LCMXO3LF-2100C-6BG324C

The LCMXO3LF-2100C-6BG324C is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a compact, surface-mount programmable logic solution with on-chip memory and a broad I/O count for system control, interface bridging and peripheral integration.

Key hardware characteristics include 2,112 logic elements, approximately 75,776 bits of embedded RAM, 279 user I/O, a 324-LFBGA (15×15) package, a supply voltage range of 2.375 V to 3.465 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  2,112 logic elements suitable for glue logic, control state machines and small-to-midsize programmable functions.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM for data buffering, FIFOs or small tables.
• I/O Density and Flexibility  279 user I/O pins in a 324-LFBGA package enable broad peripheral connectivity and board-level signal routing.
• Programmable I/O and High-Performance Buffers  Datasheet-documented programmable I/O cells and flexible I/O buffer architecture support a variety of signaling and interfacing schemes.
• Clocking and Timing  Flexible on-chip clocking with sysCLOCK PLLs and an on-chip oscillator for system timing and clock generation.
• Embedded Hardened IP  Includes hardened IP functions noted in the family datasheet such as I2C, SPI and timer/counter blocks to simplify common system tasks.
• Non-volatile, Multi-time Programmable Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration as described in the datasheet.
• System-Level Features  User Flash Memory (UFM), standby/power-saving options and hot-socketing support are included in the family feature set referenced in the datasheet.
• Package & Mounting  324-CABGA (324-LFBGA, 15×15) surface-mount package suitable for compact PCB layouts; commercial grade, RoHS compliant.
• Power & Temperature  Operates from 2.375 V to 3.465 V with an ambient temperature range of 0 °C to 85 °C (commercial grade).

Typical Applications

• System Control and Glue Logic  Use the device’s 2,112 logic elements and abundant I/O to implement board-level control, protocol translation and custom state machines.
• Peripheral Interface and Bridge  High I/O count and programmable I/O buffers make the device suitable for bridging between sensors, serial peripherals and host processors.
• Embedded Data Buffering  On-chip RAM (approximately 75,776 bits) supports FIFO buffers, small data stores and temporary packet buffering for interface pipelines.
• Timing and Event Control  Integrated clocking resources, PLLs and onboard timer/counter IP allow precise timing, clock generation and event sequencing.

Unique Advantages

• Compact, High-Density I/O: 279 I/O in a 324-LFBGA package provides extensive connectivity without a large board footprint.
• Programmable System Integration: 2,112 logic elements and embedded IP reduce external components by implementing glue logic, protocol handling and control functions on-chip.
• On-Chip Memory: Approximately 75,776 bits of embedded RAM enable onboard buffering and data handling, simplifying system architecture.
• Non-volatile Configuration: Multi-time programmable non-volatile configuration supports field updates and in-system reconfiguration strategies described by the MachXO3 family.
• Flexible Clocking and Timing: sysCLOCK PLLs and an on-chip oscillator provide integrated timing options for synchronized interfaces and local clock generation.
• Commercial-Grade, RoHS Compliant: Designed for commercial applications with RoHS compliance and defined operating voltage and temperature ranges for predictable integration.

Why Choose LCMXO3LF-2100C-6BG324C?

The LCMXO3LF-2100C-6BG324C positions itself as a compact, flexible FPGA option for designers needing moderate logic capacity, substantial I/O and embedded memory in a surface-mount 324-LFBGA package. Its MachXO3 family capabilities—non-volatile configuration, embedded IP blocks, flexible I/O and integrated clocking—enable consolidation of glue logic, peripheral interfaces and timing functions into a single device.

This part is well suited for commercial electronic systems where board space, I/O count and in-field reprogrammability matter. The combination of logic resources, on-chip RAM and family-level system features supports scalable designs and straightforward integration with existing boards and components.

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