LCMXO3LF-1300E-5UWG36CTR50

IC FPGA 28 I/O 36WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 28 65536 1280 36-UFBGA, WLCSP

Quantity 1,185 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package36-WLCSP (2.54x2.59)GradeCommercialOperating Temperature0°C – 85°C
Package / Case36-UFBGA, WLCSPNumber of I/O28Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3LF-1300E-5UWG36CTR50 – MachXO3 FPGA, 1,280 logic elements, 65,536-bit embedded RAM, 36‑WLCSP

The LCMXO3LF-1300E-5UWG36CTR50 is a MachXO3 family Field Programmable Gate Array (FPGA) in a compact 36‑WLCSP package. It provides a non-volatile, multi-time programmable FPGA architecture with on-chip memory and hardened peripherals suitable for low-pin-count control, interface and glue-logic functions.

With 1,280 logic elements, 65,536 bits of embedded RAM and 28 user I/Os, this commercial‑grade device targets space-constrained designs that require a small-footprint, low-voltage programmable logic element. The device is RoHS compliant and specified for surface-mount assembly.

Key Features

  • Core Logic  1,280 logic elements provide the programmable fabric needed for control, glue logic and small state machines.
  • Embedded Memory  65,536 bits of on-chip RAM enable local buffering, small FIFOs and microcode storage without external memory.
  • I/O Count and Flexibility  28 general-purpose I/Os support peripheral interfacing and signal routing in compact systems.
  • Package & Mounting  36‑UFBGA WLCSP (2.54 × 2.59 mm) surface-mount package minimizes board area while delivering a robust solderable footprint.
  • Low‑Voltage Operation  Supports supply voltages from 1.14 V to 1.26 V to match low-voltage system rails.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial electronics applications.
  • Non‑volatile, Multi‑time Programmable  Family-level capability for non-volatile configuration and multiple reprogramming cycles.
  • Embedded Hardened IP  Family-level hardened IP functions include I²C, SPI and timer/counter cores for common peripheral tasks.
  • Clocking and Timing  Family documentation includes on-chip oscillators and sysCLOCK PLL options for flexible on-chip clock generation and distribution.
  • Configuration & Test Support  Family-level features provide device configuration options and IEEE 1149.1-compliant boundary-scan testability.
  • RoHS Compliant  Device is compliant with RoHS requirements for lead-free assembly.

Typical Applications

  • Interface Bridging and Glue Logic  Use the 28 I/Os and 1,280 logic elements to implement protocol adaptation, signal conditioning and board-level glue without adding discrete components.
  • Peripheral Control  Implement peripheral state machines, timers and SPI/I²C interfacing using embedded hardened IP and on-chip RAM for small buffers.
  • Compact Embedded Systems  The 36‑WLCSP package and low-voltage supply make the device suitable for space-constrained modules requiring reprogrammable logic.

Unique Advantages

  • Non‑volatile configuration: Retain programmed functionality without external configuration memory, simplifying BOM and boot behavior.
  • Hardened peripheral IP: Built-in I²C, SPI and timer/counter blocks reduce the need for additional components and accelerate development.
  • Small footprint packaging: 36‑WLCSP (2.54 × 2.59 mm) saves PCB area for compact designs and modules.
  • Low-voltage compatibility: Operation from 1.14 V to 1.26 V supports integration with modern low-voltage system rails.
  • On-chip memory for buffering: 65,536 bits of embedded RAM enable local data storage and FIFO implementations without external RAM.
  • Commercial temperature support: Rated 0 °C to 85 °C for standard commercial applications and environments.

Why Choose LCMXO3LF-1300E-5UWG36CTR50?

This MachXO3 FPGA balances compact packaging, non-volatile configuration and a set of embedded peripherals to address small to medium control and interface tasks. With 1,280 logic elements, 65,536 bits of on-chip RAM and dedicated IP blocks, it simplifies designs that need programmable logic without large board area or external configuration memory.

The device is well suited to engineers building space-constrained modules, peripheral controllers and board‑level glue logic in commercial temperature environments. Its low-voltage operation and RoHS compliance help meet modern system design and manufacturing requirements while leveraging family-level capabilities described in the MachXO3 documentation.

Request a quote or submit an inquiry for LCMXO3LF-1300E-5UWG36CTR50 to get pricing, availability and lead‑time information.

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