LCMXO3LF-4300C-6BG400I

The LCMXO3LF-4300C-6BG400I is a member of the MachXO3 family of non-volatile FPGAs. It couples flexible programmable logic with on-chip embedded memory and hardened peripheral IP to support system-level integration and configuration tasks.

With 4,320 logic elements, 335 I/O pins, and 94,208 bits of on-chip RAM, this industrial-grade, surface-mount device targets designs that require extensive I/O, moderate logic capacity, and extended temperature operation from -40 °C to 100 °C. The device supports a supply range of 2.375 V to 3.465 V and is supplied in a 400-LFBGA (17 × 17) package.

Key Features

• Core Logic — 4,320 logic elements for implementing glue logic, control functions and moderate-density custom logic.
• Embedded Memory — 94,208 total RAM bits available for on-chip buffering and small data structures.
• Rich I/O — 335 available I/O pins with pre-engineered source-synchronous I/O and flexible I/O buffering noted in the MachXO3 family documentation.
• Non-volatile Configuration — MachXO3 family supports non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities as documented in the datasheet.
• Hardened IP — Embedded hardened IP functions called out in the datasheet include I²C, SPI and timer/counter blocks, plus an on-chip oscillator and user flash memory (UFM).
• Clocking and Timing — Flexible on-chip clocking with sysCLOCK PLLs and clock distribution features described in the family data sheet.
• Package and Mounting — 400-LFBGA (17 × 17) surface-mount package suitable for compact board integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet industrial environment demands.
• Power and Supply — Recommended operating supply range from 2.375 V to 3.465 V.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating, high I/O count and programmable logic to implement control logic, sensor interfaces and deterministic sequencing in industrial equipment.
• Interface Bridging & Peripheral Aggregation — Leverage 335 I/Os and hardened I²C/SPI blocks to consolidate peripheral interfaces and bridge multiple buses in embedded systems.
• System Configuration & Management — Non-volatile, multi-time programmable configuration and TransFR reconfiguration enable the device to act as a configuration manager or system glue for firmware and board-level control.
• Embedded Logic and Buffering — Combine 4,320 logic elements with 94,208 bits of on-chip RAM for control logic, buffering and small embedded data structures within constrained board layouts.

Unique Advantages

• High I/O Density: 335 available I/Os provide extensive external connectivity without occupying multiple discrete interface devices.
• Integrated Peripheral IP: Hardened I²C, SPI and timer/counter blocks reduce the need for external controllers and simplify firmware development.
• Industrial Reliability: Industrial-grade temperature rating (-40 °C to 100 °C) supports deployment in harsh operating environments.
• Non-volatile, Reprogrammable: Multi-time programmable non-volatile configuration and TransFR reconfiguration provide in-field update capability and flexible system design iterations.
• Compact Packaging: 400-LFBGA (17 × 17) package enables dense board layouts while maintaining thermal and signal routing characteristics expected of a BGA package.
• Verified Family Features: MachXO3 family documentation details clocking, power-saving modes, hot-socketing behavior and boundary-scan support to aid system-level design and test.

Why Choose LCMXO3LF-4300C-6BG400I?

The LCMXO3LF-4300C-6BG400I positions itself as a compact, industrial-grade FPGA option within the MachXO3 family, delivering a balance of logic capacity, on-chip memory and extensive I/O for system integration tasks. Its non-volatile configuration, hardened peripheral blocks and documented family features give designers a clear implementation path for interface consolidation, configuration management and mid-density custom logic.

This part suits teams and designs that need a programmable, reconfigurable device with robust I/O, industrial temperature operation and a compact BGA footprint—providing a scalable, documented platform for embedded control and system-level integration.

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