LCMXO3LF-4300C-6BG324C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 279 94208 4320 324-LFBGA |
|---|---|
| Quantity | 1,035 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CABGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 279 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3LF-4300C-6BG324C – MachXO3 Field Programmable Gate Array (FPGA) – 324-LFBGA
The LCMXO3LF-4300C-6BG324C is a MachXO3 family FPGA in a 324-LFBGA (324-CABGA, 15×15) package designed for commercial-grade embedded designs. It combines 4,320 logic elements and approximately 94 kbits of on-chip RAM with flexible I/O and on-chip peripherals to support glue-logic, control and interface tasks.
With up to 279 I/O, a broad supply range of 2.375 V to 3.465 V, and a 0 °C to 85 °C operating range, this device targets applications that require moderate logic capacity, embedded memory, and integrated peripheral IP in a surface-mount BGA package.
Key Features
- Core Logic 4,320 logic elements suitable for mid-range FPGA functions and system glue logic.
- Embedded Memory Approximately 94 kbits of on-chip RAM with support for single, dual, pseudo-dual port and FIFO modes as described in the MachXO3 family datasheet.
- I/O Capacity Up to 279 programmable I/O pins to support wide peripheral and bus interfacing requirements.
- On-Chip Peripherals Datasheet-listed hardened IP including I²C and SPI cores and a timer/counter, plus a user flash memory (UFM) for non-volatile storage and configuration data.
- Clocking and Timing Flexible on-chip clocking with sysCLOCK PLLs and an internal oscillator for system and timing functions described in the MachXO3 documentation.
- Configuration and Reliability Non-volatile, multi-time programmable device architecture with TransFR reconfiguration, IEEE 1149.1 boundary-scan testability, and hot-socketing support as outlined in the family datasheet.
- Power and Operating Range Supply voltage range of 2.375 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
- Package and Mounting 324-LFBGA (324-CABGA, 15×15) package; surface-mount mounting type for compact board-level integration.
- Compliance RoHS-compliant.
Typical Applications
- System Glue Logic Use the 4,320 logic elements and up to 279 I/O to consolidate interface logic and glue functions between processors, peripherals, and custom subsystems.
- Peripheral Bridging and Protocol Conversion Leverage hardened I²C and SPI IP cores and flexible I/O to implement bus bridging, protocol adaptation, and peripheral aggregation.
- Buffered Interfaces and Data FIFO Built-in sysMEM and FIFO configuration options make the device suitable for buffering, data alignment, and temporary storage in embedded interfaces.
- Embedded Control and Timing On-chip PLLs, oscillator, and timer/counter IP support local timing, clock management, and control tasks within systems.
Unique Advantages
- Right-sized Logic Density: 4,320 logic elements provide a balance of capacity and cost for mid-range embedded designs without unnecessary overhead.
- Integrated Memory and FIFO Modes: Approximately 94 kbits of on-chip RAM with multiple memory modes reduces external RAM requirements for many buffering and state-storage tasks.
- High I/O Count: Up to 279 I/O pins handle complex interfacing needs, minimizing additional I/O expander components.
- Embedded Hardened IP: Built-in I²C, SPI, and timer/counter cores accelerate development by providing ready-made peripheral functions documented in the MachXO3 family datasheet.
- Flexible Clocking and Configuration: On-chip PLLs, oscillator, and non-volatile multi-time programmable configuration simplify system clock management and field updates.
- Commercial-Grade Packaging: Surface-mount 324-LFBGA (15×15) footprint supports dense board layouts and standard assembly processes.
Why Choose LCMXO3LF-4300C-6BG324C?
The LCMXO3LF-4300C-6BG324C offers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 324-LFBGA package for commercial embedded systems. Its MachXO3 family architecture provides non-volatile, multi-time programmable configuration, integrated peripheral IP, and flexible clocking options that help reduce external component count and simplify system design.
This device is well suited to engineers and procurement teams building mid-range control, interface, or buffering functions who need verified on-chip peripherals, versatile memory modes, and a defined operating and supply range supported by the MachXO3 family documentation.
Request a quote or contact sales to check availability, pricing, and lead times for the LCMXO3LF-4300C-6BG324C.

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