LCMXO3LF-2100E-5MG324I

The LCMXO3LF-2100E-5MG324I is a MachXO3-series FPGA from Lattice Semiconductor Corporation. It combines a flexible FPGA fabric with embedded memory and on-chip configuration to support system control, I/O bridging and programmable logic functions.

Designed for industrial applications, the device provides 2112 logic elements, approximately 75,776 bits of embedded RAM, and 268 user I/Os in a 324‑VFBGA (324‑CSFBGA 10×10) package. The part supports non-volatile, multi-time programmability and on-chip clocking and configuration features described in the MachXO3 family datasheet.

Key Features

• Logic & Fabric  The device includes 2112 logic elements for implementing combinational and sequential logic functions within the MachXO3 architecture.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM (sysMEM) with support for RAM initialization, ROM mode and FIFO configurations as described for the MachXO3 family.
• I/O Capacity & Flexibility  Up to 268 user I/Os with pre‑engineered source‑synchronous I/O and a flexible on‑chip I/O buffer architecture for varied signaling needs.
• Clocking  Flexible on‑chip clocking including sysCLOCK Phase Locked Loops (PLLs) for system and interface clock management.
• Embedded Hardened IP  Includes hardened IP functions referenced in the MachXO3 family (for example, I²C and SPI cores, and timer/counter blocks) to accelerate common system interfaces.
• Non‑volatile Configuration  Multi‑time programmable, non‑volatile configuration and TransFR reconfiguration capability as part of the MachXO3 feature set.
• Package & Mounting  324‑VFBGA (supplier package listed as 324‑CSFBGA 10×10), surface‑mount mounting for compact board integration.
• Supply & Temperature  Nominal supply range of 1.14 V to 1.26 V and an industrial operating temperature range of −40 °C to 100 °C.
• Test & Reliability  Supports IEEE 1149.1‑compliant boundary scan and device configuration/test capabilities outlined in the MachXO3 datasheet.
• Regulatory  RoHS compliant.

Typical Applications

• System control and glue logic  Flexible logic elements, embedded RAM and timers enable on‑board control, state machines and glue logic between system components.
• I/O bridging and interface adaptation  Extensive I/O count and configurable I/O buffers support protocol bridging, level translation and custom interface mapping.
• Embedded peripheral offload  Hardened I/O cores (I²C, SPI) and timers help offload peripheral handling from the main processor and simplify firmware.
• Configuration and system monitoring  On‑chip non‑volatile configuration, boundary scan and clocking resources support robust system bring‑up and in‑field reconfiguration workflows.

Unique Advantages

• High I/O density: 268 user I/Os provide the pin count needed for complex interface and board‑level signal routing without adding external logic.
• Integrated memory and IP: Approximately 75,776 bits of embedded RAM plus hardened IP functions reduce external component count and speed development.
• Industrial temperature range: Rated for −40 °C to 100 °C, enabling deployment in industrial environments that require extended thermal tolerance.
• Compact, robust packaging: 324‑VFBGA (324‑CSFBGA 10×10) surface‑mount package balances I/O density and board space for compact designs.
• On‑chip clocking and configuration: Built‑in PLLs, non‑volatile configuration and reconfiguration capability simplify system timing and firmware update strategies.
• Standards and testability: Boundary scan support and MachXO3 family test/configuration features facilitate manufacturing test and in‑system diagnostics.

Why Choose LCMXO3LF-2100E-5MG324I?

The LCMXO3LF-2100E-5MG324I offers a balanced combination of programmable logic, embedded memory and abundant I/O in an industrial‑rated MachXO3 family device. Its non‑volatile configuration model and family‑level features such as on‑chip PLLs, hardened peripheral IP and comprehensive configuration/test support make it well suited for embedded control, interface bridging and system glue applications.

This part is appropriate for designs that require moderate logic capacity (2112 logic elements), significant I/O, and the ability to maintain configuration across power cycles, all within a compact 324‑VFBGA package and industrial temperature range. The MachXO3 family architecture provides documented configuration and memory modes to support reproducible, verifiable system implementations.

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