue logic and simplify PCB routing.
- On-Chip Memory for Data Handling: Approximately 0.42 Mbits of embedded RAM supports FIFOs and buffering without adding external memory components.
- Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) aligns with modern low-voltage digital domains for easier power sequencing and integration.
- Compact Surface-Mount Package: 256-LFBGA (14×14) enables high-density board layouts while maintaining significant resource capacity.
- Built-In System IP and Clocking: Hardened I2C/SPI cores, timers, PLLs and on-chip oscillator reduce design and verification effort for common system tasks.
- Testability and Configuration Features: Boundary-scan support and multi-time programmable non-volatile configuration simplify production test and field updates.
Why Choose LCMXO3L-9400E-5BG256C?
The LCMXO3L-9400E-5BG256C positions itself as a versatile, low-voltage MachXO3 family device that balances logic capacity, I/O density and embedded memory in a single compact package. Its combination of non-volatile configuration, hardened peripheral IP and on-chip clocking makes it suitable for designs that require robust system integration without adding external components.
This device is well suited for engineers and procurement teams seeking a scalable FPGA option for commercial-grade embedded systems, where integration, board space and predictable operating conditions matter. As part of the MachXO3 family, it aligns with documented family-level features such as configuration, testability and migration options described in the MachXO3 datasheet.
Request a quote or submit your RFQ to get pricing and availability for LCMXO3L-9400E-5BG256C. Our team can provide lead-time and ordering support tailored to your project needs.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016