LCMXO3LF-1300E-5MG256C

The LCMXO3LF-1300E-5MG256C is a MachXO3 family Field Programmable Gate Array (FPGA) designed for compact, reconfigurable logic and system integration. It combines approximately 1,280 logic elements organized across 160 logic blocks with embedded memory and a large, flexible I/O count for interfacing and control tasks.

Targeted at commercial-temperature applications, this device delivers non-volatile, multi-time programmable configuration and a range of on-chip resources—including hardened peripheral IP and programmable clocking—making it suitable for I/O bridging, sensor aggregation, and general-purpose system logic in space-constrained designs.

Key Features

• Core Logic  Approximately 1,280 logic elements arranged in 160 logic array blocks for implementing custom combinational and sequential logic.
• Embedded Memory  Approximately 64 Kbits of total RAM (65,536 bits) for LUTs, FIFOs, and small data buffers.
• I/O Density & Flexibility  206 programmable I/O pins with high-performance, flexible I/O buffering and pre-engineered source-synchronous I/O support for robust interfacing.
• Non-volatile Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capability for field updates.
• Hardened On-chip IP  Includes embedded hardened IP blocks such as I²C, SPI, timers/counters and User Flash Memory (UFM) to reduce external BOM and simplify designs.
• Clocking & Timing  On-chip sysCLOCK PLLs and flexible clock distribution for synchronized system timing and source-synchronous interfaces.
• Power  Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V and on-chip power-saving options and standby modes referenced in the MachXO3 documentation.
• Package & Mounting  256-VFBGA (256-CSFBGA supplier package, 9×9) surface-mount package optimized for compact board layouts.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant.

Typical Applications

• Sensor Hubs and Aggregation  Use the device’s hardened I²C/SPI IP and abundant I/Os to consolidate sensor data and handle front-end preprocessing.
• I/O Expansion and Glue Logic  Implement interface translation, bus bridging, and custom I/O sequencing leveraging 206 programmable I/Os and flexible buffering.
• Human-Machine Interfaces  Drive and manage display controllers, keypad matrices, and status indicators with on-chip logic and memory resources.
• Embedded Control and Timing  Take advantage of on-chip timers/counters and PLLs to implement deterministic control functions and synchronized timing paths.

Unique Advantages

• Compact, high-I/O solution: 206 I/Os in a 256-VFBGA package enable dense connectivity in small PCB footprints.
• Integrated hardened IP: Built-in I²C, SPI and timer/counter blocks reduce external components and speed development.
• Non-volatile, field-updateable configuration: Multi-time programmable configuration and TransFR reconfiguration simplify firmware and hardware iteration cycles.
• Balanced logic and memory: 1,280 logic elements paired with ~64 Kbits of RAM support moderate-complexity control, buffering, and glue-logic tasks without large external memory.
• Low-voltage core operation: 1.14 V–1.26 V supply range supports modern low-voltage system architectures and power-optimized designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C for standard commercial deployments and environments.

Why Choose LCMXO3LF-1300E-5MG256C?

The LCMXO3LF-1300E-5MG256C positions itself as a versatile, compact FPGA option within the MachXO3 family—combining non-volatile, reprogrammable logic with hardened peripheral IP and flexible I/O in a space-efficient 256-VFBGA package. Its mix of approximately 1,280 logic elements, about 64 Kbits of embedded RAM, and 206 I/Os makes it well suited to designers who need on-board glue logic, sensor interfacing, or control functionality without large external device counts.

This device is appropriate for commercial-temperature designs that require field-updateable configuration and integrated peripherals to reduce BOM and shorten development time. The MachXO3 family documentation highlights on-chip clocking, memory modes, and power-saving options that support scalable, maintainable designs backed by Lattice’s device architecture.

Request a quote or submit an inquiry to get pricing and availability for LCMXO3LF-1300E-5MG256C and to discuss how it fits into your next design.