LCMXO3LF-2100E-6MG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-VFBGA, CSPBGA |
|---|---|
| Quantity | 4 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CSFBGA (9x9) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-VFBGA, CSPBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3LF-2100E-6MG256I – MachXO3 Field Programmable Gate Array (FPGA), 256‑VFBGA
The LCMXO3LF-2100E-6MG256I is a MachXO3 family Field Programmable Gate Array (FPGA) optimized for compact, industrial-grade system designs. It combines a flexible FPGA architecture with on-chip memory, hardened peripheral IP and a dense I/O complement to address system glue logic, interface bridging and embedded control functions.
Key device facts: 2,112 logic elements, approximately 75,776 bits of embedded RAM, 206 I/Os, 256‑VFBGA (CSPBGA) package, surface-mount mounting, industrial operating range (‑40 °C to 100 °C), and a nominal supply window of 1.14 V to 1.26 V. The device is RoHS compliant and supports MachXO3 family configuration and system features.
Key Features
- Core Logic — 2,112 logic elements for implementing glue logic, state machines and custom control functions.
- Embedded Memory — Approximately 75,776 bits of on-chip RAM supporting single/dual-port and FIFO modes for data buffering and small lookup tables.
- High‑Density I/O — 206 I/O pins with MachXO3 family pre-engineered source-synchronous I/O and flexible on-chip I/O buffering for a wide range of interface needs.
- Hardened IP and Peripherals — Includes embedded hardened I2C and SPI IP cores, timers/counters and system IP to accelerate common control and interface tasks.
- Configuration and Reliability — Non-volatile, multi-time programmable architecture with TransFR reconfiguration and IEEE 1149.1 boundary-scan testability for system-level reliability and field updates.
- Clocking and Power Options — Flexible on-chip clocking including sysCLOCK PLLs and power-saving/standby modes for configurable clock and power management.
- Package and Environmental — 256‑VFBGA (256‑CSFBGA, 9×9) surface-mount package, industrial grade with operating range of ‑40 °C to 100 °C, RoHS compliant.
- Supply Voltage — Operates from 1.14 V to 1.26 V to match low-voltage system rails.
Typical Applications
- System Glue Logic — Implement custom control, protocol translation and timing adjustments between components using the device’s logic elements and abundant I/Os.
- Interface Bridging — Hardened SPI and I2C cores plus flexible I/O enable bridging between serial peripherals and legacy or modern buses.
- Embedded Control and Sequencing — Use non-volatile, multi-time programmable logic and on-chip timers for boot-time control, watchdogs and deterministic state machines.
- I/O Expansion and Protocol Adaptation — 206 I/Os and configurable I/O buffers allow compact expansion of board-level I/O and protocol conversion tasks.
Unique Advantages
- Compact, production-ready package: 256‑VFBGA (CSPBGA) surface-mount package enables high-density board designs with industrial temperature capability.
- Integrated peripherals reduce BOM: Hardened I2C, SPI and timers lower external component count and accelerate time-to-market.
- Field reprogrammability: Non-volatile, multi-time programmable configuration permits in-field updates and design iteration without hardware changes.
- Flexible I/O and clocking: Pre-engineered source-synchronous I/O and on-chip PLLs simplify timing-critical interface implementations.
- Designed for industrial use: Wide operating temperature range (‑40 °C to 100 °C) and RoHS compliance suit long-life, rugged applications.
- Low-voltage operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system rails.
Why Choose LCMXO3LF-2100E-6MG256I?
The LCMXO3LF-2100E-6MG256I positions itself as a compact, industrial-grade FPGA for designs that require a balanced combination of logic capacity, on-chip memory and extensive I/O in a small CSPBGA package. Its MachXO3 family features—non-volatile configuration, hardened peripheral IP, flexible clocking and reconfiguration—make it well suited for system-level glue logic, interface bridging and embedded control tasks.
Engineers building rugged, space-constrained products will find this device useful for reducing external components, enabling in-field updates and maintaining operation across a wide temperature range. The device’s specification set supports scalable development and long-term product maintenance within industrial applications.
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