LCMXO3LF-4300C-5BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA

Quantity 329 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300C-5BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 256-LFBGA

The LCMXO3LF-4300C-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation, delivered in a 256-LFBGA surface-mount package. It combines a flexible on-chip architecture with non-volatile, multi-time programmable configuration and embedded system-level features aimed at mid-density logic and I/O-centric designs.

Key device attributes include 4,320 logic elements, 206 I/O pins, approximately 0.094 Mbits (94,208 bits) of embedded RAM and support for a 2.375 V to 3.465 V supply. The device is specified for commercial operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Logic Capacity  4,320 logic elements to implement moderate-density control, glue logic, and custom logic functions.
  • Embedded Memory  Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for small buffers, state storage, and FIFO configurations.
  • Large I/O Count  206 I/O pins with a high-performance, flexible I/O buffer architecture and pre‑engineered source-synchronous I/O options described in the MachXO3 family data sheet.
  • Configurable Clocking  Flexible on-chip clocking resources including sysCLOCK PLLs for system clocking and timing domain management (as documented for the MachXO3 family).
  • Non-volatile Configuration  Multi‑time programmable, non-volatile configuration with TransFR reconfiguration and User Flash Memory (UFM) support noted in the family data sheet.
  • Embedded Hardened IP  Includes hardened peripheral IP functions referenced in the datasheet such as I²C, SPI and timer/counter blocks to simplify common system tasks.
  • System and Test Features  On-chip features described in the data sheet include IEEE 1149.1-compliant boundary-scan testability, power-on-reset and standby/power-saving options.
  • Package & Power  256-LFBGA (supplier package 256-CABGA, 14×14) surface-mount package; recommended supply voltage range 2.375 V to 3.465 V; commercial grade (0 °C to 85 °C).
  • Compliance  RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic  Use the device’s 206 I/Os and flexible I/O buffering to implement bus adapters, protocol bridges and board-level interface conditioning.
  • Peripheral and System Control  Embedded hardened I²C, SPI and timer/counter IP blocks plus on-chip memory support common peripheral control and management tasks.
  • Prototyping and Low‑cost Migration  MachXO3 family features such as non-volatile, multi-time programming and documented low-cost migration paths make this device suitable for iterative development and product updates.

Unique Advantages

  • Balanced Integration:  Combines 4,320 logic elements with substantial I/O and embedded RAM to reduce external components for many mid-density designs.
  • Non-volatile Configuration:  Multi-time programmable, non-volatile configuration enables field updates and persistent system logic without external configuration devices.
  • On-board Peripheral IP:  Hardened I²C and SPI controllers and timer/counter blocks reduce FPGA fabric usage and simplify firmware integration.
  • Flexible Clocking and I/O:  Family-documented PLLs and configurable I/O help designers manage timing domains and implement source-synchronous interfaces.
  • Compact, Production-Ready Package:  256-LFBGA (256-CABGA, 14×14) surface-mount format supports dense PCB layouts while meeting commercial temperature requirements.

Why Choose LCMXO3LF-4300C-5BG256C?

The LCMXO3LF-4300C-5BG256C offers a practical balance of logic capacity, I/O density and embedded memory within the MachXO3 family architecture. It is well suited to designs that need a non-volatile, reprogrammable FPGA with integrated peripheral IP and flexible clocking and I/O options.

Designed for commercial applications and delivered in a compact 256-LFBGA package, this device targets engineers building mid-density logic, interface bridging, and system control solutions who require on-chip configuration persistence and documented system-level features from a reputable manufacturer.

Request a quote or submit an inquiry for pricing and availability, and include the part number LCMXO3LF-4300C-5BG256C to receive lead-time and ordering information.

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