LCMXO3LF-4300C-5BG324I

The LCMXO3LF-4300C-5BG324I is a MachXO3 family FPGA offering 4,320 logic elements in a compact 324-LFBGA (324-CABGA, 15×15) surface-mount package. Designed for industrial-grade applications, the device combines a high I/O count and embedded memory with MachXO3 family architecture features to address board-level control, interface consolidation, and system glue logic needs.

With 279 I/O pins, support for a 2.375 V to 3.465 V supply range, and an operating temperature range of -40 °C to 100 °C, this device targets designs that require reliable operation across extended temperature and voltage conditions while keeping system integration and configuration flexibility.

Key Features

• Logic Density  4,320 logic elements provide flexible programmable resources for glue logic, control functions, and small to medium FPGA tasks.
• Embedded Memory  Approximately 0.094 Mbits of on-chip RAM (94,208 bits) to support FIFOs, small buffers, and data staging within the FPGA fabric.
• I/O and Packaging  A high 279-pin I/O count in a 324-LFBGA (324-CABGA, 15×15) surface-mount package enables dense interface integration on modern PCBs.
• Industrial Temperature Range  Specified for operation from -40 °C to 100 °C for deployment in industrial environments.
• Flexible Power  Operates from 2.375 V to 3.465 V supply rails to support a range of system power architectures.
• Non-volatile, Reconfigurable Architecture  Built on the MachXO3 family architecture which supports non-volatile, multi-time programmable configuration and in-field reconfiguration mechanisms.
• On-chip System Resources  Family-level features include sysMEM embedded block RAM, on-chip oscillator, system PLLs, and programmable I/O cells for clocking, timing, and interface flexibility.
• Embedded Hardened IP  MachXO3 family datasheet identifies hardened cores such as I²C, SPI, and timer/counter functions and user flash memory (UFM) for system storage and utility functions.
• System and Test Support  Family documentation includes configuration and testing support such as IEEE 1149.1 boundary-scan testability and device configuration facilities.
• Surface Mount Package  324-LFBGA package and surface-mount form factor suitable for modern board assembly and compact system designs.

Typical Applications

• Industrial Control and Automation  Use for sensor interfacing, board-level control, and real-time glue logic where industrial temperature range and robust I/O count are required.
• Communications and Interface Aggregation  Aggregate multiple interfaces or implement protocol bridging leveraging the high 279 I/O count and on-chip resources.
• Embedded System Glue Logic  Replace discrete logic and reduce BOM by consolidating control, reset, and configuration functions into a single programmable device.
• Configuration and Security Utilities  Leverage non-volatile configuration and user flash memory (UFM) for in-field updates, device personalization, and configuration storage.

Unique Advantages

• High I/O Integration: 279 I/O pins allow dense interface consolidation on a single device, reducing board complexity and connector count.
• Industrial-Grade Operation: Rated for -40 °C to 100 °C operation, supporting deployment in demanding industrial environments.
• Compact, Assembly-Ready Package: 324-LFBGA (324-CABGA, 15×15) surface-mount package enables compact system designs and standard PCB assembly.
• Non-volatile, Reprogrammable Configuration: MachXO3 family architecture provides multi-time programmable, non-volatile configuration and in-field reconfiguration capability for lifecycle flexibility.
• On-chip System Primitives: Integrated PLLs, on-chip oscillator, embedded RAM, and hardened IP blocks simplify design by reducing external components and software overhead.
• Testability and Configuration Support: Family-level support for IEEE 1149.1 boundary-scan and configuration features aids in manufacturing test and in-system updates.

Why Choose LCMXO3LF-4300C-5BG324I?

The LCMXO3LF-4300C-5BG324I positions itself as a flexible, industrial-grade MachXO3 family FPGA that balances logic capacity, extensive I/O, and on-chip resources in a compact 324-LFBGA package. Its operating voltage range and -40 °C to 100 °C rating make it suitable for controllers and interface-heavy systems that demand reliable operation across varied conditions.

Engineers and procurement teams seeking a programmable device for system glue logic, protocol bridging, and embedded control will find the LCMXO3LF-4300C-5BG324I offers a streamlined integration path with family-provided features such as non-volatile configuration, embedded memory, PLLs, and hardened peripheral IP to reduce BOM and simplify system design.

Request a quote or submit your requirements to get pricing and availability for the LCMXO3LF-4300C-5BG324I. Our team can assist with lead times and compatibility details for your design cycle.