LCMXO3LF-2100E-5MG256I

IC FPGA 206 I/O 256CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-VFBGA, CSPBGA

Quantity 1,171 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CSFBGA (9x9)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-VFBGA, CSPBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3LF-2100E-5MG256I – MachXO3 FPGA, 2112 Logic Elements, 206 I/O, 256-VFBGA

The LCMXO3LF-2100E-5MG256I is a MachXO3 family field programmable gate array (FPGA) in a 256-VFBGA (9×9) surface-mount package. The device integrates 2112 logic elements and approximately 0.076 Mbits of embedded RAM with up to 206 user I/O pins, delivering a compact, non-volatile programmable fabric for industrial applications.

Designed for use where configurable logic, dense I/O, and on-chip peripherals are required, the device provides flexible architecture and system-level support for control, interface bridging, and embedded peripheral functions while operating across an industrial temperature range.

Key Features

  • Core Logic  2112 logic elements provide the programmable fabric for glue logic, finite-state machines, and custom digital functions.
  • Embedded Memory  Approximately 0.076 Mbits of on-chip RAM for FIFOs, small buffers, and state storage.
  • I/O Capacity and Buffering  Up to 206 user I/O pins with flexible on-chip I/O buffer options and source-synchronous support noted in the family datasheet.
  • On-chip Timing and Clocking  Integrated clocking resources including PLLs and an on-chip oscillator are documented in the MachXO3 family data sheet for flexible clock distribution and generation.
  • Hardened Peripherals and UFM  Embedded hardened IP functions such as I²C and SPI cores, timers/counters, and user flash memory (UFM) are available according to the family documentation.
  • Non-volatile, Reconfigurable Architecture  The MachXO3 family supports non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities as described in the datasheet.
  • Power and Operating Range  Supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C for industrial deployments.
  • Package and Mounting  256-VFBGA (CSPBGA) surface-mount package, supplier package noted as 256-CSFBGA (9×9), enabling compact board placement.
  • System Reliability and Testability  Family documentation includes provisions for IEEE 1149.1-compliant boundary-scan testability and hot-socketing guidance.

Typical Applications

  • Industrial Control  Use for programmable control logic, I/O aggregation, and timing functions within industrial automation systems where industrial temperature operation is required.
  • Interface Bridging and Glue Logic  Ideal for implementing protocol adapters, bus bridging, and custom interface logic using embedded SPI/I²C and flexible I/O.
  • Embedded System Functions  Suitable for control sequencing, watchdog/timer functions, and small buffering or FIFO implementations using on-chip RAM and timers.
  • Configuration and System Management  Non-volatile, multi-time programmable configuration and UFM allow in-field updates and system-level configuration storage.

Unique Advantages

  • Highly integrated I/O and logic: 206 I/O pins combined with 2112 logic elements reduce external glue logic and simplify PCB design.
  • Non-volatile programmability: Multi-time programmable, non-volatile configuration enables field updates without external configuration memory.
  • Industrial operating range: Specified operation from −40 °C to 100 °C suits rugged and temperature-variable environments.
  • Compact, surface-mount package: 256-VFBGA (9×9) package allows dense integration on space-constrained boards.
  • On-chip peripherals and memory: Hardened I²C/SPI, timers, UFM and embedded RAM reduce BOM and off-chip component count.
  • Documented system features: Family datasheet details clocking, PLLs, hot-socketing, and boundary-scan support for streamlined development and test.

Why Choose LCMXO3LF-2100E-5MG256I?

The LCMXO3LF-2100E-5MG256I positions itself as a compact, industrial-grade MachXO3 FPGA option when you need a combination of moderate logic capacity, substantial I/O, embedded peripherals, and non-volatile programmability. Its documented clocking, on-chip peripherals, and testability features make it suitable for designs that require integrated system control, interface adaptation, and in-field configurability.

This device is well suited to engineers and procurement teams building industrial and embedded systems who need a documented, reprogrammable solution with a small footprint and broad I/O capability backed by the MachXO3 family documentation.

Request a quote or submit an inquiry for pricing and availability to evaluate the LCMXO3LF-2100E-5MG256I for your next project.

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