LCMXO3L-9400E-6BG484C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 384 442368 9400 484-LFBGA |
|---|---|
| Quantity | 893 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 384 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3L-9400E-6BG484C – MachXO3 FPGA, 9,400 logic elements, 384 I/Os, 484‑LFBGA
The LCMXO3L-9400E-6BG484C is a MachXO3 family field-programmable gate array (FPGA) optimized for system control, interface consolidation and programmable glue logic. It delivers 9,400 logic elements, 384 user I/Os and embedded block RAM to support a wide range of mid-density integration tasks within commercial temperature systems.
Built on the MachXO3 architecture, the device combines non-volatile, multi-time programmable configuration with on-chip hardened IP and flexible I/O and clocking resources to simplify board-level design and reduce external component count.
Key Features
- Core Logic 9,400 logic elements for implementing combinational and sequential logic with 1,175 configurable slices or CLB-equivalents.
- Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM provided by sysMEM block RAM for FIFOs, buffering and small data stores.
- I/O Capacity and Flexibility 384 user I/Os with pre‑engineered source-synchronous I/O and flexible I/O buffer banks to support a variety of interface needs.
- Configuration and Non-Volatile Storage Non-volatile, multi-time programmable configuration with TransFR reconfiguration capability for in-system updates.
- Clocking and Timing On-chip oscillator and sysCLOCK phase-locked loops (PLLs) enable flexible, embedded clock generation and distribution.
- Hardened IP Embedded hardened IP functions including I2C and SPI cores plus timer/counter primitives to accelerate common system functions.
- Package and Mounting 484-LFBGA package (484-CABGA, 19×19) in a surface-mount form factor suitable for compact board designs.
- Power and Temperature Recommended supply range 1.14 V to 1.26 V with commercial operating temperature 0 °C to 85 °C.
- Compliance RoHS compliant to support modern manufacturing requirements.
Typical Applications
- System Glue Logic Consolidate multiple discrete logic functions and interface translation into a single reprogrammable device using 9,400 logic elements and abundant I/Os.
- Interface Bridging Implement custom protocol bridging and buffering with the device’s 384 I/Os and embedded block RAM for short-term data storage.
- Peripheral and Sensor Control Use hardened I2C/SPI IP and timers to control sensors and peripherals while minimizing external controller requirements.
- On-Board Sequencing and Power Management Leverage programmable clocking (PLLs and on-chip oscillator) and non-volatile configuration to manage startup sequencing and reconfiguration tasks.
Unique Advantages
- Highly integrated mid-density FPGA: 9,400 logic elements and 384 I/Os reduce the need for multiple discrete devices and lower BOM complexity.
- Non-volatile reprogrammability: Multi-time programmable configuration and TransFR reconfiguration support in-field updates without external configuration memory.
- Embedded hardened peripherals: Built-in I2C and SPI cores plus timer/counter blocks accelerate system development and reduce soft-IP overhead.
- Flexible clocking and memory: On-chip oscillator, PLLs and approximately 0.42 Mbits of sysMEM block RAM simplify timing and buffering implementations.
- Compact, production-ready package: 484-LFBGA (19×19) surface-mount package supports dense board layouts while maintaining high I/O count.
Why Choose LCMXO3L-9400E-6BG484C?
As part of the MachXO3 family, the LCMXO3L-9400E-6BG484C combines non-volatile programmability, embedded hardened IP and flexible I/O and clocking to address a broad set of commercial system-level tasks. Its balance of logic density, on-chip RAM and high I/O count makes it well suited for designers seeking to consolidate interfaces, implement glue logic and enable in-field reconfiguration.
This device is positioned for customers who need a reliable, reprogrammable mid-density FPGA solution in a compact 484-LFBGA package with commercial temperature operation and RoHS compliance, and who benefit from the MachXO3 family features such as embedded peripherals and migration options documented in the family datasheet.
Request a quote or submit a purchase inquiry to get pricing and availability for LCMXO3L-9400E-6BG484C. Our team can assist with volume pricing, lead-time information and technical questions related to integrating this MachXO3 device into your design.