LCMXO3LF-4300C-5BG400C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 94208 4320 400-LFBGA |
|---|---|
| Quantity | 858 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3LF-4300C-5BG400C – MachXO3 Field Programmable Gate Array (FPGA) IC 335 94208 4320 400-LFBGA
The LCMXO3LF-4300C-5BG400C is a MachXO3 family FPGA offering non-volatile, multi-time programmable logic in a compact 400-LFBGA package. It provides a balanced combination of logic resources, I/O density, embedded memory and on-chip peripherals targeted at commercial embedded system designs.
With 4,320 logic elements, approximately 94 kbits of embedded RAM, and 335 I/O, this device is suited for applications that require flexible I/O interfacing, on-chip memory buffering, and field reconfiguration using features such as TransFR reconfiguration and integrated configuration memory.
Key Features
- Core Logic 4,320 logic elements for implementing glue logic, control state machines and custom datapaths.
- Embedded Memory Approximately 94 kbits of on-chip RAM (94,208 bits) with sysMEM block support for single/dual-port and FIFO modes.
- I/O and Packaging 335 I/O pins in a surface-mount 400-LFBGA package; supplier package listed as 400-CABGA (17x17).
- Power and Temperature Supported supply range from 2.375 V to 3.465 V and commercial operating temperature range 0 °C to 85 °C.
- Non-volatile, Multi-time Programmable Configuration Built-in non-volatile configuration enables persistent logic without external configuration memory and supports multi-time programming.
- Reconfiguration and System Support TransFR reconfiguration and enhanced system-level support for in-system updates and flexible deployment.
- On-chip Clocking and PLLs Flexible on-chip clocking architecture including sysCLOCK Phase Locked Loops for local clock management.
- Embedded Hardened IP Includes hardened IP functions documented in the MachXO3 family data sheet such as I2C and SPI IP cores, timer/counter, and an on-chip oscillator.
- System and Testability Features for device configuration, IEEE 1149.1-compliant boundary scan testability and user flash memory (UFM) for system data storage.
- Compliance RoHS compliant for environmental regulatory conformity.
Typical Applications
- Interface Bridging and I/O Expansion High I/O count and flexible I/O buffering make the device suitable for bridging between disparate interfaces or expanding system I/O.
- System Control and Glue Logic Logic density and integrated peripherals support control functions, state machines and board-level glue logic in commercial embedded systems.
- On-chip Data Buffering and FIFO Handling sysMEM block RAM with FIFO modes enables temporary buffering and data alignment tasks within data paths.
- Field Reconfiguration and System Updates Non-volatile configuration and TransFR reconfiguration enable in-system updates and flexible deployment scenarios.
Unique Advantages
- Balanced Integration: Combines 4,320 logic elements with approximately 94 kbits of embedded RAM and 335 I/O to reduce external components and simplify board design.
- Persistent, Reprogrammable Configuration: Non-volatile, multi-time programmable configuration plus TransFR reconfiguration allows controlled in-field updates without external configuration flash.
- On-chip Hardened IP: Hardened I2C, SPI, timers and an on-chip oscillator reduce development time for common system functions.
- Flexible Clocking: sysCLOCK PLLs and on-chip clock resources provide local clock management options for diverse timing requirements.
- Commercial Temperature and Broad Supply Range: Operates across a 2.375 V to 3.465 V supply range and 0 °C to 85 °C, matching common commercial embedded environment requirements.
- Compact, Surface-Mount Packaging: 400-LFBGA / 400-CABGA footprint provides high density in a compact board area for space-constrained designs.
Why Choose LCMXO3LF-4300C-5BG400C?
As a member of the MachXO3 family, the LCMXO3LF-4300C-5BG400C delivers a combination of reprogrammable non-volatile logic, embedded memory and a rich set of on-chip peripherals tailored for commercial embedded designs. Its 4,320 logic elements and 335 I/O support complex glue logic and interface tasks while minimizing external components.
This device is well suited to designers who need compact packaging, flexible on-chip clocking and reconfiguration capabilities for in-system updates. The MachXO3 family architecture and documented features provide a predictable platform for building scalable and reconfigurable commercial applications.
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