LCMXO3LF-4300C-5BG324C

The LCMXO3LF-4300C-5BG324C is a MachXO3 family FPGA from Lattice Semiconductor designed as a non-volatile, multi-time programmable logic device. It combines a flexible logic fabric with on-chip RAM, extensive I/O, and hardened peripheral functions to address system control, interface bridging, and configurable glue logic in commercial applications.

Key architecture elements include 540 configurable logic blocks (CLBs) totaling 4,320 logic elements, approximately 0.094 Mbits of embedded RAM, and 279 I/O pins—delivered in a 324-ball LFBGA surface-mount package (supplier package: 324-CABGA, 15×15). The device operates from 2.375 V to 3.465 V and is specified for commercial temperatures (0 °C to 85 °C). It is RoHS compliant.

Key Features

• Logic Fabric  540 CLBs and 4,320 logic elements provide configurable resources for control, glue logic, and custom finite-state machines.
• Embedded Memory  Approximately 0.094 Mbits of on-chip RAM (sysMEM) supporting single, dual, pseudo‑dual port and FIFO modes as described in the MachXO3 family architecture.
• High I/O Count & Flexible I/O  279 I/O pins with pre‑engineered source synchronous I/O and a high‑performance, flexible I/O buffer architecture for diverse interfacing needs.
• On‑chip System Functions  Hardened peripheral blocks including I²C and SPI cores, timer/counter, on‑chip oscillator and User Flash Memory (UFM) for system control and configuration storage.
• Configuration & Reconfiguration  Non‑volatile, multi‑time programmable configuration with TransFR reconfiguration and enhanced system‑level support for field updates.
• Clocking  Flexible on‑chip clocking with sysCLOCK PLLs and distributed clock/control networks to support synchronous designs.
• Package & Mounting  324‑LFBGA package (supplier package 324‑CABGA, 15×15), surface‑mount mounting type suitable for production assembly.
• Electrical & Environmental  Operating voltage range 2.375 V to 3.465 V, commercial operating temperature 0 °C to 85 °C, and RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Adaptation  The combination of flexible I/O buffering and a high I/O count enables implementation of protocol translators and bus bridges.
• System Control and Glue Logic  Use the programmable logic and embedded peripherals to consolidate discrete controllers, timing, and control functions.
• Peripheral & Sensor Aggregation  Hardened I²C/SPI cores and plentiful I/O pins allow aggregation and preprocessing of sensor or peripheral data before system-level processing.
• Configuration Storage & Field Updates  Non‑volatile multi‑time programmability and User Flash Memory support field updates and configurable system behavior.

Unique Advantages

• High I/O density: 279 I/O pins provide flexibility to interface with multiple buses, sensors, and peripherals without external multiplexing.
• Integrated memory and logic: The combination of 4,320 logic elements and on‑chip RAM simplifies small to mid‑scale designs and reduces external component count.
• Built‑in peripheral IP: Hardened I²C, SPI and timer/counter blocks reduce development time and free logic fabric for application‑specific functions.
• Reconfigurable, non‑volatile operation: Multi‑time programmable configuration and TransFR reconfiguration enable field updates and flexible deployment models.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance meet common production and regulatory requirements for commercial products.
• Compact, surface‑mount package: 324‑ball LFBGA (15×15) offers a high‑density assembly option for space‑constrained PCBs.

Why Choose LCMXO3LF-4300C-5BG324C?

This MachXO3 device positions itself as a flexible, non‑volatile FPGA solution for commercial designs that require substantial I/O, integrated peripheral IP, and reprogrammable logic. Its combination of 4,320 logic elements, embedded RAM, and 279 I/O pins makes it suitable for consolidating interface logic, implementing protocol conversion, and handling system control tasks while reducing external component count.

Engineers and procurement teams targeting commercial‑grade embedded systems will find the LCMXO3LF-4300C-5BG324C delivers configurable system-level functionality in a compact 324‑LFBGA surface‑mount package, with a defined operating voltage range and temperature rating for predictable integration into production designs.

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