LCMXO3LF-2100E-5MG324C

The LCMXO3LF-2100E-5MG324C is a MachXO3 family FPGA optimized for commercial embedded designs that require non-volatile, reprogrammable logic and flexible I/O. The device integrates programmable logic, embedded memory, on-chip clocking and hardened peripheral IP to address glue logic, interface bridging and control functions in compact surface-mount systems.

Designed for low-voltage operation and packaged in a 324-ball VFBGA, this part offers measurable I/O capacity and on-chip resources suited to mid-density programmable logic tasks in commercial applications.

Key Features

• Programmable Logic — 2,112 logic elements and 264 logic blocks provide mid-density programmable capacity for control, timing and glue logic.
• Embedded Memory — Approximately 75,776 bits of on-chip RAM for FIFO, buffering and small data storage requirements.
• I/O Capacity and Flexibility — 268 user I/Os with support for pre-engineered source-synchronous I/O and flexible on-chip I/O buffering (per MachXO3 family data sheet).
• Non-volatile, Multi-time Programmable — MachXO3 family architecture includes non-volatile, reprogrammable configuration for persistent logic without external configuration memory.
• Clocking and Timing — Flexible on-chip clocking resources and PLLs as described in the MachXO3 family documentation to support system timing and synchronous interfaces.
• Hardened Peripheral IP — Family-level embedded IP includes options such as I²C, SPI and timer/counter blocks (MachXO3 family features), enabling common peripheral interfaces without consuming fabric resources.
• System Features — On-chip oscillator, user flash memory (UFM), TransFR reconfiguration and standby/power-saving modes are included at the family level for compact system design.
• Package and Mounting — 324-VFBGA package (supplier package: 324-CSFBGA, 10×10) for surface-mount assembly in space-constrained boards.
• Power and Temperature — Recommended supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion — Use the device’s programmable logic and embedded IP to implement protocol adapters and I/O bridge functions in commercial systems.
• Glue Logic and System Control — Mid-density logic and abundant I/Os make the part well-suited for replacing discrete glue logic and for centralized control tasks on compact PCBs.
• User Interface and Peripheral Management — On-chip resources and hardened peripheral IP support control of displays, keypads, sensors and peripheral interfaces in embedded products.
• Buffering and Data Path Management — Built-in RAM and clocking resources enable FIFO buffering and data alignment for intermediate data paths and timing-critical interfaces.

Unique Advantages

• Substantial I/O Count: 268 user I/Os provide broad connectivity for sensors, peripherals and external buses without external glue.
• Mid-density Logic Capacity: 2,112 logic elements and 264 logic blocks give designers predictable fabric resources for control and combinational/sequential logic tasks.
• On-chip Memory: Approximately 75,776 bits of embedded RAM reduce the need for external memory for small buffers and FIFOs.
• Compact, Surface-Mount Package: 324-VFBGA (324-CSFBGA, 10×10) enables high-density board layouts while providing a large I/O count.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range supports low-power system designs and aligns with modern core-voltage domains.
• Commercial Temperature Rated: Specified for 0 °C to 85 °C operation to match typical commercial product requirements.

Why Choose LCMXO3LF-2100E-5MG324C?

The LCMXO3LF-2100E-5MG324C combines non-volatile configurability, mid-density programmable logic and a high I/O count in a compact VFBGA package. It targets commercial embedded designs that need flexible, reprogrammable logic alongside hardened peripheral IP and embedded memory to reduce external components and simplify board-level integration.

For teams building control, interface or peripheral-management subsystems, this MachXO3 family device offers a balance of integration, predictable resource counts and family-level system features that support scalable design reuse and streamlined product development.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO3LF-2100E-5MG324C. Our team can provide lead-time information and assistance selecting the right device for your design requirements.