LCMXO3LF-1300C-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA

Quantity 1,202 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3LF-1300C-6BG256I – MachXO3 FPGA IC, 206 I/O, 1280 logic elements, 256-LFBGA

The LCMXO3LF-1300C-6BG256I is a MachXO3 family Field Programmable Gate Array (FPGA) IC designed for reconfigurable logic and system I/O in industrial applications. It combines 1,280 logic elements, approximately 0.0625 Mbits (65,536 bits) of embedded RAM, and 206 I/O pins in a compact 256-LFBGA surface-mount package.

Built for industrial operating ranges and flexible voltage domains, this device supports designers who need non-volatile, multi-time programmable logic and integrated system-level functions in confined board space.

Key Features

  • Logic Capacity — 1,280 logic elements suitable for glue logic, state machines and moderate-density custom logic implementations.
  • Embedded Memory — Approximately 0.0625 Mbits (65,536 bits) of on-chip RAM with configurable RAM/ROM modes for data buffering and small memory structures.
  • I/O Density & Flexibility — 206 programmable I/O pins, supporting a variety of system interfacing requirements in a single device.
  • Non-volatile, Multi-time Programmable Configuration — In-system reprogrammability and persistent configuration across power cycles as described for the MachXO3 family.
  • Clocking and Timing — Integrated on-chip oscillator and sysCLOCK PLL support for flexible on-chip clocking and timing control.
  • Embedded IP and Peripherals — Hardened IP functions referenced in the MachXO3 family including I²C and SPI cores, timers/counters and user flash memory (UFM).
  • Package and Mounting — 256-LFBGA (supplier package: 256-CABGA, 14×14) surface-mount package optimized for dense board integration.
  • Power and Voltage — Operates from 2.375 V to 3.465 V supply domains to match common system rails.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • System Reliability and Testability — Features referenced in the family datasheet include IEEE 1149.1-compliant boundary scan and power-on-reset behavior to support testing and system bring-up.

Typical Applications

  • Industrial Control & Monitoring — The industrial temperature range (−40 °C to 100 °C), 206 I/O and reprogrammable logic make the device suitable for control, I/O aggregation and monitoring functions.
  • Interface Bridging and Glue Logic — Use the programmable I/O, hardened I²C/SPI IP and on-chip memory to implement protocol bridges, level adaptation and board-level glue logic.
  • Embedded System Integration — Non-volatile, multi-time programmable configuration with on-chip oscillator and PLLs enables compact embedded designs requiring persistent logic and flexible clocking.

Unique Advantages

  • Industrial-rated operation: Supports −40 °C to 100 °C to meet the environmental needs of industrial equipment and controls.
  • High I/O count in a compact package: 206 I/O pins in a 256-LFBGA (14×14) footprint reduces external interface components and simplifies PCB routing.
  • Non-volatile programmability: Multi-time programmable configuration keeps designs field-upgradable without external configuration memory.
  • Integrated system functions: Hardened I²C/SPI and timers reduce the need for discrete supervisory components and simplify firmware complexity.
  • Flexible power domains: 2.375 V to 3.465 V operating range enables compatibility with common board power rails.
  • Test and reliability features: Boundary-scan support and documented power-on-reset behavior aid production test and system bring-up.

Why Choose LCMXO3LF-1300C-6BG256I?

The LCMXO3LF-1300C-6BG256I positions itself as a compact, industrial-grade MachXO3 FPGA option for designs that require persistent, reconfigurable logic, substantial I/O, and modest embedded memory. Its combination of 1,280 logic elements, 206 I/O pins, integrated system IP and industrial temperature rating makes it well suited for control, interface and embedded integration tasks where board space and reliability matter.

For design teams targeting scalable, field-updateable hardware with on-chip clocking, system IP and boundary-scan testability, this MachXO3 device offers a balanced set of capabilities to simplify BOM, reduce external components and support long-term maintainability.

If you would like pricing, availability or technical support for LCMXO3LF-1300C-6BG256I, request a quote or contact sales to discuss your requirements and obtain a formal quotation.

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