LCMXO3LF-4300C-5BG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 1,010 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3LF-4300C-5BG256I – MachXO3 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA
The LCMXO3LF-4300C-5BG256I is a MachXO3 family FPGA offering non-volatile, multi-time programmable logic in a compact 256‑LFBGA (14×14) package. It combines a moderate logic capacity with on-chip embedded memory, flexible I/O, and system-level peripherals targeted at industrial and embedded control applications.
With 4,320 logic elements, 206 I/O pins, an operating range of 2.375 V to 3.465 V, and an industrial temperature rating from -40 °C to 100 °C, this device is built for designs that require reconfigurable logic, compact packaging, and a broad supply/temperature envelope.
Key Features
- Core Logic Provides 4,320 logic elements to implement combinational and sequential logic functions for glue logic, interface bridging, and control tasks.
- Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM via the sysMEM embedded block RAM subsystem, supporting single/dual/pseudo-dual port and FIFO modes.
- Rich I/O Resources 206 I/O pins with pre‑engineered source‑synchronous support and a high‑performance, flexible I/O buffer architecture for diverse signalling and interface needs.
- Clocking and Timing Flexible on‑chip clocking including sysCLOCK PLLs and clock distribution features to support system timing requirements.
- Embedded Hardened IP Includes hardened I²C and SPI IP cores, and a hardware timer/counter block, reducing external IP integration effort.
- Non‑volatile Configuration Device supports non‑volatile, multi‑time programming and TransFR reconfiguration for in-system updates and iterative development.
- System and Power Features On‑chip oscillator, user flash memory (UFM), standby and power‑saving options, and hot‑socketing behavior for system flexibility and lower BOM complexity.
- Package, Mounting and Compliance Surface-mount 256‑LFBGA (256‑CABGA 14×14 supplier package) with RoHS compliance and an industrial grade rating.
- Electrical and Environmental Supply voltage range 2.375 V to 3.465 V and an operating temperature range of -40 °C to 100 °C suitable for industrial environments.
Typical Applications
- Industrial Control Implement control logic, signal conditioning, and interface bridging in industrial equipment that requires an extended temperature range and industrial grade components.
- Interface and Protocol Bridging Use flexible I/O and embedded hardened I²C/SPI IP for protocol conversion, sensor aggregation, and board‑level glue logic.
- Embedded System Integration Integrate control functions, timers, and small buffering using the on‑chip RAM and timer/counter resources within compact form‑factor designs.
- Configuration‑Updatable Systems Leverage non‑volatile, multi‑time programmable configuration and TransFR reconfiguration for systems requiring field updates or iterative feature rollouts.
Unique Advantages
- Highly integrated functionality: Combines logic, embedded RAM, hardened IP blocks, PLLs, and an on‑chip oscillator to reduce external component count.
- Non‑volatile reconfigurability: Multi‑time programmable configuration and TransFR support enable in‑system updates without external flash.
- Broad I/O capability: 206 I/O pins with source‑synchronous I/O support simplify interfacing to parallel buses and high‑pin count peripherals.
- Industrial readiness: Industrial operating temperature range (-40 °C to 100 °C) and RoHS compliance for deployment in harsher environments.
- Compact packaging: 256‑LFBGA (14×14) provides a small footprint for dense board designs while maintaining substantial I/O and logic resources.
- System-level primitives: Embedded hardened I²C/SPI and timer/counter blocks accelerate development and lower integration risk for common system functions.
Why Choose LCMXO3LF-4300C-5BG256I?
The LCMXO3LF-4300C-5BG256I positions MachXO3 family capabilities in a compact, industrial‑grade package that balances logic capacity, embedded memory, and extensive I/O. Its combination of non‑volatile configuration, hardened IP blocks, and flexible clocking options make it suitable for designers needing a reliable, field‑updatable FPGA solution for control, interface, and embedded functions.
This device is well suited to engineering teams and procurement groups building compact industrial and embedded systems that require a moderate logic resource, robust I/O, and system-level peripherals without adding external configuration memory or dedicated interface controllers.
Request a quote or submit a procurement inquiry to get pricing, lead‑time, and availability for the LCMXO3LF-4300C-5BG256I.