LCMXO3LF-1300E-6MG121I

IC FPGA 100 I/O 121CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 100 65536 1280 121-VFBGA, CSPBGA

Quantity 939 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package121-CSFBGA (6x6)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case121-VFBGA, CSPBGANumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3LF-1300E-6MG121I – MachXO3 Field Programmable Gate Array (FPGA), 100 I/Os, 1280 logic elements, 65,536 bits RAM, 121‑VFBGA

The LCMXO3LF-1300E-6MG121I is a MachXO3 family FPGA IC that provides a compact, non-volatile, multi-time programmable logic solution for industrial designs. Built with 1,280 logic elements and approximately 65,536 bits of embedded RAM, this device targets control, interface and glue‑logic roles where on-chip memory, flexible I/O and industrial temperature range are required.

Key architectural highlights from the MachXO3 family include on-chip clocking with PLLs, pre‑engineered source‑synchronous I/O, hardened peripheral IP (I²C, SPI, timers), and user flash memory (UFM), enabling integration of control and interface functions into a single surface‑mount package.

Key Features

  • Core Logic  1,280 logic elements provide programmable logic resources suitable for glue logic, control finite‑state machines and small to medium control functions.
  • Embedded Memory  Approximately 65,536 bits of on‑chip RAM for frame buffers, FIFOs or small data stores.
  • I/O  100 programmable I/O pins with pre‑engineered source‑synchronous I/O support for reliable interfacing to external devices.
  • Non‑volatile, Multi‑time Programmable  MachXO3 family architecture supports non‑volatile, multi‑time programming for persistent configuration without external configuration memory.
  • Clocking and Timing  Flexible on‑chip clocking including sysCLOCK PLLs for clock generation and synchronization across logic and I/O.
  • Hardened IP  Embedded hardened I²C and SPI cores plus timer/counter blocks reduce design overhead and speed integration of common peripherals.
  • User Flash and Configuration  User Flash Memory (UFM) and TransFR reconfiguration features from the MachXO3 family enable in‑system storage and reconfiguration options.
  • Package and Mounting  121‑VFBGA (CSPBGA) package, supplier device package 121‑CSFBGA (6×6), surface‑mount mounting for compact board implementation.
  • Power  Supported supply voltage range: 1.14 V to 1.26 V for core power domains.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for industrial applications.
  • Manufacturing and Test  IEEE 1149.1‑compliant boundary scan and built‑in configuration/test features as described in the MachXO3 family datasheet.

Typical Applications

  • Industrial Control  Implement control logic, protocol bridging and timing functions that must operate across −40 °C to 100 °C.
  • Peripheral and Interface Glue Logic  Replace multiple discrete devices by consolidating bus interfaces, level translation control and simple protocol converters into a single FPGA.
  • Embedded System Management  Use on‑chip UFM, timers and hardened I/O IP to manage board-level monitoring, configuration and subsystem coordination.
  • Communications & Timing  Leverage flexible on‑chip PLLs and source‑synchronous I/O to implement timing alignment, deskew and interface timing blocks.

Unique Advantages

  • Non‑volatile configuration: Retains programmed functionality without external configuration memory, simplifying BOM and board design.
  • Integrated peripheral IP: Hardened I²C, SPI and timer cores reduce firmware and logic development time for common interfaces.
  • Compact BGA package: 121‑VFBGA (6×6) surface‑mount package delivers a small footprint for space‑constrained boards.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
  • Flexible clocking and I/O: On‑chip PLLs and source‑synchronous I/O enable robust interfacing and timing solutions for system integration.

Why Choose LCMXO3LF-1300E-6MG121I?

The LCMXO3LF-1300E-6MG121I positions itself as a compact, industrial‑grade FPGA option for designs that require non‑volatile configuration, embedded memory and a balanced mix of logic and I/O resources. Its MachXO3 family capabilities—such as hardened peripheral IP, flexible on‑chip clocking and UFM—help reduce external components and accelerate time to market.

This device is well suited to engineers building control, interface and system management functions who need a programmable, surface‑mount solution with clearly specified supply and thermal operating ranges. The combination of logic elements, embedded RAM and industrial temperature rating provides predictable performance for long‑life industrial applications.

If you would like pricing, lead time or availability, request a quote or submit a product inquiry to receive a formal response and technical support for procurement and design planning.

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