LCMXO3LF-4300C-5BG400C

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 94208 4320 400-LFBGA

Quantity 858 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300C-5BG400C – MachXO3 Field Programmable Gate Array (FPGA) IC 335 94208 4320 400-LFBGA

The LCMXO3LF-4300C-5BG400C is a MachXO3 family FPGA offering non-volatile, multi-time programmable logic in a compact 400-LFBGA package. It provides a balanced combination of logic resources, I/O density, embedded memory and on-chip peripherals targeted at commercial embedded system designs.

With 4,320 logic elements, approximately 94 kbits of embedded RAM, and 335 I/O, this device is suited for applications that require flexible I/O interfacing, on-chip memory buffering, and field reconfiguration using features such as TransFR reconfiguration and integrated configuration memory.

Key Features

  • Core Logic  4,320 logic elements for implementing glue logic, control state machines and custom datapaths.
  • Embedded Memory  Approximately 94 kbits of on-chip RAM (94,208 bits) with sysMEM block support for single/dual-port and FIFO modes.
  • I/O and Packaging  335 I/O pins in a surface-mount 400-LFBGA package; supplier package listed as 400-CABGA (17x17).
  • Power and Temperature  Supported supply range from 2.375 V to 3.465 V and commercial operating temperature range 0 °C to 85 °C.
  • Non-volatile, Multi-time Programmable Configuration  Built-in non-volatile configuration enables persistent logic without external configuration memory and supports multi-time programming.
  • Reconfiguration and System Support  TransFR reconfiguration and enhanced system-level support for in-system updates and flexible deployment.
  • On-chip Clocking and PLLs  Flexible on-chip clocking architecture including sysCLOCK Phase Locked Loops for local clock management.
  • Embedded Hardened IP  Includes hardened IP functions documented in the MachXO3 family data sheet such as I2C and SPI IP cores, timer/counter, and an on-chip oscillator.
  • System and Testability  Features for device configuration, IEEE 1149.1-compliant boundary scan testability and user flash memory (UFM) for system data storage.
  • Compliance  RoHS compliant for environmental regulatory conformity.

Typical Applications

  • Interface Bridging and I/O Expansion  High I/O count and flexible I/O buffering make the device suitable for bridging between disparate interfaces or expanding system I/O.
  • System Control and Glue Logic  Logic density and integrated peripherals support control functions, state machines and board-level glue logic in commercial embedded systems.
  • On-chip Data Buffering and FIFO Handling  sysMEM block RAM with FIFO modes enables temporary buffering and data alignment tasks within data paths.
  • Field Reconfiguration and System Updates  Non-volatile configuration and TransFR reconfiguration enable in-system updates and flexible deployment scenarios.

Unique Advantages

  • Balanced Integration: Combines 4,320 logic elements with approximately 94 kbits of embedded RAM and 335 I/O to reduce external components and simplify board design.
  • Persistent, Reprogrammable Configuration: Non-volatile, multi-time programmable configuration plus TransFR reconfiguration allows controlled in-field updates without external configuration flash.
  • On-chip Hardened IP: Hardened I2C, SPI, timers and an on-chip oscillator reduce development time for common system functions.
  • Flexible Clocking: sysCLOCK PLLs and on-chip clock resources provide local clock management options for diverse timing requirements.
  • Commercial Temperature and Broad Supply Range: Operates across a 2.375 V to 3.465 V supply range and 0 °C to 85 °C, matching common commercial embedded environment requirements.
  • Compact, Surface-Mount Packaging: 400-LFBGA / 400-CABGA footprint provides high density in a compact board area for space-constrained designs.

Why Choose LCMXO3LF-4300C-5BG400C?

As a member of the MachXO3 family, the LCMXO3LF-4300C-5BG400C delivers a combination of reprogrammable non-volatile logic, embedded memory and a rich set of on-chip peripherals tailored for commercial embedded designs. Its 4,320 logic elements and 335 I/O support complex glue logic and interface tasks while minimizing external components.

This device is well suited to designers who need compact packaging, flexible on-chip clocking and reconfiguration capabilities for in-system updates. The MachXO3 family architecture and documented features provide a predictable platform for building scalable and reconfigurable commercial applications.

Request a quote or submit a quotation request to receive pricing and availability for the LCMXO3LF-4300C-5BG400C.

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