LCMXO3LF-2100E-5MG121C

IC FPGA 100 I/O 121CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA

Quantity 880 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package121-CSFBGA (6x6)GradeCommercialOperating Temperature0°C – 85°C
Package / Case121-VFBGA, CSPBGANumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3LF-2100E-5MG121C – MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA

The LCMXO3LF-2100E-5MG121C from Lattice Semiconductor Corporation is a MachXO3 family FPGA offering non-volatile, multi-time programmable reconfigurable logic in a compact BGA package. It combines on-chip embedded memory, flexible I/O capabilities and hardened peripheral IP to address system control, I/O expansion and configuration tasks in commercial-grade designs.

With a supply voltage range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C, this surface-mount device delivers a balance of integration and programmability for applications that require configurable logic, small embedded memory and a high count of I/O signals in a 121-ball VFBGA/CSPBGA footprint.

Key Features

  • Core capacity — 264 logic blocks (2,112 logic element cells) provide the reconfigurable fabric to implement glue logic, control state machines and custom peripherals.
  • Embedded memory — 75,776 bits of on-chip RAM (approximately 0.076 Mbits) with MachXO3 sysMEM block RAM support for single/dual-port and FIFO configurations.
  • I/O and buffering — 100 general-purpose I/O pins with pre‑engineered source‑synchronous I/O and flexible, high‑performance I/O buffer architecture as detailed in the MachXO3 datasheet.
  • Non-volatile configuration — Multi-time programmable, non-volatile configuration and TransFR reconfiguration capabilities for field updates and reliable power-up behavior.
  • Embedded hardened IP — On-chip hardened IP including I²C and SPI cores, timer/counter functions and user flash memory (UFM) referenced in the MachXO3 family documentation.
  • Clocking and timing — Integrated clocking primitives including PLLs and an on‑chip oscillator to support flexible clock architectures.
  • Package and mounting — 121‑VFBGA / CSPBGA package (supplier device package: 121‑CSFBGA, 6×6) in a surface-mount form factor for compact boards.
  • Power and environmental — Nominal supply range 1.14 V to 1.26 V; commercial temperature grade with operating range 0 °C to 85 °C; RoHS compliant.
  • Testability and configuration support — IEEE 1149.1-compliant boundary-scan testability and documented device configuration and testing methods in the MachXO3 datasheet.

Typical Applications

  • Interface and glue logic — Implement bus bridging, protocol adaptation and signal multiplexing using the device’s reconfigurable fabric and 100 I/O pins.
  • Embedded system control — Host control functions and local sequencing using integrated timers/counters, on‑chip memory and hardened SPI/I²C IP.
  • I/O expansion and signal management — Add programmable I/O buffering and gearboxing to extend or adapt system interfaces without redesigning host processors.
  • Field-updatable configurations — Use the non-volatile, multi-time programmable configuration to deploy in-field updates and revisions while preserving board-level reliability.

Unique Advantages

  • Compact, reconfigurable solution: Combines a meaningful logic capacity (264 logic blocks / 2,112 logic element cells) with embedded RAM to implement a variety of control and interface functions in a small package.
  • Built-in peripheral IP: Hardened I²C and SPI cores plus timer/counter functions reduce design effort and BOM compared with discrete peripheral implementations.
  • Flexible I/O architecture: Pre-engineered source-synchronous I/O and programmable I/O cells simplify integration with diverse host interfaces and clock domains.
  • Non-volatile configuration: Multi-time programmable, non-volatile configuration and TransFR reconfiguration enable reliable power-up behavior and field updates without external configuration memory.
  • Commercial-grade reliability and compliance: Designed for 0 °C to 85 °C operation and shipped RoHS compliant for mainstream commercial applications.

Why Choose LCMXO3LF-2100E-5MG121C?

This MachXO3 FPGA part provides a practical combination of reprogrammable logic, embedded memory and hardened peripheral IP in a compact 121‑ball BGA package, making it well suited to commercial designs that need configurable glue logic, interface adaptation and local control functions. The device’s non-volatile, multi-time programmable configuration, integrated clocking and I/O flexibility offer a maintainable platform for iterative development and field updates.

Engineers and procurement teams seeking a commercial-grade, RoHS-compliant FPGA with documented MachXO3 family features — including sysMEM, PLLs, on‑chip oscillator and boundary-scan support — will find the LCMXO3LF-2100E-5MG121C a pragmatic choice for space-constrained boards and designs requiring adaptable I/O and embedded control.

Request a quote or submit an inquiry to get pricing and availability information for the LCMXO3LF-2100E-5MG121C. Mention the part number to expedite your request.

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