LCMXO3LF-2100C-6BG324I

The LCMXO3LF-2100C-6BG324I is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It combines a non-volatile, multi-time programmable fabric with embedded memory and on-chip system resources to address control, interface and glue-logic roles in industrial designs.

With 264 configurable logic blocks (CLBs) delivering 2,112 logic elements, 279 I/Os and approximately 0.076 Mbits of embedded RAM, this device is sized for applications that require a high I/O count, integrated peripherals and robust operating range in a compact 324-LFBGA package.

Key Features

• Logic and Fabric — 264 CLBs providing 2,112 logic elements for flexible user logic implementation and combinational/sequential designs.
• Embedded Memory — Total RAM of 75,776 bits (approximately 0.076 Mbits) for small on-chip data storage, FIFOs and buffer use.
• I/O Density — 279 dedicated I/O pins to support wide parallel interfaces, multiple peripherals or complex board-level routing.
• On‑chip System Resources — Datasheet describes embedded block RAM (sysMEM), programmable I/O cells, on-chip oscillator, hardened I2C and SPI IP cores, timers/counters and user flash memory (UFM) for system integration.
• Clocking and Reconfiguration — Flexible on-chip clocking including sysCLOCK PLLs and support for TransFR reconfiguration modes as documented in the MachXO3 family datasheet.
• Package and Mounting — 324‑LFBGA package; supplier device package listed as 324‑CABGA (15×15). Surface mount mounting type for standard assembly processes.
• Power — Supported supply range from 2.375 V to 3.465 V to accommodate common board power rails.
• Industrial Temperature Grade — Rated operating range from −40 °C to 100 °C suitable for industrial environments.
• Standards and Testability — Datasheet references IEEE 1149.1‑compliant boundary scan testability for board-level test support.
• Environmental — RoHS compliant.

Typical Applications

• Industrial control and automation — Use the device for interface glue logic, peripheral aggregation and control functions within industrial equipment operating across −40 °C to 100 °C.
• Protocol bridging and interface management — High I/O count and programmable I/O cells make it suitable for consolidating multiple serial and parallel interfaces on a single device.
• Embedded system glue logic — On‑chip RAM, UFM and hardened peripheral IP allow compact implementations of configuration, control and buffering tasks without external components.

Unique Advantages

• High I/O capacity: 279 I/Os enable dense board-level connectivity and reduce the need for external multiplexing or multiple interface ICs.
• Integrated system peripherals: Embedded block RAM, hardened I2C/SPI, timers and oscillator reduce BOM and simplify firmware/hardware partitioning.
• Non‑volatile, multi-time programmable fabric: MachXO3 family capabilities allow field updates and persistent configuration without external volatile configuration memory.
• Industrial temperature operation: −40 °C to 100 °C rating helps ensure reliable operation across common industrial environments.
• Compact BGA footprint: 324‑LFBGA / 324‑CABGA (15×15) package provides a high-density solution in a compact assembly form factor.
• Design and test support: Boundary scan and documented reconfiguration/clocking features assist in development, debug and production test flows.

Why Choose LCMXO3LF-2100C-6BG324I?

The LCMXO3LF-2100C-6BG324I positions itself as an integrated FPGA choice for engineers needing moderate logic capacity with a very high I/O count, embedded memory resources and on-chip peripherals in an industrial-grade package. Its documented MachXO3 family features—non‑volatile programmable fabric, sysMEM, PLL-based clocking, hardened IP cores and boundary-scan testability—allow consolidation of control and interface functions while minimizing external components.

This device is well suited for designers targeting compact, robust implementations that require flexible I/O mapping, persistent configuration and a broad operating voltage and temperature window. The combination of logic elements, embedded memory and system IP offers a pathway to reduce BOM complexity and accelerate system integration.

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