LCMXO3LF-2100E-6MG121C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA |
|---|---|
| Quantity | 68 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 121-CSFBGA (6x6) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 121-VFBGA, CSPBGA | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3LF-2100E-6MG121C – MachXO3 FPGA, 121-CSFBGA (6×6)
The LCMXO3LF-2100E-6MG121C is a MachXO3 family Field Programmable Gate Array (FPGA) supplied in a 121-pin CSP/BGA package. This commercial-grade device provides a compact, non‑volatile FPGA option with on-chip memory and flexible I/O for embedded and system-level designs.
Built on the MachXO3 architecture, the device combines reconfigurable logic, embedded RAM, and hardened peripheral IP to address interface customization, glue-logic consolidation, and system control tasks while operating from a 1.14 V to 1.26 V supply and a 0 °C to 85 °C temperature range.
Key Features
- Core Logic Contains 2,112 logic elements for implementing combinational and sequential logic functions.
- Embedded Memory Approximately 75,776 bits of on-chip RAM for FIFOs, small buffers, and local data storage.
- I/O Capacity Up to 100 general-purpose I/Os with support for source-synchronous interfaces and flexible I/O buffer configurations.
- Non-volatile, Multi-time Programmable MachXO3 family non-volatile configuration and multiple reconfiguration modes (including TransFR) for field updates and flexible deployment.
- Clocking Flexible on-chip clocking resources including sysCLOCK PLLs for system timing and coordination.
- Hardened Peripheral IP Embedded hardened functions such as I²C, SPI and timer/counter blocks to reduce external component count and simplify designs.
- User Flash Memory (UFM) On-chip UFM for storing configuration, parameters, or small data sets.
- Package & Mounting 121-pin CSFBGA (6×6 mm) surface-mount package for compact board integration.
- Power & Temperature Supply voltage range: 1.14 V to 1.26 V. Commercial operating range: 0 °C to 85 °C.
- System-Level Features Includes standby and power-saving options, hot-socketing support, and boundary-scan testability for improved system integration and test.
Typical Applications
- Interface Bridging and Glue Logic Use the device’s 100 I/Os and flexible I/O buffers to consolidate interface translation and glue logic on a single compact FPGA.
- Embedded System Control Deploy as a system controller using on-chip memory, timers, and user flash to manage board-level functions and configuration data.
- Peripheral and Sensor Aggregation Integrate SPI, I²C, and GPIO control to aggregate peripherals and sensors while minimizing external components.
- Low- to Mid-Density Logic Integration Implement custom logic functions and small state machines using the 2,112 logic elements and embedded RAM for localized data buffering.
Unique Advantages
- Compact, Non-volatile FPGA: Combines reconfigurable logic and on-chip non-volatile configuration to simplify BOM and enable field reprogramming without external configuration devices.
- Integrated Peripheral IP: Hardened I²C, SPI and timers reduce the need for discrete controllers and speed time-to-market.
- Flexible I/O and Clocking: Source-synchronous I/O support and on-chip PLLs provide practical options for coordinating external interfaces and system timing.
- Family Scalability: Part of the MachXO3 family, offering migration and density options across the same architecture for future design scaling.
- Test and System Support: Boundary-scan testability and hot-socketing capabilities improve manufacturability and serviceability in production environments.
Why Choose LCMXO3LF-2100E-6MG121C?
The LCMXO3LF-2100E-6MG121C positions itself as a compact, commercially graded FPGA solution that balances reconfigurability, embedded resources and system-level features. With 2,112 logic elements, roughly 75,776 bits of embedded RAM, 100 I/Os and hardened peripheral IP, it is suited to designers who need to consolidate interfaces, implement control logic, or add flexible I/O capabilities in space-constrained designs.
Being part of the MachXO3 family, the device offers architecture-level consistency and available migration paths, enabling designers to scale or adapt designs across related devices while retaining the benefits of on-chip configuration, embedded memory and system integration features.
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