LCMXO3LF-2100E-5UWG49ITR1K

The LCMXO3LF-2100E-5UWG49ITR1K is a MachXO3 family FPGA in a 49-pin WLCSP package designed for industrial applications. It provides a compact, non-volatile programmable fabric with on-chip memory and flexible I/O to support control, glue-logic, and interface tasks where a small footprint and broad temperature range are required.

Built on the MachXO3 architecture, this device combines a programmable logic core with embedded memory, configurable I/O, and on-chip system features to streamline integration and reduce system BOM for embedded designs.

Key Features

• Logic Core  2,112 logic elements to implement control, glue-logic, and small custom logic blocks in compact systems.
• Embedded Memory  Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for small FIFOs, state storage, and buffering.
• I/O Capacity  38 available I/O pins delivered through a high-performance, flexible I/O buffer architecture supporting source-synchronous and custom interface implementations.
• Power and Supply  Operates from a core supply range of 1.14 V to 1.26 V for predictable power integration.
• Package & Mounting  49-WLCSP (3.11 × 3.19 mm) ultra-compact, surface-mount package for space-constrained PCBs.
• Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Non-volatile Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capability as part of the device architecture.
• System-Level Features  On-chip clocking, configurable I/O banks, and embedded peripherals described in the MachXO3 family datasheet to simplify system integration and bring-up.
• Compliance  RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion  Implement source-synchronous and custom interface logic with flexible I/O and embedded memory for buffering and timing alignment.
• System Glue Logic  Replace discrete glue components by consolidating control and sequencing logic within the FPGA’s 2,112 logic elements and on-chip resources.
• Configuration and State Management  Use the device’s non-volatile, multi-time programmable capabilities for system configuration storage and boot-time control functions.
• Industrial Control and Monitoring  Compact WLCSP package and industrial temperature rating enable integration into space-constrained industrial electronics and embedded controllers.

Unique Advantages

• Compact, production-ready package: The 49-WLCSP (3.11 × 3.19 mm) minimizes PCB area while providing 38 usable I/O for dense designs.
• Programmable non-volatile configuration: Multi-time programmable, non-volatile configuration eliminates the need for external configuration flash in many applications.
• Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Developer-friendly integration: Embedded memory, on-chip clocking and configurable I/O reduce external component count and simplify system design.
• Predictable power domain: Narrow core supply window (1.14 V to 1.26 V) aids in designing stable power delivery for the logic core.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory considerations.

Why Choose LCMXO3LF-2100E-5UWG49ITR1K?

This MachXO3 FPGA delivers a tightly integrated combination of programmable logic, embedded RAM, and flexible I/O in an ultra-compact WLCSP package targeted at industrial applications. Its 2,112 logic elements and approximately 0.076 Mbits of on-chip RAM provide the right balance of resources for glue-logic, interface bridging, and control functions while minimizing board area and external components.

Designed for engineers seeking a small-footprint, industrial-grade, non-volatile programmable device, the LCMXO3LF-2100E-5UWG49ITR1K is suitable for space-constrained modules and embedded systems where predictable supply requirements, configurable I/O, and reliable operation across −40 °C to 100 °C are required.

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