LCMXO3LF-4300E-5MG256C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-VFBGA, CSPBGA |
|---|---|
| Quantity | 180 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CSFBGA (9x9) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-VFBGA, CSPBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3LF-4300E-5MG256C – MachXO3 FPGA, 4,320 Logic Elements, 206 I/Os
The LCMXO3LF-4300E-5MG256C is a MachXO3 field programmable gate array (FPGA) in a 256-ball VFBGA/CSPBGA package. It combines a flexible architecture with on-chip memory and a broad I/O count to support control, glue-logic and system integration functions in commercial electronic designs.
With 4,320 logic elements, approximately 94 Kbits of embedded RAM and 206 I/Os, this device targets applications that require reprogrammable logic, embedded peripherals and compact package options while operating from a 1.14–1.26 V supply over 0 °C to 85 °C.
Key Features
- Core Logic — 4,320 logic elements provide reprogrammable logic resources suitable for control and interface tasks.
- Embedded Memory — Approximately 94 Kbits (94,208 bits) of on-chip RAM for data buffering, small FIFOs and state storage.
- High I/O Count — 206 general-purpose I/Os to support multiple interfaces, sensors and external peripherals.
- Configurable Clocking — On-chip clocking architecture including PLLs and an on-chip oscillator referenced in the MachXO3 family documentation to support flexible timing topologies.
- Hardened System IP — Family-level embedded IP described in the datasheet includes hardened I²C and SPI cores as well as timer/counter blocks and user flash memory (UFM) for system functions.
- Non-volatile, Reprogrammable — MachXO3 family devices are described as non-volatile and multi-time programmable, enabling in-field updates and iterative development.
- Package Options — Supplied in a 256-VFBGA / CSPBGA package; supplier device package specified as 256-CSFBGA (9x9) for space-efficient board integration.
- Power and Environmental — Operates from a 1.14 V to 1.26 V supply and rated for commercial-grade temperatures of 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Board-level Glue Logic — Implement protocol adaptation, address decoding and bus bridging using the device’s logic elements and high I/O density.
- Sensor and Peripheral Aggregation — Aggregate and preprocess signals from multiple sensors or peripherals leveraging the large I/O count and embedded memory for buffering.
- User Interface Control — Drive and manage displays, buttons and LEDs while combining timers, SPI/I²C peripherals and programmable logic for responsive UI behavior.
- Embedded System Integration — Integrate custom interfaces and housekeeping functions to reduce BOM and centralize control in compact systems.
Unique Advantages
- Balanced Logic and Memory: 4,320 logic elements paired with ~94 Kbits of embedded RAM provide a practical balance for control-oriented designs without external memory.
- High I/O Connectivity: 206 I/Os allow consolidation of multiple interfaces and peripherals onto a single device, simplifying board routing and lowering component count.
- Non-volatile, Reprogrammable: Multi-time programmable, non-volatile architecture supports firmware updates and iterative feature development in the field.
- Hardened Peripheral IP: Built-in I²C, SPI and timer/counter blocks reduce the need to implement these functions in fabric, saving logic resources.
- Compact Packaging: 256-ball VFBGA/CSPBGA (256-CSFBGA 9x9) packaging enables designs with constrained board area to maintain a small footprint.
- Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for a wide range of indoor and controlled-environment applications.
Why Choose LCMXO3LF-4300E-5MG256C?
The LCMXO3LF-4300E-5MG256C positions itself as a practical, integrated FPGA solution for designers seeking to consolidate control, interface and peripheral logic into a single reprogrammable device. Its combination of 4,320 logic elements, substantial I/O capacity and on-chip memory supports flexible system architectures while simplifying board-level integration thanks to compact 256-ball BGA packaging.
This device is well suited to teams focused on rapid development cycles, in-field updates and systems where reducing BOM and board complexity matter. The family-level documentation highlights on-chip clocking, hardened IP and non-volatile configuration capabilities that contribute to long-term design scalability and maintainability.
Request a quote or submit a pricing inquiry to check availability, lead times and to discuss how the LCMXO3LF-4300E-5MG256C can fit into your next design.

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