LCMXO3LF-2100E-5MG121I

The LCMXO3LF-2100E-5MG121I is a member of the MachXO3 family of FPGAs from Lattice Semiconductor. This industrial-grade, non-volatile FPGA provides 2,112 logic elements, approximately 75.8 Kbits of embedded RAM, and up to 100 I/Os in a compact 121-ball VFBGA (6 × 6 mm) package.

Designed for board-level glue logic, interface bridging and system control in industrial environments, this device combines flexible programmable logic, on-chip memory and a range of embedded system features to support mid-density control and I/O-intensive applications within a -40 °C to 100 °C operating range.

Key Features

• Core Logic  2,112 logic elements suitable for mid-density control, glue logic and protocol bridging tasks.
• Embedded Memory  75,776 total RAM bits of on-chip memory for FIFOs, buffering and small data stores.
• I/O and Interface  Up to 100 I/Os with flexible programmable I/O cells and support for source-synchronous I/O architectures referenced in the MachXO3 family documentation.
• Non-volatile, Multi-time Programmable  MachXO3 family architecture provides non-volatile configuration and multi-time programmability for reconfiguration and field updates.
• Clocking and Timing  On-chip PLLs and flexible clock distribution options described in the MachXO3 family enable system-level clock management and synchronous interfaces.
• Embedded Hardened IP  Family-level features include hardened I²C and SPI IP cores plus timers/counters and user flash memory (UFM) as described in the MachXO3 documentation.
• Configuration & Reliability  TransFR reconfiguration, power-on-reset and IEEE 1149.1 boundary-scan testability are included in the MachXO3 family feature set for device configuration and board-level test.
• Power and Supply  Supported core voltage range of 1.14 V to 1.26 V for low-voltage system integration.
• Package & Mounting  121-ball VFBGA (121-CSFBGA, 6 × 6 mm) surface-mount package suitable for compact board designs.
• Industrial Temperature Grade  Specified operating range from -40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic  Use the device’s flexible I/O and programmable logic to implement protocol translation, bus bridging and board-level glue functions.
• Industrial Control and Sequencing  Industrial operating temperature and mid-density logic capacity make it suitable for control state machines, sequencing and interface aggregation in industrial equipment.
• Peripheral Aggregation  Consolidate multiple peripheral interfaces and small buffering functions using embedded RAM and the hardened I²C/SPI IP available in the MachXO3 family.

Unique Advantages

• Mid-density FPGA with On-chip Memory: 2,112 logic elements and 75,776 bits of embedded RAM provide an integrated solution for control and buffering without external memory.
• Compact, Production-ready Package: The 121-ball VFBGA (6 × 6 mm) package enables dense board layouts while delivering up to 100 I/Os for versatile system connectivity.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to meet the thermal demands of industrial applications and outdoor equipment.
• Low-voltage Core Compatibility: Core supply range of 1.14 V to 1.26 V simplifies integration with modern low-voltage rails.
• Built-in System IP and Configuration Features: Family-level hardened IP (I²C, SPI, timers), UFM, non-volatile configuration and reconfiguration features reduce design complexity and BOM count.
• RoHS Compliance: Environmentally compliant for modern manufacturing requirements.

Why Choose LCMXO3LF-2100E-5MG121I?

The LCMXO3LF-2100E-5MG121I delivers a compact, industrial-grade FPGA option with a balanced mix of logic capacity, embedded RAM and flexible I/O. It is a practical choice for designers who need mid-density programmable logic, on-chip memory for buffering and a small-footprint package for space-constrained boards.

As a MachXO3 family device, it benefits from family-level system features—non-volatile multi-time programmability, hardened peripheral IP and flexible clocking—providing a reliable, field-updateable platform for industrial control, interface bridging and peripheral aggregation designs.

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