LCMXO3LF-2100E-6MG121C

IC FPGA 100 I/O 121CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA

Quantity 68 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package121-CSFBGA (6x6)GradeCommercialOperating Temperature0°C – 85°C
Package / Case121-VFBGA, CSPBGANumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3LF-2100E-6MG121C – MachXO3 FPGA, 121-CSFBGA (6×6)

The LCMXO3LF-2100E-6MG121C is a MachXO3 family Field Programmable Gate Array (FPGA) supplied in a 121-pin CSP/BGA package. This commercial-grade device provides a compact, non‑volatile FPGA option with on-chip memory and flexible I/O for embedded and system-level designs.

Built on the MachXO3 architecture, the device combines reconfigurable logic, embedded RAM, and hardened peripheral IP to address interface customization, glue-logic consolidation, and system control tasks while operating from a 1.14 V to 1.26 V supply and a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic  Contains 2,112 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory  Approximately 75,776 bits of on-chip RAM for FIFOs, small buffers, and local data storage.
  • I/O Capacity  Up to 100 general-purpose I/Os with support for source-synchronous interfaces and flexible I/O buffer configurations.
  • Non-volatile, Multi-time Programmable  MachXO3 family non-volatile configuration and multiple reconfiguration modes (including TransFR) for field updates and flexible deployment.
  • Clocking  Flexible on-chip clocking resources including sysCLOCK PLLs for system timing and coordination.
  • Hardened Peripheral IP  Embedded hardened functions such as I²C, SPI and timer/counter blocks to reduce external component count and simplify designs.
  • User Flash Memory (UFM)  On-chip UFM for storing configuration, parameters, or small data sets.
  • Package & Mounting  121-pin CSFBGA (6×6 mm) surface-mount package for compact board integration.
  • Power & Temperature  Supply voltage range: 1.14 V to 1.26 V. Commercial operating range: 0 °C to 85 °C.
  • System-Level Features  Includes standby and power-saving options, hot-socketing support, and boundary-scan testability for improved system integration and test.

Typical Applications

  • Interface Bridging and Glue Logic  Use the device’s 100 I/Os and flexible I/O buffers to consolidate interface translation and glue logic on a single compact FPGA.
  • Embedded System Control  Deploy as a system controller using on-chip memory, timers, and user flash to manage board-level functions and configuration data.
  • Peripheral and Sensor Aggregation  Integrate SPI, I²C, and GPIO control to aggregate peripherals and sensors while minimizing external components.
  • Low- to Mid-Density Logic Integration  Implement custom logic functions and small state machines using the 2,112 logic elements and embedded RAM for localized data buffering.

Unique Advantages

  • Compact, Non-volatile FPGA:  Combines reconfigurable logic and on-chip non-volatile configuration to simplify BOM and enable field reprogramming without external configuration devices.
  • Integrated Peripheral IP:  Hardened I²C, SPI and timers reduce the need for discrete controllers and speed time-to-market.
  • Flexible I/O and Clocking:  Source-synchronous I/O support and on-chip PLLs provide practical options for coordinating external interfaces and system timing.
  • Family Scalability:  Part of the MachXO3 family, offering migration and density options across the same architecture for future design scaling.
  • Test and System Support:  Boundary-scan testability and hot-socketing capabilities improve manufacturability and serviceability in production environments.

Why Choose LCMXO3LF-2100E-6MG121C?

The LCMXO3LF-2100E-6MG121C positions itself as a compact, commercially graded FPGA solution that balances reconfigurability, embedded resources and system-level features. With 2,112 logic elements, roughly 75,776 bits of embedded RAM, 100 I/Os and hardened peripheral IP, it is suited to designers who need to consolidate interfaces, implement control logic, or add flexible I/O capabilities in space-constrained designs.

Being part of the MachXO3 family, the device offers architecture-level consistency and available migration paths, enabling designers to scale or adapt designs across related devices while retaining the benefits of on-chip configuration, embedded memory and system integration features.

Request a quote or submit an inquiry to receive pricing, availability, and assistance integrating the LCMXO3LF-2100E-6MG121C into your next design.

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