LCMXO3LF-2100E-6MG324I

The LCMXO3LF-2100E-6MG324I is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for mid-density logic and flexible I/O integration. It delivers 2,112 logic elements, approximately 0.076 Mbits of embedded RAM (75,776 bits), and up to 268 I/O pins in a compact 324-VFBGA package.

Built for configurable system functions, this device combines non-volatile, multi-time programmable architecture with on-chip memory, hardened peripheral IP and flexible clocking to address interface bridging, control logic and configuration tasks in industrial applications.

Key Features

• Core and Logic  2,112 logic elements and 264 CLBs provide mid-density programmable logic resources for glue logic, state machines and control functions.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM (sysMEM) with single/dual/pseudo-dual port and FIFO modes for buffering and temporary data storage.
• I/O and Interface  Up to 268 I/Os with pre‑engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture for diverse interface needs.
• Clocking and Timing  Flexible on-chip clocking with sysCLOCK PLLs and an on-chip oscillator to support a range of timing and synchronization requirements.
• Hardened Peripheral IP  Embedded hardened IP including I²C, SPI and timer/counter blocks to offload common serial and timing tasks from fabric.
• Non-volatile Configuration  Multi-time programmable non-volatile architecture and TransFR reconfiguration options for in-system updates and persistent configuration.
• Packaging and Power  324-VFBGA (supplier package: 324-CSFBGA, 10×10) surface-mount package; nominal core supply range 1.14 V to 1.26 V.
• Industrial Reliability  Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulated environments.
• Test and Configuration Support  Includes IEEE 1149.1-compliant boundary-scan testability and on-chip configuration and testing features for manufacturing and debug.

Typical Applications

• Interface Bridging and Glue Logic  Use the abundant I/O and source-synchronous support to implement protocol conversion, bus interfacing and board-level glue logic.
• System Control and Configuration  Non-volatile, multi-time programmable configuration and embedded peripherals make the device suitable for control tasks and persistent system setup.
• Data Buffering and FIFO Management  Embedded sysMEM with FIFO modes supports temporary buffering, rate adaptation and small data queuing functions.
• Peripheral and Serial Controllers  Hardened I²C and SPI blocks reduce firmware overhead for sensor and peripheral management.

Unique Advantages

• Highly integrated mid-density FPGA: 2,112 logic elements and 268 I/Os combine programmable logic and rich connectivity to reduce external glue components.
• Persistent configuration with in-system reprogramming: Multi-time programmable non-volatile architecture and TransFR reconfiguration allow field updates without external flash.
• Flexible I/O and timing toolkit: Source-synchronous I/O, flexible I/O buffers and on-chip PLLs simplify timing-critical interface design.
• Industrial temperature range: Guaranteed operation from −40 °C to 100 °C supports deployment in a wide range of industrial environments.
• Compact, high-density package: 324-VFBGA (324-CSFBGA, 10×10) provides a space-efficient footprint for board-level integration.
• Compliance and manufacturability: RoHS compliance and IEEE 1149.1 boundary-scan support aid regulatory and production testing workflows.

Why Choose LCMXO3LF-2100E-6MG324I?

The LCMXO3LF-2100E-6MG324I brings MachXO3 family architecture into a compact, industrial-grade FPGA targeted at designs needing mid-level programmable logic, high I/O count and non-volatile configuration. Its combination of 2,112 logic elements, embedded RAM, hardened serial IP and flexible clocking suits a variety of system-level functions where persistent configuration and reliable operation across −40 °C to 100 °C are required.

This device is appropriate for teams seeking a balanced mix of integration and configurability—reducing external components while retaining in-system reprogrammability and built-in peripheral blocks that accelerate implementation and reduce firmware overhead.

Request a quote or submit a procurement inquiry for LCMXO3LF-2100E-6MG324I to check availability and pricing for your next design.