LCMXO3L-9400E-5MG256C

The LCMXO3L-9400E-5MG256C is a MachXO3 family field programmable gate array (FPGA) offered in a 256-VFBGA (256-CSFBGA, 9×9) package. It provides 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, and 206 user I/Os in a commercial-grade, surface-mount form factor.

Built on the MachXO3 architecture, the device supports non-volatile, multi-time programmable configuration and family-level system features such as embedded block RAM, programmable I/O, on-chip clocking and PLLs, and hardened peripheral IP to simplify system integration.

Key Features

• Core Logic 9,400 logic elements designed for glue logic, control functions, and small-to-medium FPGA tasks.
• Embedded Memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for FIFOs, buffers and local storage.
• I/O Density 206 user I/Os to support parallel interfaces, signal aggregation and multiple peripheral connections.
• Non-volatile Configuration MachXO3 family support for non-volatile, multi-time programmable configuration enabling persistent designs without external configuration memory.
• Programmable I/O and System IP Family-level programmable I/O cells, source-synchronous I/O support, on-chip oscillator, and embedded hardened IP blocks such as I²C and SPI cores and timers to reduce external components.
• Clocking and Timing On-chip clocking resources including PLLs and flexible clock distribution suited for synchronous designs.
• Power Core supply operation between 1.14 V and 1.26 V to match low-voltage system rails.
• Package and Mounting 256-VFBGA (256-CSFBGA, 9×9) surface-mount package for compact board integration.
• Commercial Grade & RoHS Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• System Glue Logic Implement board-level control, bus bridging and protocol adaptation functions using the device’s programmable logic and dense I/O.
• I/O Expansion and Interface Aggregation Aggregate and translate multiple peripheral interfaces with 206 available I/Os and programmable I/O cells.
• Embedded Control and Configuration Use non-volatile, multi-time programmable configuration and on-chip timers and controllers for persistent system control functions.
• Local Buffering and FIFO Management Utilize the embedded RAM for buffering, small FIFOs and temporary data storage close to logic to simplify board design.

Unique Advantages

• Highly integrated I/O and logic: 206 I/Os combined with 9,400 logic elements reduce external glue logic and simplify PCB layouts.
• Non-volatile, multi-time programmable configuration: Eliminates the need for external configuration memory while enabling field reprogramming.
• Embedded hardened IP and clocking: On-chip I²C/SPI IP cores, timers and PLLs reduce BOM and speed time-to-market.
• Compact, solderable package: 256-VFBGA surface-mount package balances pin count and board footprint for dense designs.
• Low-voltage core operation: 1.14 V to 1.26 V supply compatibility with low-voltage system rails.
• Commercial temperature range and RoHS compliance: Designed for standard commercial applications with environmental compliance for global supply chains.

Why Choose LCMXO3L-9400E-5MG256C?

The LCMXO3L-9400E-5MG256C positions itself as a compact, feature-rich MachXO3 family FPGA that balances logic capacity, I/O density and embedded memory for common system control, interface and glue logic roles. Its non-volatile configuration, on-chip clocking and hardened IP blocks help reduce external components and streamline board-level integration.

This device is suited to designs that require a commercial-grade, surface-mount FPGA with substantial I/O, flexible on-chip resources and family-level support for migration and system-level features. Its combination of logic, embedded RAM and peripheral IP provides a practical platform for rapid development and deployment in a wide range of embedded applications.

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