LCMXO3LF-2100C-5BG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 244 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3LF-2100C-5BG256I – MachXO3 Field Programmable Gate Array (FPGA), 2112 logic elements, 206 I/Os, 256‑LFBGA
The LCMXO3LF-2100C-5BG256I is a MachXO3-family FPGA from Lattice Semiconductor Corporation. It combines 2,112 logic elements, approximately 75,776 bits of embedded RAM, and 206 general‑purpose I/Os in a compact 256‑LFBGA (14×14) package to address I/O‑dense, industrial applications.
Designed with a non‑volatile, multi‑time programmable architecture and flexible on‑chip clocking and I/O features listed in the MachXO3 data sheet, this device targets industrial designs that require robust temperature and voltage operating ranges while minimizing external glue logic.
Key Features
- Logic Capacity – 2,112 logic elements suitable for glue logic, control functions and mid-density FPGA tasks.
- Embedded Memory – Approximately 75,776 bits of on‑chip RAM for small buffers, FIFOs and state storage.
- I/O Density – 206 I/Os to support multiple peripheral interfaces and high pin‑count board functions.
- Programmable, Non‑volatile Architecture – MachXO3 family features include non‑volatile, multi‑time programmable configuration and TransFR reconfiguration options as described in the datasheet.
- On‑chip Peripherals and IP – Datasheet describes hardened I2C and SPI IP cores, timers/counters, on‑chip oscillator and programmable I/O cells for common embedded functions.
- Clocking and Routing – Flexible on‑chip clocking (including PLLs) and programmable routing blocks for timing control and source‑synchronous I/O architectures referenced in the MachXO3 documentation.
- Package and Mounting – 256‑LFBGA (supplier device package 256‑CABGA 14×14) surface‑mount package for compact PCB integration.
- Power and Temperature – Supported supply range of 2.375 V to 3.465 V and industrial operating temperature range of −40 °C to 100 °C.
- Regulatory – RoHS compliant.
Typical Applications
- Industrial Control – Leverages industrial temperature rating (−40 °C to 100 °C) and 206 I/Os for sensor aggregation, I/O expansion and control logic in factory and process automation.
- Interface Bridging and Glue Logic – 2,112 logic elements and hardened I2C/SPI IP cores support protocol adaptation and board‑level interface consolidation.
- Embedded System Control – On‑chip oscillator, PLL‑based clocking and embedded RAM enable local sequencing, timing and small buffering tasks within embedded systems.
- Communications and Peripheral Management – High I/O count and flexible programmable I/O cells are suited for handling multiple peripheral interfaces and control plane functions.
Unique Advantages
- High I/O Integration: 206 I/Os reduce the need for external expanders and simplify board-level routing for I/O-heavy designs.
- Industrial‑grade Operation: −40 °C to 100 °C operating range supports deployment in demanding industrial environments.
- Compact Package: 256‑LFBGA (14×14) package minimizes PCB footprint while providing ample I/O and logic resources.
- Flexible Power Range: 2.375 V to 3.465 V supply range enables compatibility with common system power rails.
- Embedded Memory: Approximately 75,776 bits of on‑chip RAM provide local storage for buffering, FIFOs and state machines without external memory.
- Non‑volatile, Reconfigurable Architecture: Multi‑time programmable configuration supports in‑field updates and iterative development workflows consistent with the MachXO3 family.
Why Choose LCMXO3LF-2100C-5BG256I?
Part of the MachXO3 family from Lattice Semiconductor Corporation, the LCMXO3LF-2100C-5BG256I balances mid‑density logic resources with high I/O capacity and embedded memory in a small 256‑LFBGA package. Its industrial temperature rating and flexible supply range make it suitable for board‑level control, interface consolidation and peripheral management in industrial and embedded systems.
Engineers seeking a non‑volatile, reconfigurable FPGA with hardened peripheral IP options, on‑chip clocking and modest embedded RAM will find this device well aligned to applications that require robust I/O, compact packaging and field‑programmable updates.
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