LCMXO3L-9400E-5BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 34 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3L-9400E-5BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

The LCMXO3L-9400E-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation designed for low-voltage, non-volatile system logic and I/O integration. Built around a flexible on-chip architecture, this device provides 9,400 logic elements, approximately 0.42 Mbits of embedded memory, and 206 user I/Os in a compact 256-LFBGA package.

Typical uses for this device include system control, interface bridging and integration, and configuration/monitoring functions where a combination of programmable logic, embedded memory and hardened IP blocks deliver integration and design flexibility while operating within a commercial temperature range.

Key Features

  • Logic Capacity — 9,400 logic elements for implementing glue logic, protocol handlers, state machines and custom control functions.
  • Embedded Memory — 442,368 bits of on-chip RAM (approximately 0.42 Mbits) to support FIFOs, buffers and small lookup tables without external memory.
  • I/O Density — 206 user I/Os providing broad interfacing capability for peripheral, sensor and bus connections.
  • Low-Voltage Supply — Specified supply range from 1.14 V to 1.26 V for compatibility with low-voltage system rails.
  • Package and Mounting — 256-LFBGA (supplier package: 256-CABGA, 14×14) in a surface-mount format for compact board designs.
  • Commercial Grade Temperature — Rated for 0 °C to 85 °C operation; suitable for standard commercial applications.
  • Non-Volatile, Multi-Time Programmable — MachXO3 family features include non-volatile configuration and multi-time programmability for stable field operation and reconfiguration.
  • Embedded System IP and Clocking — Family datasheet documents on-chip oscillator, sysCLOCK PLLs, hardened I2C and SPI IP cores, and timer/counter primitives to accelerate system designs.
  • Configuration & Test — Family-level support for IEEE 1149.1-compliant boundary scan and device configuration features for board-level testability and production programming.
  • Regulatory Compliance — RoHS compliant.

Typical Applications

  • System Control and Glue Logic — Implement custom control paths, bus adapters and sequencing logic to integrate discrete components and ICs on the board.
  • Interface Bridging — Use the device’s abundant I/O and embedded memory to translate, buffer or time-align signals between different peripheral interfaces.
  • Configuration and Monitoring — Leverage non-volatile configuration and on-chip timers/IP to manage system boot sequences, configuration storage and runtime status monitoring.
  • Peripheral Pre-Processing — Offload simple data formatting, filtering or aggregation tasks from the main processor using programmable logic and on-chip RAM.

Unique Advantages

  • Highly Integrated I/O and Logic: 206 I/Os combined with 9,400 logic elements reduce external glue logic and simplify PCB routing.
  • On-Chip Memory for Data Handling: Approximately 0.42 Mbits of embedded RAM supports FIFOs and buffering without adding external memory components.
  • Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) aligns with modern low-voltage digital domains for easier power sequencing and integration.
  • Compact Surface-Mount Package: 256-LFBGA (14×14) enables high-density board layouts while maintaining significant resource capacity.
  • Built-In System IP and Clocking: Hardened I2C/SPI cores, timers, PLLs and on-chip oscillator reduce design and verification effort for common system tasks.
  • Testability and Configuration Features: Boundary-scan support and multi-time programmable non-volatile configuration simplify production test and field updates.

Why Choose LCMXO3L-9400E-5BG256C?

The LCMXO3L-9400E-5BG256C positions itself as a versatile, low-voltage MachXO3 family device that balances logic capacity, I/O density and embedded memory in a single compact package. Its combination of non-volatile configuration, hardened peripheral IP and on-chip clocking makes it suitable for designs that require robust system integration without adding external components.

This device is well suited for engineers and procurement teams seeking a scalable FPGA option for commercial-grade embedded systems, where integration, board space and predictable operating conditions matter. As part of the MachXO3 family, it aligns with documented family-level features such as configuration, testability and migration options described in the MachXO3 datasheet.

Request a quote or submit your RFQ to get pricing and availability for LCMXO3L-9400E-5BG256C. Our team can provide lead-time and ordering support tailored to your project needs.

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