LCMXO3L-9400E-6BG484I

The LCMXO3L-9400E-6BG484I is a MachXO3 field programmable gate array (FPGA) in a 484-LFBGA package. It integrates 9,400 logic elements with approximately 0.44 Mbits of embedded RAM and up to 384 I/Os, delivering a compact, reprogrammable logic platform suitable for industrial-temperature applications.

Designed for system integration, configuration management and flexible I/O tasks, this device combines non-volatile, multi-time programmable configuration with on-chip clocking, programmable I/O buffering and hardened peripheral IP options described in the MachXO3 family datasheet.

Key Features

• Logic Capacity — 9,400 logic elements organized across 1,175 logic blocks, providing mid-range programmable logic density for glue logic, control and interface tasks.
• Embedded Memory — Approximately 0.44 Mbits of total on-chip RAM for FIFOs, buffers and small data storage requirements.
• I/O and Packaging — Up to 384 user I/Os in a 484-LFBGA package (supplier device package: 484-CABGA, 19×19); surface-mount mounting for standard PCB assembly.
• Industrial Operating Range — Rated operating temperature from −40 °C to 100 °C and specified as industrial grade for use in harsher environments.
• Low-Voltage Core — Core supply range from 1.14 V to 1.26 V to match system power domains.
• Non-volatile, Multi-time Programmable Configuration — Family-level capability for persistent configuration and in-field reprogramming as described in the MachXO3 data sheet.
• On-chip System Resources — Flexible on-chip clocking with PLLs, an on-chip oscillator and user flash memory (UFM) for system functions and small non-volatile storage.
• Embedded Hardened IP — MachXO3 family includes hardened peripheral IP building blocks such as I²C, SPI and timer/counter cores to accelerate common system designs.
• Configuration & Test — Device-level support for configuration and IEEE 1149.1-compliant boundary-scan testability as documented in the family datasheet.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature range and dense I/O make the device suitable for sensor interfacing, control logic and factory automation subsystems.
• I/O Expansion and Protocol Bridging — 384 I/Os combined with flexible I/O buffering and on-chip peripherals support protocol translation and board-level interface consolidation.
• Configuration and System Management — Non-volatile multi-time programmable configuration and user flash memory enable persistent configuration, system monitoring and field updates.
• Glue Logic and Embedded Control — 9,400 logic elements and embedded RAM provide resources for glue logic, small-state machines and local data buffering on complex PCBs.

Unique Advantages

• Mid-range Logic Density: 9,400 logic elements deliver ample capacity for interface logic and control functions without the area and cost of larger FPGAs.
• High I/O Count in a Compact Package: Up to 384 I/Os in a 484-LFBGA footprint enable significant board-level routing and connectivity while maintaining a compact form factor.
• Industrial-ready Thermal Range: Specified −40 °C to 100 °C operation supports deployments in industrial environments requiring wider temperature tolerance.
• Persistent, Reprogrammable Configuration: Non-volatile, multi-time programmable configuration and UFM simplify in-field updates and system provisioning.
• Integrated System Features: On-chip PLLs, oscillator, embedded RAM and hardened IP reduce external component count and accelerate development.
• Test and Validation Support: IEEE 1149.1 boundary-scan support aids board-level test and manufacturing diagnostics.

Why Choose LCMXO3L-9400E-6BG484I?

The LCMXO3L-9400E-6BG484I positions itself as a versatile, industrial-grade FPGA for mid-density logic, I/O-heavy designs and system integration tasks. Its combination of 9,400 logic elements, substantial embedded RAM, high I/O count and family-level features—such as non-volatile configuration, on-chip clocking and hardened peripheral IP—provides a practical balance of integration and flexibility for embedded system designers and PCB-level integrators.

This part is well suited to teams seeking a reprogrammable, compact solution that supports field updates, board-level interface consolidation and industrial operating conditions while leveraging the MachXO3 family capabilities documented in the datasheet.

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