LCMXO3LF-1300C-6BG256C

The LCMXO3LF-1300C-6BG256C is a MachXO3 family FPGA offering a compact, non-volatile programmable logic solution with integrated memory and extensive I/O. Its flexible architecture and on-chip resources are designed to support interface, control and glue-logic tasks in commercial electronic designs.

Built in a 256-LFBGA (256-CABGA, 14×14) surface-mount package, the device provides 206 programmable I/Os, approximately 1,280 logic elements, and about 65,536 bits of embedded RAM. The device operates from a 2.375 V to 3.465 V supply and across a 0 °C to 85 °C commercial temperature range, and is RoHS compliant.

Key Features

• Core Logic  Approximately 1,280 logic elements (cells) for implementing custom glue logic, control paths and small-scale state machines.
• Embedded Memory  On-chip memory totaling 65,536 bits for frequently used data, FIFOs, or small buffers.
• I/O Density & Flexibility  206 programmable I/O pins in a 256-LFBGA package; datasheet documents pre‑engineered source‑synchronous I/O and flexible I/O buffer capabilities.
• Non-Volatile Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration for in-system updates.
• Embedded Hardened IP  Family-level documentation includes hardened I²C and SPI cores and timer/counter blocks for common peripheral interfaces (embedded IP availability is part of the MachXO3 family feature set).
• Clocking & Oscillator  On-chip oscillator and sysCLOCK PLL resources are included in the family architecture to support flexible clocking and timing control.
• Package & Electrical  256-LFBGA (256-CABGA 14×14) surface-mount package; supply voltage range 2.375 V to 3.465 V; commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Use the FPGA for glue logic, protocol bridging and I/O management where 206 I/Os and integrated memory simplify board-level design.
• Interface and Connectivity Modules  Leverage the device’s flexible I/O and programmable logic to implement custom interface functions and signal conditioning in compact form factors.
• Control and Timing Functions  Implement sequencers, timers and small control engines using the logic elements together with on-chip oscillator and PLL resources.
• Prototyping and Low-Volume Products  The multi-time programmable, non-volatile configuration supports iterative development and in-field updates for evolving product requirements.

Unique Advantages

• Compact high I/O density: 206 programmable I/Os in a 14×14 256-LFBGA package reduce PCB routing complexity for dense connector or peripheral interfaces.
• Integrated logic and RAM: Approximately 1,280 logic elements with about 65,536 bits of embedded memory minimizes external component needs for small buffering and control tasks.
• Non-volatile, reprogrammable configuration: Multi-time programmable non-volatile configuration enables in-system updates and design iteration without external flash.
• On-chip peripheral IP and clocking: Hardened I/O-related IP blocks and built-in oscillator/PLL options simplify common interface and timing implementations.
• Commercial-ready electrical envelope: Wide supply voltage support (2.375 V–3.465 V) and 0 °C–85 °C operating range fit typical commercial electronics requirements.
• RoHS compliant: Aligns with common environmental and manufacturing requirements.

Why Choose LCMXO3LF-1300C-6BG256C?

The LCMXO3LF-1300C-6BG256C positions itself as a flexible, compact FPGA solution for commercial embedded designs that require moderate logic density, substantial I/O, and integrated memory. Its MachXO3 family architecture provides non-volatile, reprogrammable configuration, embedded peripheral IP options and built-in clocking resources, enabling designers to reduce BOM count and accelerate time-to-market.

This part is well suited to engineers and product teams building commercial electronics that need programmable glue logic, interface bridging, or small control functions in a space-constrained package, with the ability to update firmware in-system and rely on documented family-level features for system integration.

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