LCMXO3LF-1300C-6BG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 65536 1280 256-LFBGA |
|---|---|
| Quantity | 1,202 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3LF-1300C-6BG256I – MachXO3 FPGA IC, 206 I/O, 1280 logic elements, 256-LFBGA
The LCMXO3LF-1300C-6BG256I is a MachXO3 family Field Programmable Gate Array (FPGA) IC designed for reconfigurable logic and system I/O in industrial applications. It combines 1,280 logic elements, approximately 0.0625 Mbits (65,536 bits) of embedded RAM, and 206 I/O pins in a compact 256-LFBGA surface-mount package.
Built for industrial operating ranges and flexible voltage domains, this device supports designers who need non-volatile, multi-time programmable logic and integrated system-level functions in confined board space.
Key Features
- Logic Capacity — 1,280 logic elements suitable for glue logic, state machines and moderate-density custom logic implementations.
- Embedded Memory — Approximately 0.0625 Mbits (65,536 bits) of on-chip RAM with configurable RAM/ROM modes for data buffering and small memory structures.
- I/O Density & Flexibility — 206 programmable I/O pins, supporting a variety of system interfacing requirements in a single device.
- Non-volatile, Multi-time Programmable Configuration — In-system reprogrammability and persistent configuration across power cycles as described for the MachXO3 family.
- Clocking and Timing — Integrated on-chip oscillator and sysCLOCK PLL support for flexible on-chip clocking and timing control.
- Embedded IP and Peripherals — Hardened IP functions referenced in the MachXO3 family including I²C and SPI cores, timers/counters and user flash memory (UFM).
- Package and Mounting — 256-LFBGA (supplier package: 256-CABGA, 14×14) surface-mount package optimized for dense board integration.
- Power and Voltage — Operates from 2.375 V to 3.465 V supply domains to match common system rails.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
- System Reliability and Testability — Features referenced in the family datasheet include IEEE 1149.1-compliant boundary scan and power-on-reset behavior to support testing and system bring-up.
Typical Applications
- Industrial Control & Monitoring — The industrial temperature range (−40 °C to 100 °C), 206 I/O and reprogrammable logic make the device suitable for control, I/O aggregation and monitoring functions.
- Interface Bridging and Glue Logic — Use the programmable I/O, hardened I²C/SPI IP and on-chip memory to implement protocol bridges, level adaptation and board-level glue logic.
- Embedded System Integration — Non-volatile, multi-time programmable configuration with on-chip oscillator and PLLs enables compact embedded designs requiring persistent logic and flexible clocking.
Unique Advantages
- Industrial-rated operation: Supports −40 °C to 100 °C to meet the environmental needs of industrial equipment and controls.
- High I/O count in a compact package: 206 I/O pins in a 256-LFBGA (14×14) footprint reduces external interface components and simplifies PCB routing.
- Non-volatile programmability: Multi-time programmable configuration keeps designs field-upgradable without external configuration memory.
- Integrated system functions: Hardened I²C/SPI and timers reduce the need for discrete supervisory components and simplify firmware complexity.
- Flexible power domains: 2.375 V to 3.465 V operating range enables compatibility with common board power rails.
- Test and reliability features: Boundary-scan support and documented power-on-reset behavior aid production test and system bring-up.
Why Choose LCMXO3LF-1300C-6BG256I?
The LCMXO3LF-1300C-6BG256I positions itself as a compact, industrial-grade MachXO3 FPGA option for designs that require persistent, reconfigurable logic, substantial I/O, and modest embedded memory. Its combination of 1,280 logic elements, 206 I/O pins, integrated system IP and industrial temperature rating makes it well suited for control, interface and embedded integration tasks where board space and reliability matter.
For design teams targeting scalable, field-updateable hardware with on-chip clocking, system IP and boundary-scan testability, this MachXO3 device offers a balanced set of capabilities to simplify BOM, reduce external components and support long-term maintainability.
If you would like pricing, availability or technical support for LCMXO3LF-1300C-6BG256I, request a quote or contact sales to discuss your requirements and obtain a formal quotation.

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