LCMXO3LF-2100E-6MG121I

The LCMXO3LF-2100E-6MG121I is a MachXO3 family FPGA offering a compact, surface-mount solution for industrial embedded control and interface tasks. It combines a flexible programmable fabric with on-chip memory, programmable I/O, and family-level features described in the MachXO3 datasheet to support system-level control, I/O bridging, and peripheral management.

Designed for industrial-temperature operation and low-voltage supply environments, this device targets applications that require reprogrammable logic, embedded memory, and a high pin count in a 121-ball VFBGA/CSPBGA package.

Key Features

• Programmable Logic: 2,112 logic elements for implementing custom glue logic, state machines, and small to medium control functions.
• Embedded Memory: Approximately 75,776 bits of on-chip RAM for FIFOs, small buffers, and local data storage.
• I/O Capacity: 100 available I/Os to support dense peripheral and bus interfacing.
• Supply and Power: Operates from a core supply range of 1.14 V to 1.26 V as specified in the device data.
• Industrial Temperature: Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package & Mounting: 121-VFBGA (CSPBGA) 121-CSFBGA (6×6) supplier device package; surface-mount mounting for compact PCB integration.
• Non-volatile Configuration: MachXO3 family features in the datasheet include non-volatile, multi-time programmable configuration and TransFR reconfiguration capability for field updates.
• On-chip System Resources: Family-level resources documented in the datasheet include programmable I/O cells, PLL-based clocking, on-chip oscillator, embedded block RAM (sysMEM), and hardened IP such as I²C and SPI controllers and timers/counters.
• Power Management & Reliability: The MachXO3 family datasheet describes standby and power-saving options plus power-on-reset and configuration/test features to support robust system behavior.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Industrial Control: Implement control logic, sensor interfacing and peripheral aggregation using the device’s programmable logic, I/O resources and hardened SPI/I²C IP described in the family datasheet.
• Interface Bridging: Bridge and translate between buses or legacy interfaces using the programmable I/O cells and on-chip memory for buffering.
• Embedded System Glue: Replace discrete logic with compact FPGA-based glue logic to reduce BOM and centralize timing and control functions within the 121-ball VFBGA package.
• Peripheral Management: Offload timers, counters and serial peripheral control (I²C/SPI) to on-chip hardened IP to free host CPU resources and consolidate system functions.

Unique Advantages

• Highly Integrated, Compact Package: 121-ball VFBGA (6×6) package and surface-mount mounting enable space-efficient board layouts while providing 100 I/Os.
• Industrial-Grade Operation: Specified for −40 °C to 100 °C operation to meet the thermal requirements of industrial applications.
• Deterministic Low-Voltage Core: Narrow core supply window (1.14 V–1.26 V) supports controlled power budgeting and predictable power sequencing.
• On-chip Memory and Logic Balance: 2,112 logic elements paired with approximately 75,776 bits of embedded RAM enable a range of control, buffering and small data-path implementations without external RAM.
• Family-Level System IP: MachXO3 family features include PLLs, on-chip oscillator, programmable I/O and hardened I²C/SPI—simplifying integration of common system functions.
• Compliance and Assembly: RoHS-compliant construction supports environmental requirements for modern electronics manufacturing.

Why Choose LCMXO3LF-2100E-6MG121I?

The LCMXO3LF-2100E-6MG121I provides a compact, industrial-grade reprogrammable logic option that balances logic density, embedded memory and I/O capacity in a 121-ball VFBGA package. Its documented MachXO3 family features—non-volatile multi-time programmability, programmable I/O, embedded block RAM and hardened peripheral IP—help centralize system functions, reduce BOM and simplify board-level integration.

This device is well suited to designers building industrial control, interface bridging and peripheral management solutions who need reprogrammability, reliable industrial-temperature operation and a compact surface-mount package. Choosing this MachXO3 part delivers a scalable, supportable building block aligned with the family-level capabilities described in the vendor datasheet.

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