LCMXO3LF-2100C-5BG256C

The LCMXO3LF-2100C-5BG256C is a MachXO3-family Field Programmable Gate Array (FPGA) offered in a 256-LFBGA package for surface-mount assembly. It combines a compact logic fabric with on-chip embedded memory and high pin-count I/O to support commercial embedded designs that require flexible glue logic, interface control, and system-level integration.

Designed for commercial temperature operation (0 °C to 85 °C) and RoHS-compliant manufacturing, this device provides non-volatile, multi-time programmable configuration and a mix of hardened IP and programmable I/O and clocking resources to simplify system design and reduce external component count.

Key Features

• Core Logic 2,112 logic elements provide programmable combinational and sequential resources for glue logic, control functions, and small to medium-scale finite-state machines.
• Embedded Memory Approximately 0.076 Mbits (75,776 bits) of on-chip RAM with flexible modes including single, dual and pseudo-dual port operation and FIFO configuration as described in the MachXO3 family architecture.
• I/O Capacity and Flexibility 206 user I/O pins support high fanout interface applications. The family includes pre‑engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture for reliable signal interfacing.
• Clocking and Timing Integrated clocking resources including on-chip oscillator and system PLLs enable flexible on-chip clock generation and distribution for synchronous designs.
• Hardened Embedded IP Embedded hardened IP blocks such as I²C, SPI and timer/counter blocks are available to offload common peripheral functions from the programmable fabric.
• Non-volatile Configuration and UFM Multi-time programmable non-volatile configuration with User Flash Memory (UFM) supports stored data and reconfiguration workflows.
• Power and Supply Range Voltage supply range of 2.375 V to 3.465 V to accommodate a variety of system rails and I/O standards.
• Package and Mounting 256-LFBGA package (supplier device package: 256-CABGA, 14×14) in a surface-mount form factor for compact board-level integration.
• Commercial Grade and Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS-compliant material status suitable for general embedded and consumer applications.

Typical Applications

• Interface Bridging and Glue Logic Use the programmable fabric and abundant I/O to implement protocol adapters, bus bridges, and board-level glue logic without adding discrete logic chips.
• Embedded Control and System Management Combine logic elements, timers, and hardened SPI/I²C blocks to implement configuration, control and monitoring functions within embedded systems.
• Configuration and Reconfiguration Tasks Non-volatile, multi-time programmable configuration and User Flash Memory (UFM) enable in-field updates and stored configuration data for system customization.

Unique Advantages

• Compact, high‑I/O integration: 206 I/O pins in a 256-LFBGA package provide dense interface capability while keeping PCB area and BOM count low.
• Programmable logic with embedded memory: 2,112 logic elements paired with approximately 0.076 Mbits of embedded RAM enable flexible implementation of control logic and small data buffers without external SRAM.
• On-board hardened peripherals: Built-in I²C, SPI and timer/counter IP reduce development effort and offload common functions from the programmable fabric.
• Flexible clocking and reconfiguration: Integrated PLLs and on-chip oscillator plus multi-time programmable configuration support robust clocking strategies and field updates.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant construction for general-purpose embedded and consumer products.
• Low integration overhead: Surface-mount 256-LFBGA (14×14) package simplifies board-level assembly and streamlines mechanical design.

Why Choose LCMXO3LF-2100C-5BG256C?

The LCMXO3LF-2100C-5BG256C delivers a balanced mix of programmable logic, embedded memory, and high I/O density in a compact surface-mount package for commercial embedded applications. Its MachXO3-family architecture provides flexible clocking, on-chip hardened peripherals, and non-volatile multi-time programmable configuration for adaptable system-level integration.

This part is well suited to designers seeking to consolidate interface logic, implement configuration and control functions, and reduce external component count while maintaining commercial-grade operating ranges and RoHS compliance. The combination of logic elements, embedded RAM, and integrated IP supports rapid development and reliable deployment in a variety of board-level designs.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO3LF-2100C-5BG256C. Our team can assist with lead times and purchasing options to support your project schedule.