LCMXO3LF-2100C-5BG324I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 279 75776 2112 324-LFBGA |
|---|---|
| Quantity | 1,298 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CABGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 279 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3LF-2100C-5BG324I – MachXO3 Field Programmable Gate Array (FPGA)
The LCMXO3LF-2100C-5BG324I is a MachXO3 family Field Programmable Gate Array (FPGA) in a 324-LFBGA package. It delivers a compact, industrial-grade programmable-logic solution with a balanced mix of logic capacity, on-chip memory and high I/O density for embedded and industrial system designs.
Designed for applications that require non-volatile, reprogrammable logic in a small surface-mount package, this device combines 2,112 logic elements, approximately 0.076 Mbits of embedded memory, and 279 user I/O to support complex glue-logic, control and system-integration tasks within an industrial temperature range.
Key Features
- Logic Capacity 2,112 logic elements provide a moderate programmable fabric for glue logic, control functions and peripheral management.
- Embedded Memory (sysMEM) Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for small FIFOs, buffers and state storage; supports single/dual/ pseudo-dual port and FIFO modes as described in the MachXO3 family documentation.
- High I/O Density 279 user I/O pins to support multiple peripheral interfaces and board-level interconnects.
- Non-volatile, Multi-time Programmable MachXO3 family architecture includes non-volatile, multi-time programmable configuration for persistent logic without external flash.
- On-chip System Support Includes hardened IP building blocks referenced in the family datasheet, such as I²C and SPI IP cores, timer/counter, on-chip oscillator and PLL-based clocking (sysCLOCK), enabling reduced external component count.
- Flexible I/O and Clocking Pre-engineered source-synchronous I/O, flexible I/O buffer options and on-chip clocking resources are included in the family feature set to simplify timing and interface design.
- Reconfiguration and System-Level Tools Supports MachXO3 family-level features like TransFR reconfiguration and enhanced system-level support for deployment and in-field updates.
- Package & Mounting 324-LFBGA (324-CABGA, 15×15 mm) in a surface-mount form factor for compact PCB layouts.
- Power & Temperature Supply voltage range 2.375 V to 3.465 V and industrial operating temperature range of −40 °C to 100 °C.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Use the device in industrial systems that require programmable glue logic and control while operating across an industrial temperature range.
- Embedded Interfaces High I/O count and hardened peripheral IP make it suitable for consolidating serial buses, SPI/I²C masters and peripheral bridging.
- System Integration & Glue Logic Fits board-level integration tasks where moderate logic capacity and on-chip memory are used to reduce external components and simplify designs.
Unique Advantages
- Compact, High I/O Footprint: 279 user I/Os in a 324-LFBGA package lets designers route multiple interfaces without needing a larger, higher-pin-count device.
- Non-volatile, Reprogrammable Logic: On-chip non-volatile configuration removes the need for external configuration memory while supporting multiple reprogram cycles for field updates.
- Industry-Grade Reliability: Rated for −40 °C to 100 °C and specified as industrial grade for deployment in temperature-challenging environments.
- Integrated IP and System Support: Hardened I²C, SPI, timer/counter and on-chip clocking resources reduce PCB BOM and accelerate time-to-market.
- Flexible Power Range: Operates across a 2.375 V to 3.465 V supply range to accommodate a variety of board power architectures.
Why Choose LCMXO3LF-2100C-5BG324I?
The LCMXO3LF-2100C-5BG324I positions itself as a mid-density, industrial-grade MachXO3 FPGA option that balances logic resources, embedded memory and a very high I/O count in a compact 324-LFBGA package. It is well suited to designers who need non-volatile programmable logic with integrated peripheral IP and flexible I/O/clocking for embedded and industrial applications.
As part of the MachXO3 family, this device benefits from the family-level architecture and system-level features documented by the vendor, offering a pathway for migration within the same device family and consistent deployment across multiple designs.
Request a quote or submit a procurement inquiry to receive pricing and availability for the LCMXO3LF-2100C-5BG324I.

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