LCMXO3LF-2100C-5BG324C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 279 75776 2112 324-LFBGA |
|---|---|
| Quantity | 784 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CABGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 279 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3LF-2100C-5BG324C – MachXO3 FPGA, 324-LFBGA
The LCMXO3LF-2100C-5BG324C is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a non-volatile, multi-time programmable logic fabric with embedded system features and a high-density I/O complement for commercial electronic designs.
With 2,112 logic elements, approximately 75.8 Kbits of on-chip RAM, and 279 user I/O, this device targets commercial applications that require moderate logic capacity, extensive I/O, and flexible on-chip peripherals. Package and power specifications support surface-mount integration in a 324-LFBGA (15×15) footprint with a 2.375 V to 3.465 V supply and 0 °C to 85 °C operating range.
Key Features
- Core Logic 2,112 logic elements provide mid-density programmable logic for glue logic, control functions, and custom combinational/sequential logic blocks.
- Embedded Memory Approximately 75.8 Kbits of on-chip RAM (sysMEM) for data buffering, small FIFOs, and local storage with support for single, dual and FIFO memory modes as documented in the MachXO3 family datasheet.
- High I/O Count 279 user I/O pins and flexible I/O buffer architecture for source-synchronous interfaces and varied signaling requirements.
- Non-volatile, Reprogrammable Configuration Multi-time programmable non-volatile configuration with TransFR reconfiguration support, enabling field updates and in-system reconfiguration as described in the MachXO3 family documentation.
- On-chip Peripherals and IP Hardened IP functions include I²C and SPI cores, timer/counter blocks, on-chip oscillator, and user flash memory (UFM) to simplify common peripheral and control tasks.
- Clocking and Timing Flexible on-chip clocking resources including PLLs and a distributed clock/control network to support varied clocking architectures.
- Package & Mounting 324-LFBGA (324-CABGA, 15×15) surface-mount package suitable for compact board implementations.
- Power & Environmental Supported supply voltage range of 2.375 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C. RoHS compliant.
Typical Applications
- Commercial System Control — Implement control and glue-logic functions in commercial equipment using the device's 2,112 logic elements and on-chip peripherals.
- I/O Bridging and Interface Adaptation — Use the 279 I/O pins and high-performance I/O buffer architecture for interface translation and signal routing between subsystems.
- Peripheral Management — Leverage hardened I²C and SPI IP cores, timer/counter resources, and UFM for embedded peripheral control and firmware storage.
- Prototyping and Low-cost FPGA Solutions — Non-volatile, multi-time programmable configuration and a compact 324-LFBGA package make this device suitable for commercial prototyping and production designs that require reprogrammability.
Unique Advantages
- High I/O density: 279 user I/O pins enable flexible system interconnect and minimize external buffering or level-shifting components.
- Mid-density programmable logic: 2,112 logic elements provide sufficient capacity for glue logic, control, and moderate custom logic without overprovisioning.
- Embedded peripherals reduce BOM: Hardened I²C, SPI, timers, and on-chip oscillator reduce the need for discrete peripheral controllers.
- Non-volatile, field-update capable: Multi-time programmable non-volatile configuration with TransFR support enables in-system updates and reliable startup without external configuration memory.
- Compact surface-mount package: 324-LFBGA (15×15) footprint supports dense PCB layouts while preserving a large I/O count.
- Commercial temperature and flexible power: 0 °C to 85 °C operating range and a supply range of 2.375 V to 3.465 V accommodate a wide range of commercial designs.
Why Choose LCMXO3LF-2100C-5BG324C?
The LCMXO3LF-2100C-5BG324C is positioned for commercial designs that need moderate programmable logic, extensive I/O, and integrated peripheral IP while maintaining a compact board footprint. As a MachXO3 family device, it combines reprogrammable non-volatile configuration with on-chip memory, hardened interfaces, and flexible clocking documented in the MachXO3 datasheet.
This device suits engineering teams and procurement looking for a commercially graded FPGA option from Lattice Semiconductor Corporation that balances integration, reprogrammability, and I/O density for control, interface, and peripheral-management roles in commercial equipment.
Request a quote or submit a sales inquiry to obtain pricing, lead time, and availability for the LCMXO3LF-2100C-5BG324C.

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