LCMXO3LF-2100C-6BG256I

The LCMXO3LF-2100C-6BG256I is a MachXO3 family FPGA provided in a 256-LFBGA package. It integrates 2,112 logic elements, approximately 0.076 Mbits of embedded RAM, and 206 general-purpose I/Os in a surface-mount 14 × 14 mm package intended for industrial applications.

With a supported supply range of 2.375 V to 3.465 V and an operating temperature range of −40 °C to 100 °C, this device is positioned for designs that require a non-volatile, reprogrammable logic element with on-chip memory, flexible I/O count and industrial-temperature capability.

Key Features

• Logic Fabric  2,112 logic elements for implementing glue logic, small state machines, and custom control functionality.
• Embedded Memory  Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for small data buffers, FIFOs or register storage.
• I/O Density  206 I/O pins to support multiple interfaces, parallel buses, and system-level signal routing.
• Package & Mounting  256-LFBGA (supplier package: 256-CABGA, 14 × 14 mm) in a surface-mount footprint for compact board designs.
• Voltage Flexibility  Wide supply range from 2.375 V to 3.465 V to accommodate diverse I/O and core power schemes.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for use in factory and industrial environments.
• Non-volatile, Multi-time Programmable Architecture  Family-level MachXO3 features include non-volatile configuration and reprogrammability for field updates.
• On-chip System IP  MachXO3 family datasheet describes hardened IP such as I²C and SPI cores, on-chip oscillator, and embedded timers/counters for system integration.
• System and Configuration Support  Family features include source-synchronous I/O support, flexible on-chip clocking (PLLs), user flash memory (UFM), and boundary-scan testability (IEEE 1149.1) as documented in the MachXO3 datasheet.
• Power Management Options  Includes standby mode and power-saving options described in family documentation to help manage system-level power.

Typical Applications

• Industrial Control  Implement control logic, I/O aggregation, and custom interfaces for automation equipment using the device’s industrial temperature rating and high I/O count.
• Interface Bridging and Glue Logic  Use the FPGA to bridge disparate buses or implement protocol translation where flexible I/O, on-chip memory, and reprogrammability are required.
• Embedded System Integration  Embed peripheral controllers and system glue (SPI, I²C, timers, clocking) leveraging hardened IP and on-chip resources for compact designs.
• Field-Upgradeable Logic  Deploy reprogrammable logic in products that need in-field updates or configuration changes via the MachXO3 non-volatile programming capability.

Unique Advantages

• High I/O Capacity: 206 I/Os enable consolidation of multiple signals and interfaces onto a single device, reducing board-level wiring and external multiplexers.
• Non-volatile Reprogrammability: MachXO3 family architecture supports multi-time programming and non-volatile configuration to enable field updates without external configuration memory.
• Industrial Qualification: Specified for −40 °C to 100 °C operation, suitable for industrial deployments that require extended temperature capability.
• Compact, Surface-Mount Package: 256-LFBGA (14 × 14 mm) offers a compact footprint for space-constrained designs while providing a high pin count.
• On-chip System IP and Clocking: Hardened SPI/I²C IP, on-chip oscillator, and flexible PLL-based clocking reduce external component count and simplify system design.
• Wide Voltage Range: 2.375 V to 3.465 V supply compatibility fits a range of power architectures and I/O standards documented for the family.

Why Choose LCMXO3LF-2100C-6BG256I?

The LCMXO3LF-2100C-6BG256I provides a compact, industrial-temperature FPGA option featuring 2,112 logic elements, substantial I/O capacity, and embedded RAM for tightly integrated control and interface functions. Its MachXO3 family characteristics—non-volatile programming, hardened peripheral IP, flexible clocking and power-saving options—make it suitable for systems that require reliable, field-updatable logic in a space-efficient package.

This device is a practical choice for engineers building industrial automation, interface bridging, or embedded control functions where on-chip memory, a high pin count, and industrial temperature operation are key selection criteria. The combination of embedded IP and reprogrammability supports long-term design flexibility and simplified system BOMs.

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