LCMXO3L-9400E-6BG400C

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

Quantity 1,149 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O335Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3L-9400E-6BG400C – MachXO3 Field Programmable Gate Array (FPGA), 9,400 logic elements, 335 I/Os

The LCMXO3L-9400E-6BG400C is a MachXO3 family FPGA offering 9,400 logic elements and approximately 0.44 Mbits of embedded RAM in a 400-LFBGA package. It provides a flexible, non-volatile, multi-time programmable architecture with on-chip configuration and system-level features suited for compact, board-level programmable logic integration.

Designed for commercial-grade applications, the device delivers a high I/O count (335 pins), advanced on-chip peripherals and configurable I/O buffering, enabling system integration tasks such as interface bridging, glue logic and control functions while operating from a 1.14 V to 1.26 V supply and a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic  9,400 logic elements for implementing combinational and sequential logic, supporting a wide range of programmable logic functions.
  • Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for data buffering, state storage and small look-up tables.
  • High I/O Density  335 I/Os and high-performance, flexible I/O buffers for interfacing to multiple peripherals and external devices.
  • Packaging  Surface-mount 400-LFBGA (400-CABGA, 17×17) package suitable for high-density PCB designs.
  • Power and Temperature  Core supply range of 1.14 V to 1.26 V and rated for commercial operation from 0 °C to 85 °C.
  • Non-volatile Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
  • On-chip System IP  Datasheet references embedded hardened IP such as I²C and SPI controllers, timers/counters, user flash memory (UFM), on-chip oscillator and PLL-based clocking options.
  • System Support & Reliability  Includes architecture-level features for configuration, boundary-scan testability and standby/power-saving options as described in the MachXO3 family documentation.
  • Compliance  RoHS compliant.

Typical Applications

  • Interface Bridging  Use the high I/O count and flexible I/O buffering to convert, aggregate or bridge signals between subsystems and peripherals.
  • System Glue Logic  Implement custom glue logic, control sequencing and protocol adaptation with programmable logic and embedded RAM.
  • Peripheral Management  Integrate on-chip I²C/SPI controllers and timers for peripheral control and local management tasks.
  • Configuration and Security Functions  Leverage non-volatile, multi-time programmable configuration and user flash memory for board-level configuration and stored parameters.

Unique Advantages

  • Highly integrated programmable fabric: 9,400 logic elements combined with embedded RAM and hardened IP reduce external component count and simplify board-level designs.
  • Large I/O capacity: 335 I/Os enable complex interfacing and high pin-count peripheral connections without additional transceivers.
  • Non-volatile, reprogrammable configuration: Multi-time programmable, on-chip configuration supports in-field updates and flexible development workflows.
  • Compact, surface-mount package: 400-LFBGA (17×17) package supports high-density PCB layouts while providing the device’s full I/O complement.
  • Embedded system features: Hardened I²C/SPI, timers and on-chip oscillator/PLLs provide ready-made building blocks for common system functions.
  • Commercial-grade operation: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Why Choose LCMXO3L-9400E-6BG400C?

The LCMXO3L-9400E-6BG400C positions itself as a versatile, board-level FPGA solution offering substantial I/O density, a sizable programmable fabric and embedded memory with non-volatile configuration. Its MachXO3 family features—such as hardened peripheral IP, flexible on-chip clocking and configuration options—make it a practical choice for applications that require compact, reprogrammable logic and system-level integration at commercial temperature grades.

This device is suited for engineering teams seeking to consolidate functions, reduce BOM complexity and maintain field reprogrammability while leveraging a proven architecture and documented family-level features.

Request a quote or submit a pricing and availability inquiry to evaluate the LCMXO3L-9400E-6BG400C for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up