LCMXO3LF-4300C-6BG324C

IC FPGA 279 I/O 324CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 279 94208 4320 324-LFBGA

Quantity 1,035 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-CABGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LFBGANumber of I/O279Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300C-6BG324C – MachXO3 Field Programmable Gate Array (FPGA) – 324-LFBGA

The LCMXO3LF-4300C-6BG324C is a MachXO3 family FPGA in a 324-LFBGA (324-CABGA, 15×15) package designed for commercial-grade embedded designs. It combines 4,320 logic elements and approximately 94 kbits of on-chip RAM with flexible I/O and on-chip peripherals to support glue-logic, control and interface tasks.

With up to 279 I/O, a broad supply range of 2.375 V to 3.465 V, and a 0 °C to 85 °C operating range, this device targets applications that require moderate logic capacity, embedded memory, and integrated peripheral IP in a surface-mount BGA package.

Key Features

  • Core Logic  4,320 logic elements suitable for mid-range FPGA functions and system glue logic.
  • Embedded Memory  Approximately 94 kbits of on-chip RAM with support for single, dual, pseudo-dual port and FIFO modes as described in the MachXO3 family datasheet.
  • I/O Capacity  Up to 279 programmable I/O pins to support wide peripheral and bus interfacing requirements.
  • On-Chip Peripherals  Datasheet-listed hardened IP including I²C and SPI cores and a timer/counter, plus a user flash memory (UFM) for non-volatile storage and configuration data.
  • Clocking and Timing  Flexible on-chip clocking with sysCLOCK PLLs and an internal oscillator for system and timing functions described in the MachXO3 documentation.
  • Configuration and Reliability  Non-volatile, multi-time programmable device architecture with TransFR reconfiguration, IEEE 1149.1 boundary-scan testability, and hot-socketing support as outlined in the family datasheet.
  • Power and Operating Range  Supply voltage range of 2.375 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
  • Package and Mounting  324-LFBGA (324-CABGA, 15×15) package; surface-mount mounting type for compact board-level integration.
  • Compliance  RoHS-compliant.

Typical Applications

  • System Glue Logic  Use the 4,320 logic elements and up to 279 I/O to consolidate interface logic and glue functions between processors, peripherals, and custom subsystems.
  • Peripheral Bridging and Protocol Conversion  Leverage hardened I²C and SPI IP cores and flexible I/O to implement bus bridging, protocol adaptation, and peripheral aggregation.
  • Buffered Interfaces and Data FIFO  Built-in sysMEM and FIFO configuration options make the device suitable for buffering, data alignment, and temporary storage in embedded interfaces.
  • Embedded Control and Timing  On-chip PLLs, oscillator, and timer/counter IP support local timing, clock management, and control tasks within systems.

Unique Advantages

  • Right-sized Logic Density:  4,320 logic elements provide a balance of capacity and cost for mid-range embedded designs without unnecessary overhead.
  • Integrated Memory and FIFO Modes:  Approximately 94 kbits of on-chip RAM with multiple memory modes reduces external RAM requirements for many buffering and state-storage tasks.
  • High I/O Count:  Up to 279 I/O pins handle complex interfacing needs, minimizing additional I/O expander components.
  • Embedded Hardened IP:  Built-in I²C, SPI, and timer/counter cores accelerate development by providing ready-made peripheral functions documented in the MachXO3 family datasheet.
  • Flexible Clocking and Configuration:  On-chip PLLs, oscillator, and non-volatile multi-time programmable configuration simplify system clock management and field updates.
  • Commercial-Grade Packaging:  Surface-mount 324-LFBGA (15×15) footprint supports dense board layouts and standard assembly processes.

Why Choose LCMXO3LF-4300C-6BG324C?

The LCMXO3LF-4300C-6BG324C offers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 324-LFBGA package for commercial embedded systems. Its MachXO3 family architecture provides non-volatile, multi-time programmable configuration, integrated peripheral IP, and flexible clocking options that help reduce external component count and simplify system design.

This device is well suited to engineers and procurement teams building mid-range control, interface, or buffering functions who need verified on-chip peripherals, versatile memory modes, and a defined operating and supply range supported by the MachXO3 family documentation.

Request a quote or contact sales to check availability, pricing, and lead times for the LCMXO3LF-4300C-6BG324C.

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