LCMXO3LF-2100E-5UWG49CTR1K

The LCMXO3LF-2100E-5UWG49CTR1K is a MachXO3 family Field Programmable Gate Array (FPGA) offered in a compact 49‑WLCSP (3.11 × 3.19 mm) package for surface-mount assembly. It provides 2,112 logic elements and approximately 75.8 kbits of embedded RAM complemented by 38 general-purpose I/O pins, delivering a low‑voltage, compact programmable fabric for commercial-grade designs.

Designed for applications requiring small footprint programmable logic, this device combines flexible architecture and on-chip resources with non‑volatile, multi‑time programmable configuration to support system glue logic, interface bridging, and other embedded control functions within the 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity — 2,112 logic elements for implementing control, glue logic, and moderate-density combinational/sequential functions.
• Embedded Memory — 75,776 total RAM bits (approximately 75.8 kbits) of on-chip RAM for data buffering, small FIFOs, and state storage.
• I/O Count and Flexibility — 38 I/O pins in a programmable I/O cell architecture to support a range of standard interfaces and board-level signal connectivity.
• Low-Voltage Supply — Nominal operating supply range from 1.14 V to 1.26 V to match low-voltage system rails.
• Compact Package & Mounting — 49‑WLCSP (3.11 × 3.19 mm) package, surface-mount compatible for space-constrained designs.
• Commercial Grade — Rated for 0 °C to 85 °C operation and RoHS compliant for commercial applications.
• Non-volatile, Multi-time Programmable Configuration — MachXO3 family architecture provides non-volatile, reprogrammable device configuration for field updates and system flexibility.
• On-chip System Support — Datasheet references include flexible on-chip clocking (PLLs), on-chip oscillator, programmable I/O buffers, and embedded hardened IP functions to simplify system integration.

Typical Applications

• Consumer and Commercial Electronics — Implements control, user interface logic, and small protocol bridges where compact size and low-voltage operation are required.
• Interface Bridging and Glue Logic — Provides programmable signal adaptation and timing logic between subsystems with moderate I/O and memory needs.
• Embedded Control and I/O Expansion — Adds flexible digital control, timing, and I/O management in space-constrained boards.

Unique Advantages

• Compact, board-friendly package: The 49‑WLCSP (3.11 × 3.19 mm) footprint minimizes board area while keeping 38 I/O available for system signals.
• Small‑system power compatibility: Operates from a narrow 1.14 V to 1.26 V supply range, enabling integration with low-voltage platforms.
• Non‑volatile reprogrammability: Multi-time programmable configuration allows field updates and iterative design refinement without external configuration memory.
• On‑chip memory for buffering: Approximately 75.8 kbits of embedded RAM supports small FIFOs, state machines, and transient data storage without external SRAM.
• Commercial-temperature rating: 0 °C to 85 °C specification provides deterministic environmental bounds for typical commercial deployments.
• RoHS compliant: Meets RoHS requirements for modern electronics manufacturing and supply chains.

Why Choose LCMXO3LF-2100E-5UWG49CTR1K?

This MachXO3 device combines a compact WLCSP footprint with 2,112 logic elements, on-chip RAM, and 38 I/Os to deliver a pragmatic programmable-logic option for commercial designs that need low-voltage operation and small board area. Its non‑volatile, multi‑time programmable configuration and on-chip system resources simplify integration for interface bridging, embedded control, and other moderate-density programmable tasks.

Engineers and procurement teams seeking a compact, RoHS‑compliant FPGA for commercial-temperature applications will find the LCMXO3LF-2100E-5UWG49CTR1K suitable for designs that demand space efficiency, programmable flexibility, and straightforward system-level features documented in the MachXO3 family datasheet.

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