LCMXO3LF-4300C-5BG256C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 329 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3LF-4300C-5BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 256-LFBGA
The LCMXO3LF-4300C-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation, delivered in a 256-LFBGA surface-mount package. It combines a flexible on-chip architecture with non-volatile, multi-time programmable configuration and embedded system-level features aimed at mid-density logic and I/O-centric designs.
Key device attributes include 4,320 logic elements, 206 I/O pins, approximately 0.094 Mbits (94,208 bits) of embedded RAM and support for a 2.375 V to 3.465 V supply. The device is specified for commercial operation from 0 °C to 85 °C and is RoHS compliant.
Key Features
- Logic Capacity 4,320 logic elements to implement moderate-density control, glue logic, and custom logic functions.
- Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for small buffers, state storage, and FIFO configurations.
- Large I/O Count 206 I/O pins with a high-performance, flexible I/O buffer architecture and pre‑engineered source-synchronous I/O options described in the MachXO3 family data sheet.
- Configurable Clocking Flexible on-chip clocking resources including sysCLOCK PLLs for system clocking and timing domain management (as documented for the MachXO3 family).
- Non-volatile Configuration Multi‑time programmable, non-volatile configuration with TransFR reconfiguration and User Flash Memory (UFM) support noted in the family data sheet.
- Embedded Hardened IP Includes hardened peripheral IP functions referenced in the datasheet such as I²C, SPI and timer/counter blocks to simplify common system tasks.
- System and Test Features On-chip features described in the data sheet include IEEE 1149.1-compliant boundary-scan testability, power-on-reset and standby/power-saving options.
- Package & Power 256-LFBGA (supplier package 256-CABGA, 14×14) surface-mount package; recommended supply voltage range 2.375 V to 3.465 V; commercial grade (0 °C to 85 °C).
- Compliance RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic Use the device’s 206 I/Os and flexible I/O buffering to implement bus adapters, protocol bridges and board-level interface conditioning.
- Peripheral and System Control Embedded hardened I²C, SPI and timer/counter IP blocks plus on-chip memory support common peripheral control and management tasks.
- Prototyping and Low‑cost Migration MachXO3 family features such as non-volatile, multi-time programming and documented low-cost migration paths make this device suitable for iterative development and product updates.
Unique Advantages
- Balanced Integration: Combines 4,320 logic elements with substantial I/O and embedded RAM to reduce external components for many mid-density designs.
- Non-volatile Configuration: Multi-time programmable, non-volatile configuration enables field updates and persistent system logic without external configuration devices.
- On-board Peripheral IP: Hardened I²C and SPI controllers and timer/counter blocks reduce FPGA fabric usage and simplify firmware integration.
- Flexible Clocking and I/O: Family-documented PLLs and configurable I/O help designers manage timing domains and implement source-synchronous interfaces.
- Compact, Production-Ready Package: 256-LFBGA (256-CABGA, 14×14) surface-mount format supports dense PCB layouts while meeting commercial temperature requirements.
Why Choose LCMXO3LF-4300C-5BG256C?
The LCMXO3LF-4300C-5BG256C offers a practical balance of logic capacity, I/O density and embedded memory within the MachXO3 family architecture. It is well suited to designs that need a non-volatile, reprogrammable FPGA with integrated peripheral IP and flexible clocking and I/O options.
Designed for commercial applications and delivered in a compact 256-LFBGA package, this device targets engineers building mid-density logic, interface bridging, and system control solutions who require on-chip configuration persistence and documented system-level features from a reputable manufacturer.
Request a quote or submit an inquiry for pricing and availability, and include the part number LCMXO3LF-4300C-5BG256C to receive lead-time and ordering information.

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