LCMXO3LF-1300E-5MG121I

The LCMXO3LF-1300E-5MG121I is a MachXO3 family FPGA offering a compact, surface-mount 121-VFBGA (121-CSFBGA, 6×6) package with 100 I/O pins. It provides 1,280 logic elements and 65,536 bits of embedded RAM, supporting programmable logic, on-chip memory, and flexible I/O for embedded and industrial designs.

Designed for industrial operating conditions (–40 °C to 100 °C) and a low-voltage core (1.14 V to 1.26 V), the device targets applications that require non-volatile, multi-time programmable logic with integrated peripheral functions and configurable clocking and I/O resources.

Key Features

• Core and Logic 1,280 logic elements provide reconfigurable programmable logic for glue logic, control paths, and custom state machines.
• Embedded Memory 65,536 bits of on-chip RAM (sysMEM/EBR) support single-, dual- and FIFO-style memory configurations for buffering and local storage.
• I/O and Packaging 100 I/O pins in a 121-VFBGA (121-CSFBGA, 6×6) surface-mount package deliver flexible interface options in a compact footprint.
• Non-volatile, Reconfigurable MachXO3 family features such as non-volatile multi-time programmability and TransFR reconfiguration allow field updates and persistent configuration.
• Embedded Peripherals and IP Hardened IP functions described in the family datasheet include I²C, SPI, and timer/counter blocks, plus on-chip oscillator and user flash memory (UFM) for system functions.
• Clocking and Timing Flexible on-chip clocking, including PLLs, supports a range of clock distribution and timing architectures.
• Power and Temperature Low-voltage supply range of 1.14 V to 1.26 V and industrial temperature grade (–40 °C to 100 °C) for deployment in temperature-demanding environments.
• Testing and Configuration Features Family-level features include IEEE 1149.1-compliant boundary scan, configuration and testing modes, and power-on-reset behavior as described in the MachXO3 family datasheet.

Typical Applications

• Industrial Control — Programmable control logic, interface bridging, and local decision-making in industrial automation and equipment.
• Interface Bridging & Glue Logic — Implement custom signal conditioning, protocol adaptation, and I/O aggregation where flexible I/O and on-chip memory are required.
• Embedded System I/O Expansion — Add application-specific peripherals, I/O management, and timing functions without large external logic blocks.
• Sensor and Peripheral Management — Local buffering and interfacing of sensors or peripheral devices using on-chip RAM and hardened serial/peripheral IP.

Unique Advantages

• Compact, high-density package: 121-VFBGA (6×6) package with 100 I/Os provides a small footprint for space-constrained boards.
• Non-volatile programmability: Multi-time programmable configuration enables field updates and persistent device behavior.
• Integrated peripherals: Hardened I²C, SPI, timers and on-chip oscillator reduce the need for some external components described in the datasheet.
• Flexible memory modes: Embedded RAM can be configured in single-, dual- or FIFO-style modes to match buffering and throughput requirements.
• Industrial temperature rating: Specified operation from –40 °C to 100 °C addresses a wide range of industrial environments.
• Low-voltage core: 1.14 V to 1.26 V supply range supports designs targeting low-voltage system domains.

Why Choose LCMXO3LF-1300E-5MG121I?

The LCMXO3LF-1300E-5MG121I positions itself as a compact, industrial-grade MachXO3 FPGA option for designs that need modest programmable logic capacity, embedded RAM, and a flexible I/O complement in a small BGA package. Its family-level features—non-volatile configuration, hardened peripheral IP, flexible clocking, and multiple memory modes—support a range of embedded control, interface, and sensor-management applications.

This device is suitable for engineers seeking a low-voltage, reconfigurable logic element with industrial temperature capability and integrated system-level features that can simplify board design and support field reconfiguration and evolving system requirements.

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