LCMXO3L-9400E-6BG400C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA |
|---|---|
| Quantity | 1,149 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3L-9400E-6BG400C – MachXO3 Field Programmable Gate Array (FPGA), 9,400 logic elements, 335 I/Os
The LCMXO3L-9400E-6BG400C is a MachXO3 family FPGA offering 9,400 logic elements and approximately 0.44 Mbits of embedded RAM in a 400-LFBGA package. It provides a flexible, non-volatile, multi-time programmable architecture with on-chip configuration and system-level features suited for compact, board-level programmable logic integration.
Designed for commercial-grade applications, the device delivers a high I/O count (335 pins), advanced on-chip peripherals and configurable I/O buffering, enabling system integration tasks such as interface bridging, glue logic and control functions while operating from a 1.14 V to 1.26 V supply and a 0 °C to 85 °C temperature range.
Key Features
- Core Logic 9,400 logic elements for implementing combinational and sequential logic, supporting a wide range of programmable logic functions.
- Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for data buffering, state storage and small look-up tables.
- High I/O Density 335 I/Os and high-performance, flexible I/O buffers for interfacing to multiple peripherals and external devices.
- Packaging Surface-mount 400-LFBGA (400-CABGA, 17×17) package suitable for high-density PCB designs.
- Power and Temperature Core supply range of 1.14 V to 1.26 V and rated for commercial operation from 0 °C to 85 °C.
- Non-volatile Configuration MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
- On-chip System IP Datasheet references embedded hardened IP such as I²C and SPI controllers, timers/counters, user flash memory (UFM), on-chip oscillator and PLL-based clocking options.
- System Support & Reliability Includes architecture-level features for configuration, boundary-scan testability and standby/power-saving options as described in the MachXO3 family documentation.
- Compliance RoHS compliant.
Typical Applications
- Interface Bridging Use the high I/O count and flexible I/O buffering to convert, aggregate or bridge signals between subsystems and peripherals.
- System Glue Logic Implement custom glue logic, control sequencing and protocol adaptation with programmable logic and embedded RAM.
- Peripheral Management Integrate on-chip I²C/SPI controllers and timers for peripheral control and local management tasks.
- Configuration and Security Functions Leverage non-volatile, multi-time programmable configuration and user flash memory for board-level configuration and stored parameters.
Unique Advantages
- Highly integrated programmable fabric: 9,400 logic elements combined with embedded RAM and hardened IP reduce external component count and simplify board-level designs.
- Large I/O capacity: 335 I/Os enable complex interfacing and high pin-count peripheral connections without additional transceivers.
- Non-volatile, reprogrammable configuration: Multi-time programmable, on-chip configuration supports in-field updates and flexible development workflows.
- Compact, surface-mount package: 400-LFBGA (17×17) package supports high-density PCB layouts while providing the device’s full I/O complement.
- Embedded system features: Hardened I²C/SPI, timers and on-chip oscillator/PLLs provide ready-made building blocks for common system functions.
- Commercial-grade operation: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial applications.
Why Choose LCMXO3L-9400E-6BG400C?
The LCMXO3L-9400E-6BG400C positions itself as a versatile, board-level FPGA solution offering substantial I/O density, a sizable programmable fabric and embedded memory with non-volatile configuration. Its MachXO3 family features—such as hardened peripheral IP, flexible on-chip clocking and configuration options—make it a practical choice for applications that require compact, reprogrammable logic and system-level integration at commercial temperature grades.
This device is suited for engineering teams seeking to consolidate functions, reduce BOM complexity and maintain field reprogrammability while leveraging a proven architecture and documented family-level features.
Request a quote or submit a pricing and availability inquiry to evaluate the LCMXO3L-9400E-6BG400C for your next design.