LCMXO3LF-2100E-5MG121C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA |
|---|---|
| Quantity | 880 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 121-CSFBGA (6x6) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 121-VFBGA, CSPBGA | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3LF-2100E-5MG121C – MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA
The LCMXO3LF-2100E-5MG121C from Lattice Semiconductor Corporation is a MachXO3 family FPGA offering non-volatile, multi-time programmable reconfigurable logic in a compact BGA package. It combines on-chip embedded memory, flexible I/O capabilities and hardened peripheral IP to address system control, I/O expansion and configuration tasks in commercial-grade designs.
With a supply voltage range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C, this surface-mount device delivers a balance of integration and programmability for applications that require configurable logic, small embedded memory and a high count of I/O signals in a 121-ball VFBGA/CSPBGA footprint.
Key Features
- Core capacity — 264 logic blocks (2,112 logic element cells) provide the reconfigurable fabric to implement glue logic, control state machines and custom peripherals.
- Embedded memory — 75,776 bits of on-chip RAM (approximately 0.076 Mbits) with MachXO3 sysMEM block RAM support for single/dual-port and FIFO configurations.
- I/O and buffering — 100 general-purpose I/O pins with pre‑engineered source‑synchronous I/O and flexible, high‑performance I/O buffer architecture as detailed in the MachXO3 datasheet.
- Non-volatile configuration — Multi-time programmable, non-volatile configuration and TransFR reconfiguration capabilities for field updates and reliable power-up behavior.
- Embedded hardened IP — On-chip hardened IP including I²C and SPI cores, timer/counter functions and user flash memory (UFM) referenced in the MachXO3 family documentation.
- Clocking and timing — Integrated clocking primitives including PLLs and an on‑chip oscillator to support flexible clock architectures.
- Package and mounting — 121‑VFBGA / CSPBGA package (supplier device package: 121‑CSFBGA, 6×6) in a surface-mount form factor for compact boards.
- Power and environmental — Nominal supply range 1.14 V to 1.26 V; commercial temperature grade with operating range 0 °C to 85 °C; RoHS compliant.
- Testability and configuration support — IEEE 1149.1-compliant boundary-scan testability and documented device configuration and testing methods in the MachXO3 datasheet.
Typical Applications
- Interface and glue logic — Implement bus bridging, protocol adaptation and signal multiplexing using the device’s reconfigurable fabric and 100 I/O pins.
- Embedded system control — Host control functions and local sequencing using integrated timers/counters, on‑chip memory and hardened SPI/I²C IP.
- I/O expansion and signal management — Add programmable I/O buffering and gearboxing to extend or adapt system interfaces without redesigning host processors.
- Field-updatable configurations — Use the non-volatile, multi-time programmable configuration to deploy in-field updates and revisions while preserving board-level reliability.
Unique Advantages
- Compact, reconfigurable solution: Combines a meaningful logic capacity (264 logic blocks / 2,112 logic element cells) with embedded RAM to implement a variety of control and interface functions in a small package.
- Built-in peripheral IP: Hardened I²C and SPI cores plus timer/counter functions reduce design effort and BOM compared with discrete peripheral implementations.
- Flexible I/O architecture: Pre-engineered source-synchronous I/O and programmable I/O cells simplify integration with diverse host interfaces and clock domains.
- Non-volatile configuration: Multi-time programmable, non-volatile configuration and TransFR reconfiguration enable reliable power-up behavior and field updates without external configuration memory.
- Commercial-grade reliability and compliance: Designed for 0 °C to 85 °C operation and shipped RoHS compliant for mainstream commercial applications.
Why Choose LCMXO3LF-2100E-5MG121C?
This MachXO3 FPGA part provides a practical combination of reprogrammable logic, embedded memory and hardened peripheral IP in a compact 121‑ball BGA package, making it well suited to commercial designs that need configurable glue logic, interface adaptation and local control functions. The device’s non-volatile, multi-time programmable configuration, integrated clocking and I/O flexibility offer a maintainable platform for iterative development and field updates.
Engineers and procurement teams seeking a commercial-grade, RoHS-compliant FPGA with documented MachXO3 family features — including sysMEM, PLLs, on‑chip oscillator and boundary-scan support — will find the LCMXO3LF-2100E-5MG121C a pragmatic choice for space-constrained boards and designs requiring adaptable I/O and embedded control.
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