LCMXO3LF-2100E-5MG256C

The LCMXO3LF-2100E-5MG256C is a MachXO3 family field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It integrates 2,112 logic elements, approximately 75,776 bits of embedded RAM, and up to 206 I/O pins in a compact 256‑VFBGA (CSPBGA) package, delivering a flexible, non-volatile programmable fabric for control, glue-logic and I/O-centric designs.

Designed for commercial-grade systems, the device operates from a 1.14 V to 1.26 V core supply and across a 0 °C to 85 °C temperature range, making it suitable for a wide range of surface-mount embedded applications that require reconfigurable logic and memory with a small footprint.

Key Features

• Core Logic — 2,112 logic elements and 264 logic blocks (device specification) provide programmable logic capacity for glue logic, protocol adaptation and small to medium FPGA tasks.
• Embedded Memory — 75,776 bits of on-chip RAM (sysMEM) suitable for FIFOs, small buffers and state storage; supports single, dual, pseudo-dual port and FIFO modes as described in the family datasheet.
• I/O Capacity & Flexibility — Up to 206 I/O pins with a flexible I/O buffer architecture and support for pre‑engineered source-synchronous I/O and multiple I/O standards (per family datasheet).
• Clocking & Timing — Integrated clock distribution with PLL support (sysCLOCK PLLs) and flexible on-chip clocking options to manage system timing and clock domains.
• Configuration & Non‑Volatility — Non-volatile, multi‑time programmable configuration and TransFR reconfiguration features (MachXO3 family), enabling field updates and configuration management.
• Embedded IP & Peripherals — Family-level hardened IP blocks including I²C, SPI and timer/counter functions to reduce external component count and simplify common system interfaces.
• Package & Mounting — 256‑VFBGA (CSPBGA) surface-mount package; supplier package listed as 256‑CSFBGA (9×9), optimized for space-constrained board designs.
• Power & Environmental — Core voltage range 1.14 V to 1.26 V; commercial-grade operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the device’s flexible I/O and 206 I/O pins to implement custom protocol bridges, timing adaptation and system glue without large external logic arrays.
• Embedded Control and State Machines — Leverage 2,112 logic elements and on-chip RAM to implement control logic, finite-state machines and small data buffering within constrained system designs.
• Peripheral Aggregation and Protocol Conversion — Hardened I/O functions and embedded peripherals simplify aggregation of sensors, serial peripherals and other subsystems while reducing BOM complexity.

Unique Advantages

• Compact, high‑I/O footprint: 206 available I/Os in a 256‑VFBGA package lets you consolidate functions in a small PCB area.
• Non‑volatile programmability: Multi‑time programmable configuration supports in‑field updates and simplifies system provisioning without external configuration memory.
• Integrated memory and peripherals: 75,776 bits of embedded RAM plus hardened IP (I²C, SPI, timers) reduce external components and accelerate development.
• Deterministic clocking: On-chip PLLs and a flexible clock distribution network enable precise timing control across multiple domains.
• Commercial-grade reliability: Specified for 0 °C to 85 °C operation with RoHS compliance for standard commercial applications.

Why Choose LCMXO3LF-2100E-5MG256C?

The LCMXO3LF-2100E-5MG256C positions itself as a balanced, compact FPGA solution for designs that need reconfigurable logic, moderate embedded memory and substantial I/O capacity in a small surface-mount package. Its MachXO3 family architecture provides configuration flexibility, on-chip peripherals and deterministic clocking options to streamline system design and reduce external component count.

This device is well suited for engineers and procurement teams targeting commercial embedded applications that require programmable control, interface consolidation and field-updatable logic. The combination of 2,112 logic elements, approximately 75,776 bits of embedded RAM and 206 I/O pins offers practical scalability and integration for a wide range of board-level designs.

Request a quote or submit a procurement inquiry to get pricing and availability for the LCMXO3LF-2100E-5MG256C.