LCMXO3L-9400E-6BG484C

IC FPGA 384 I/O 484CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 384 442368 9400 484-LFBGA

Quantity 893 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-CABGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-LFBGANumber of I/O384Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3L-9400E-6BG484C – MachXO3 FPGA, 9,400 logic elements, 384 I/Os, 484‑LFBGA

The LCMXO3L-9400E-6BG484C is a MachXO3 family field-programmable gate array (FPGA) optimized for system control, interface consolidation and programmable glue logic. It delivers 9,400 logic elements, 384 user I/Os and embedded block RAM to support a wide range of mid-density integration tasks within commercial temperature systems.

Built on the MachXO3 architecture, the device combines non-volatile, multi-time programmable configuration with on-chip hardened IP and flexible I/O and clocking resources to simplify board-level design and reduce external component count.

Key Features

  • Core Logic 9,400 logic elements for implementing combinational and sequential logic with 1,175 configurable slices or CLB-equivalents.
  • Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM provided by sysMEM block RAM for FIFOs, buffering and small data stores.
  • I/O Capacity and Flexibility 384 user I/Os with pre‑engineered source-synchronous I/O and flexible I/O buffer banks to support a variety of interface needs.
  • Configuration and Non-Volatile Storage Non-volatile, multi-time programmable configuration with TransFR reconfiguration capability for in-system updates.
  • Clocking and Timing On-chip oscillator and sysCLOCK phase-locked loops (PLLs) enable flexible, embedded clock generation and distribution.
  • Hardened IP Embedded hardened IP functions including I2C and SPI cores plus timer/counter primitives to accelerate common system functions.
  • Package and Mounting 484-LFBGA package (484-CABGA, 19×19) in a surface-mount form factor suitable for compact board designs.
  • Power and Temperature Recommended supply range 1.14 V to 1.26 V with commercial operating temperature 0 °C to 85 °C.
  • Compliance RoHS compliant to support modern manufacturing requirements.

Typical Applications

  • System Glue Logic Consolidate multiple discrete logic functions and interface translation into a single reprogrammable device using 9,400 logic elements and abundant I/Os.
  • Interface Bridging Implement custom protocol bridging and buffering with the device’s 384 I/Os and embedded block RAM for short-term data storage.
  • Peripheral and Sensor Control Use hardened I2C/SPI IP and timers to control sensors and peripherals while minimizing external controller requirements.
  • On-Board Sequencing and Power Management Leverage programmable clocking (PLLs and on-chip oscillator) and non-volatile configuration to manage startup sequencing and reconfiguration tasks.

Unique Advantages

  • Highly integrated mid-density FPGA: 9,400 logic elements and 384 I/Os reduce the need for multiple discrete devices and lower BOM complexity.
  • Non-volatile reprogrammability: Multi-time programmable configuration and TransFR reconfiguration support in-field updates without external configuration memory.
  • Embedded hardened peripherals: Built-in I2C and SPI cores plus timer/counter blocks accelerate system development and reduce soft-IP overhead.
  • Flexible clocking and memory: On-chip oscillator, PLLs and approximately 0.42 Mbits of sysMEM block RAM simplify timing and buffering implementations.
  • Compact, production-ready package: 484-LFBGA (19×19) surface-mount package supports dense board layouts while maintaining high I/O count.

Why Choose LCMXO3L-9400E-6BG484C?

As part of the MachXO3 family, the LCMXO3L-9400E-6BG484C combines non-volatile programmability, embedded hardened IP and flexible I/O and clocking to address a broad set of commercial system-level tasks. Its balance of logic density, on-chip RAM and high I/O count makes it well suited for designers seeking to consolidate interfaces, implement glue logic and enable in-field reconfiguration.

This device is positioned for customers who need a reliable, reprogrammable mid-density FPGA solution in a compact 484-LFBGA package with commercial temperature operation and RoHS compliance, and who benefit from the MachXO3 family features such as embedded peripherals and migration options documented in the family datasheet.

Request a quote or submit a purchase inquiry to get pricing and availability for LCMXO3L-9400E-6BG484C. Our team can assist with volume pricing, lead-time information and technical questions related to integrating this MachXO3 device into your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up