LCMXO3LF-2100E-6MG256C

The LCMXO3LF-2100E-6MG256C is a MachXO3 family FPGA IC that provides a compact, non-volatile programmable logic solution for system control, I/O expansion and interface glue logic. Built around a flexible on-chip architecture with embedded memory blocks, hardened peripheral IP and programmable I/O, it targets commercial applications that require reprogrammable logic combined with multi‑time configuration capability.

With 2,112 logic elements, 206 I/Os and integrated clocking/configuration features from the MachXO3 family, this device is positioned for designs where dense I/O, on-chip memory and reliable, reprogrammable system functions are required within a small 256‑VFBGA package.

Key Features

• Core and Logic — 2,112 logic elements providing the programmable fabric for implementing custom logic, state machines and glue functions. The device includes 264 CLBs as a structural resource count.
• Embedded Memory — Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for FIFOs, buffers and small data structures; supports single/dual/pseudo-dual port and FIFO modes as described in the MachXO3 family architecture.
• I/O Capacity — 206 programmable I/O pins enabling high pin-count interfacing, bus bridging and signal aggregation for system-level designs.
• Clocking and Timing — On-chip oscillators and sysCLOCK PLLs as part of the MachXO3 family architecture to support flexible clock generation and distribution for synchronous designs.
• Hardened IP and System Functions — Embedded hardened IP blocks referenced in the family datasheet, including I²C and SPI cores and timer/counter functionality, plus user flash memory (UFM) for system storage and configuration.
• Non-volatile, Multi‑time Programmable — MachXO3 family configuration semantics provide non-volatile, reprogrammable device configuration and TransFR reconfiguration support described in the datasheet.
• Power and Thermal — Operates from a supply range of 1.14 V to 1.26 V and specified for commercial grade operation from 0 °C to 85 °C; includes standby mode and power-saving options described in the family documentation.
• Package and Mounting — Surface-mount 256‑VFBGA (supplier package 256‑CSFBGA, 9×9) for compact board integration; RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion — Use the device’s 206 I/Os and embedded serial IP to implement bus bridges, level translators and protocol adapters in compact systems.
• System Control and Glue Logic — Implement control sequencing, state machines and system supervisors using the 2,112 logic elements together with on-chip timers and UFM for configuration data.
• Peripheral Aggregation — Aggregate multiple lower-pin-count peripherals into a single device interface, leveraging the programmable I/O banks and embedded memory for buffering.

Unique Advantages

• Highly integrated I/O density: 206 I/Os reduce external interface components and simplify board routing for I/O-heavy designs.
• Non‑volatile configurability: Multi-time programmable, non-volatile configuration removes the need for external volatile configuration memory in many system architectures.
• Embedded system IP: Hardened I²C, SPI and timer/counter functions enable quicker integration of common peripherals without consuming large amounts of programmable fabric.
• Compact package: 256‑VFBGA (9×9) packaging provides a small footprint for space-constrained applications while supporting high pin count.
• Design flexibility: On‑chip PLLs, oscillators and multiple memory modes (including FIFO) support a range of synchronous and buffering topologies.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match typical commercial deployment environments.

Why Choose LCMXO3LF-2100E-6MG256C?

The LCMXO3LF-2100E-6MG256C combines the MachXO3 family’s programmable architecture, non‑volatile multi‑time programmability and embedded system IP into a small 256‑VFBGA package. With 2,112 logic elements, approximately 0.076 Mbits of on‑chip RAM and 206 I/Os, it is suitable for commercial designs that need dense I/O, configuration flexibility and integrated peripheral support without large external BOMs.

This part is a practical choice for engineers developing interface bridges, system controllers and peripheral aggregators who require reprogrammable logic, on-chip memory and hardened IP blocks in a compact, RoHS‑compliant package. The device’s documented MachXO3 family features—clocking, configuration options, and embedded memory modes—help accelerate integration and deployment in commercial applications.

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