LCMXO3LF-1300E-5UWG36CTR50
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 28 65536 1280 36-UFBGA, WLCSP |
|---|---|
| Quantity | 1,185 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-WLCSP (2.54x2.59) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-UFBGA, WLCSP | Number of I/O | 28 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3LF-1300E-5UWG36CTR50 – MachXO3 FPGA, 1,280 logic elements, 65,536-bit embedded RAM, 36‑WLCSP
The LCMXO3LF-1300E-5UWG36CTR50 is a MachXO3 family Field Programmable Gate Array (FPGA) in a compact 36‑WLCSP package. It provides a non-volatile, multi-time programmable FPGA architecture with on-chip memory and hardened peripherals suitable for low-pin-count control, interface and glue-logic functions.
With 1,280 logic elements, 65,536 bits of embedded RAM and 28 user I/Os, this commercial‑grade device targets space-constrained designs that require a small-footprint, low-voltage programmable logic element. The device is RoHS compliant and specified for surface-mount assembly.
Key Features
- Core Logic 1,280 logic elements provide the programmable fabric needed for control, glue logic and small state machines.
- Embedded Memory 65,536 bits of on-chip RAM enable local buffering, small FIFOs and microcode storage without external memory.
- I/O Count and Flexibility 28 general-purpose I/Os support peripheral interfacing and signal routing in compact systems.
- Package & Mounting 36‑UFBGA WLCSP (2.54 × 2.59 mm) surface-mount package minimizes board area while delivering a robust solderable footprint.
- Low‑Voltage Operation Supports supply voltages from 1.14 V to 1.26 V to match low-voltage system rails.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial electronics applications.
- Non‑volatile, Multi‑time Programmable Family-level capability for non-volatile configuration and multiple reprogramming cycles.
- Embedded Hardened IP Family-level hardened IP functions include I²C, SPI and timer/counter cores for common peripheral tasks.
- Clocking and Timing Family documentation includes on-chip oscillators and sysCLOCK PLL options for flexible on-chip clock generation and distribution.
- Configuration & Test Support Family-level features provide device configuration options and IEEE 1149.1-compliant boundary-scan testability.
- RoHS Compliant Device is compliant with RoHS requirements for lead-free assembly.
Typical Applications
- Interface Bridging and Glue Logic Use the 28 I/Os and 1,280 logic elements to implement protocol adaptation, signal conditioning and board-level glue without adding discrete components.
- Peripheral Control Implement peripheral state machines, timers and SPI/I²C interfacing using embedded hardened IP and on-chip RAM for small buffers.
- Compact Embedded Systems The 36‑WLCSP package and low-voltage supply make the device suitable for space-constrained modules requiring reprogrammable logic.
Unique Advantages
- Non‑volatile configuration: Retain programmed functionality without external configuration memory, simplifying BOM and boot behavior.
- Hardened peripheral IP: Built-in I²C, SPI and timer/counter blocks reduce the need for additional components and accelerate development.
- Small footprint packaging: 36‑WLCSP (2.54 × 2.59 mm) saves PCB area for compact designs and modules.
- Low-voltage compatibility: Operation from 1.14 V to 1.26 V supports integration with modern low-voltage system rails.
- On-chip memory for buffering: 65,536 bits of embedded RAM enable local data storage and FIFO implementations without external RAM.
- Commercial temperature support: Rated 0 °C to 85 °C for standard commercial applications and environments.
Why Choose LCMXO3LF-1300E-5UWG36CTR50?
This MachXO3 FPGA balances compact packaging, non-volatile configuration and a set of embedded peripherals to address small to medium control and interface tasks. With 1,280 logic elements, 65,536 bits of on-chip RAM and dedicated IP blocks, it simplifies designs that need programmable logic without large board area or external configuration memory.
The device is well suited to engineers building space-constrained modules, peripheral controllers and board‑level glue logic in commercial temperature environments. Its low-voltage operation and RoHS compliance help meet modern system design and manufacturing requirements while leveraging family-level capabilities described in the MachXO3 documentation.
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