LCMXO3LF-1300E-5UWG36ITR50
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 28 65536 1280 36-UFBGA, WLCSP |
|---|---|
| Quantity | 522 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-WLCSP (2.54x2.59) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-UFBGA, WLCSP | Number of I/O | 28 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3LF-1300E-5UWG36ITR50 – MachXO3LF FPGA, 1,280 logic elements, 36‑WLCSP
The LCMXO3LF-1300E-5UWG36ITR50 is a MachXO3 Field Programmable Gate Array (FPGA) offered in a compact 36‑WLCSP package. This industrial‑grade, surface‑mount device delivers 1,280 logic elements, approximately 64 Kbits of embedded RAM, and 28 general I/O pins in a 2.54 × 2.59 mm package footprint.
Built on the MachXO3 family architecture, the device includes non‑volatile, multi‑time programmable configuration, on‑chip clocking and PLLs, hardened peripheral IP blocks, and power‑saving modes—making it suitable for control, peripheral bridging, and I/O consolidation tasks in industrial systems.
Key Features
- Logic Capacity — 1,280 logic elements suitable for low‑to‑mid density programmable logic functions and glue‑logic integration.
- Embedded Memory — 65,536 total RAM bits (approximately 64 Kbits) for small on‑chip buffers, state storage, and FIFOs.
- I/O and Packaging — 28 I/O pins in a 36‑WLCSP (2.54 × 2.59 mm) package; surface mount package optimized for compact board layouts.
- Industrial Grade — Specified operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
- Power Supply — Core supply range 1.14 V to 1.26 V, supporting typical MachXO3LF power domains.
- Non‑volatile, Multi‑time Programmable Configuration — Built‑in non‑volatile configuration memory enabling multi‑time reprogramming without external configuration flash.
- Clocking and Timing — On‑chip oscillator and sysCLOCK PLLs for flexible on‑chip clock generation and distribution.
- Hardened Peripheral IP — Embedded hardened I2C, SPI and timer/counter IP cores for common system interfaces and timing functions.
- Power Management — Standby mode and power‑saving options for low power operation and system-level power control.
- System and Test Support — Features for device configuration, boundary scan testability and system trace (as detailed in the MachXO3 family documentation).
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Industrial Control — Logic consolidation, peripheral interfacing and small control tasks in industrial systems that require operation across −40 °C to 100 °C.
- Sensor and Peripheral Bridging — Use embedded I2C and SPI IP to interface sensors and serial peripherals while handling protocol glue logic on the FPGA fabric.
- User Interface and Control Panels — Implement button handling, LED drivers and simple UI logic using available I/O and on‑chip memory for state and debouncing logic.
- System Glue Logic — Replace discrete components by centralizing glue logic, clock management and simple state machines within the FPGA fabric and UFM.
Unique Advantages
- Compact, Low‑profile Package: 36‑WLCSP (2.54 × 2.59 mm) provides a very small PCB footprint for space‑constrained designs.
- Non‑volatile Reconfiguration: Multi‑time programmable configuration removes the need for external configuration memory in many applications.
- Integrated Peripheral IP: Hardened I2C, SPI and timer/counter blocks reduce FPGA fabric usage and simplify firmware development.
- Industrial Temperature Range: −40 °C to 100 °C rating supports reliable operation in broad industrial conditions.
- Flexible Clocking: On‑chip oscillator and PLLs enable internal clock generation and distribution without additional clock ICs.
- Low BOM Impact: Combining logic, memory and common serial interfaces into one device reduces component count and board complexity.
Why Choose LCMXO3LF-1300E-5UWG36ITR50?
This MachXO3LF part positions itself as a compact, industrial‑grade programmable logic device for designs that need moderate logic capacity, small embedded memory, and integrated serial/peripheral IP in a minimal footprint. Its non‑volatile configuration, flexible clocking, and standby/power‑saving features make it suitable for consolidating glue logic, handling peripheral interfaces, and implementing simple control and UI functions without external configuration or large supporting circuitry.
Engineers seeking a small, RoHS‑compliant FPGA with hardened interface blocks and industrial temperature support will find this device a practical option for reducing BOM complexity while retaining reprogrammability and system‑level flexibility.
Request a quote or submit an inquiry to obtain pricing, availability, and order information for the LCMXO3LF-1300E-5UWG36ITR50.
