LCMXO3LF-2100E-6MG324C

The LCMXO3LF-2100E-6MG324C is a MachXO3 family FPGA from Lattice Semiconductor, delivered in a 324-ball Very Fine-pitch BGA (10×10) package for surface-mount applications. This non-volatile, multi-time programmable FPGA provides a compact, reconfigurable logic platform combining programmable I/O, embedded memory, and on-chip system resources suitable for commercial electronic designs.

With 2,112 logic elements, 268 I/Os, and approximately 0.072 Mbits (75,776 bits) of on-chip RAM, the device targets compact control, interface and glue-logic functions where integration, flexible I/O and low-voltage operation are important.

Key Features

• Logic Capacity — 2,112 logic elements enable implementation of moderate-density glue logic, state machines and control functions.
• On-chip Memory — Approximately 0.072 Mbits of embedded RAM (75,776 bits) supporting small FIFOs, buffering and local storage.
• I/O Count & Flexibility — 268 programmable I/Os with family-level support for flexible I/O buffers and source-synchronous I/O (as described in the MachXO3 family datasheet).
• Package & Mounting — 324-ball VFBGA (324-CSFBGA 10×10) package optimized for compact PCB layouts and surface-mount assembly.
• Power Supply — Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial-class electronics.
• Non-volatile Configuration & System Features — Part of the MachXO3 family which includes non-volatile, multi-time programmable configuration, on-chip oscillator, user flash memory (UFM), programmable clocking (PLLs) and embedded hardened IP blocks referenced in the family datasheet.
• Standards & Compliance — RoHS-compliant for lead-free assembly and regulatory consistency in commercial product builds.

Typical Applications

• Interface Bridging and Protocol Conversion — Use the 268 I/Os and flexible I/O buffering to implement protocol translation and board-level interface glue.
• Control and System Glue Logic — 2,112 logic elements provide resources for power sequencing, peripheral control, and custom state machines in compact systems.
• Local Buffering and Small FIFO Functions — Embedded RAM and sysMEM modes (described in the family datasheet) support short-term buffering and FIFO implementations for data flow management.
• Compact Consumer and Commercial Products — The 324-VFBGA package and commercial temperature rating make the device suitable for space-constrained, commercial electronic products requiring reprogrammable logic.

Unique Advantages

• Compact, Surface-Mount Form Factor: 324-ball VFBGA (10×10) enables high-density PCB integration while conserving board area.
• Low-Voltage Core: 1.14 V–1.26 V supply supports designs targeting modern low-voltage power domains.
• Integrated System Resources: Family-level features such as on-chip oscillators, PLLs, user flash memory and hardened IP cores reduce external component count and simplify design.
• High I/O Density: 268 programmable I/Os allow extensive peripheral interfacing without external multiplexing logic.
• Commercial-Grade Reliability: 0 °C–85 °C operating range and RoHS compliance align the device with standard commercial manufacturing and deployment requirements.

Why Choose LCMXO3LF-2100E-6MG324C?

This MachXO3-family FPGA balances reprogrammable logic capacity, dense I/O, and integrated system features in a compact 324-VFBGA package. It is well suited to designers building commercial electronic products that require flexible interface logic, local buffering and programmable control while minimizing BOM complexity.

As part of the MachXO3 family, the device benefits from family-level architecture and system resources outlined in the MachXO3 datasheet, providing designers a predictable platform for migration and integration in medium-density, commercial applications.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO3LF-2100E-6MG324C. Our team can provide lead-time information and support for procurement and design planning.