LCMXO3LF-1300C-5BG256I

The LCMXO3LF-1300C-5BG256I is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It provides 1280 logic elements, 65,536 bits of on-chip RAM, and up to 206 user I/Os in a compact 256-pin LFBGA package, delivering a reconfigurable logic option with non-volatile configuration capabilities described in the MachXO3 family datasheet.

Designed and specified for industrial operation (–40 °C to 100 °C) with a recommended supply range of 2.375 V to 3.465 V, the device targets embedded systems that require flexible I/O, on-chip memory, hardened peripheral IP, and advanced system-level support from the MachXO3 family.

Key Features

• Core Logic — 1280 logic elements to implement glue logic, custom state machines, and small to medium combinational/sequential functions.
• Embedded Memory — 65,536 bits of on-chip RAM for data buffering, FIFOs or small local memories.
• I/O Density and Flexibility — 206 user I/Os with the MachXO3 family’s programmable I/O cell architecture and pre‑engineered source-synchronous I/O capabilities as described in the datasheet.
• Configuration and Non-volatile Storage — Family-level features include non-volatile, multi-time programmable configuration and TransFR reconfiguration mechanisms for field updates.
• Embedded Hardened IP — The MachXO3 family datasheet documents hardened IP functions such as I²C and SPI cores and timers/counters for common peripheral control tasks.
• Clocking and Timing — Flexible on-chip clocking infrastructure including PLLs and clock distribution features referenced in the family documentation.
• Package and Mounting — 256-LFBGA (supplier package 256-CABGA, 14×14) surface-mount package for compact board designs.
• Industrial Grade Operation — Specified operating temperature range of –40 °C to 100 °C for industrial applications.
• Power and System Options — Supported supply range of 2.375 V to 3.465 V and family-level standby/power-saving options documented in the datasheet.
• Standards and Testability — Family documentation includes boundary-scan (IEEE 1149.1) and configuration/testing features to aid production test and validation.

Typical Applications

• Interface Bridging and Glue Logic — Use the device’s 206 I/Os and source-synchronous I/O features to implement protocol bridging, bus adaptation, and board-level glue logic.
• Industrial Control and Monitoring — Industrial grade temperature range and on-chip memory make it suitable for control, signal conditioning, and local sequencing in industrial systems.
• Peripheral Aggregation and Sensor Interfaces — Hardened I²C and SPI IP cores plus programmable I/O enable aggregation of sensors and peripheral devices with local preprocessing.
• Configuration and Boot Management — Non-volatile, multi-time programmable configuration supports in-field updates and boot-time configuration tasks documented in the MachXO3 family materials.

Unique Advantages

• Highly integrated small FPGA: Combines 1280 logic elements, 65,536 bits of RAM and 206 I/Os in a single 256-LFBGA package to reduce BOM and board real estate.
• Industrial temperature rating: Specified for –40 °C to 100 °C operation, enabling deployment in harsher environments without additional qualification claims beyond the provided grade.
• Non-volatile, field-reconfigurable: MachXO3 family configuration features support multi-time programming and field updates for evolving system requirements.
• Embedded peripheral IP: Hardened I²C, SPI and timer/counter blocks reduce logic implementation effort and speed time-to-market for common control tasks.
• Compact package with high I/O count: 256-pin LFBGA (14×14 CABGA) allows for dense connectivity while remaining surface-mount friendly.
• System-level support documented: The MachXO3 family datasheet provides architecture, clocking, power management and testability guidance to support engineering integration.

Why Choose LCMXO3LF-1300C-5BG256I?

The LCMXO3LF-1300C-5BG256I positions itself as a compact, industrial-grade FPGA option within the MachXO3 family, delivering a balance of logic capacity, embedded RAM, and high I/O density in a 256-pin LFBGA package. Its family-documented features—non-volatile configuration, hardened peripheral IP, flexible clocking and I/O—help streamline common embedded and control system designs.

This device is appropriate for engineering teams who need a reconfigurable, field-updatable logic element with documented system-level features and industrial temperature operation. The MachXO3 family documentation offers migration and system-support guidance that helps maintain design continuity and long-term product support.

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