LCMXO3L-9400E-5BG400I

The LCMXO3L-9400E-5BG400I is a MachXO3 family Field Programmable Gate Array (FPGA) IC designed for system integration and flexible I/O-centric designs. It combines 9,400 logic elements with approximately 0.44 Mbits of embedded RAM and up to 335 I/Os in a compact 400‑LFBGA package.

Targeted for industrial applications, this device offers non-volatile, multi-time programmable capability and operational support across a wide voltage range and industrial temperature window to meet robust deployment needs.

Key Features

• Logic Capacity  9,400 logic elements for implementing custom glue logic, control functions, and moderate-density programmable logic designs.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) to support FIFOs, state storage, and data buffering.
• I/O Density  335 I/Os to enable extensive peripheral connectivity, bus bridging, and interface aggregation in a single device.
• Non-volatile, Multi-time Programmable  Built-in non-volatile configuration supports multi-time programming for field updates and flexible lifecycle management.
• Hardened Embedded IP  Includes embedded hardened IP functions such as I²C, SPI and timer/counter blocks for common system tasks and peripheral control.
• Clocking and Timing  Flexible on-chip clocking resources, including PLL support, for synchronized interfaces and reliable timing across system domains.
• Power and Temperature  Operating supply range of 1.14 V to 1.26 V and an industrial temperature rating of −40 °C to 100 °C for deployment in demanding environments.
• Package and Mounting  Surface-mount 400‑LFBGA package (supplier device package: 400‑CABGA, 17×17) for high-pin-count, space-efficient board designs.
• Standards and Compliance  RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• Industrial Control Systems  Use the device's industrial temperature range and 335 I/Os to consolidate sensor inputs, actuator control, and protocol interfacing on factory and process automation boards.
• Interface Bridging and Glue Logic  Leverage 9,400 logic elements and flexible I/O to implement protocol converters, bus adapters, and board-level glue logic that reduce system BOM.
• Embedded System Peripherals  Employ the embedded RAM and hardened I²C/SPI/timer functions for local buffering, peripheral management, and timing tasks in embedded controllers.

Unique Advantages

• High Integration Density: Combines 9,400 logic elements with 335 I/Os and embedded RAM to reduce part count and simplify PCB design.
• Non-volatile Configuration: Multi-time programmable non-volatile configuration enables field updates and flexible design revisions without external configuration memory.
• Industrial-ready Operation: Rated for −40 °C to 100 °C and RoHS compliant, supporting deployment in industrial environments that require extended temperature tolerance.
• Embedded Peripheral IP: Hardened I²C, SPI and timer/counter blocks offload common tasks from fabric resources, accelerating development and conserving logic elements.
• Compact, High‑Pin Package: 400‑LFBGA (400‑CABGA, 17×17) offers high I/O count in a compact surface-mount form factor for space-constrained system designs.
• Controlled Supply Range: Operates within a defined 1.14–1.26 V supply window for predictable power and timing behavior in regulated designs.

Why Choose LCMXO3L-9400E-5BG400I?

The LCMXO3L-9400E-5BG400I positions itself as a flexible, industrial-grade FPGA option for designs that require a balance of logic density, high I/O count, and on-chip memory. Its non-volatile, multi-time programmable architecture and embedded peripheral IP simplify system architecture and reduce the need for external support components.

Engineers designing industrial control, interface bridging, or embedded peripheral systems will find this device suitable for consolidating functionality, shortening development cycles, and supporting long-term field updates while operating across a wide temperature range and within a compact package.

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